component

MC33072ADR2G

Public Made by Adom

by adom

onsemi Operational Amplifier, SOIC-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs mc33072adr2g: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
viewers pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
mc33072adr2g-etched.fit.json mc33072adr2g: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
mc33072adr2g-etched.glb mc33072adr2g: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
mc33072adr2g-etched.step mc33072adr2g: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
mc33072adr2g.glb Publish 0.1.0 · Ray
mc33072adr2g.kicad_mod Publish 0.1.0 · Ray
mc33072adr2g.kicad_sym Publish 0.1.0 · Ray
mc33072adr2g.lbr rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect an… · Ray
mc33072adr2g.step Publish 0.1.0 · Ray
package.json Publish 0.2.0 · Ray
pads.json pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
page.json mc33072adr2g: specified limits as data (metadata.characteristics, 25 rows from the datasheet) · Ray
README.md mc33072adr2g: specified limits as data (metadata.characteristics, 25 rows from the datasheet) · Ray

MC33072ADR2G

onsemi · Operational Amplifier · SOIC-8

MC33072ADR2G from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Output 1 output Output of op-amp channel 1. Class-AB push-pull NPN output stage with no deadband crossover distortion, capable of driving up to 10,000 pF capacitive loads. Short-circuit current ~30 mA source/sink.
2 Input 1- input Inverting input of op-amp channel 1. High-impedance Darlington input; input bias current typ 100 nA (500 nA max). Differential input resistance ~150 MΩ.
3 Input 1+ input Non-inverting input of op-amp channel 1. Common-mode range extends from VEE to (VCC − 1.8 V), allowing single-supply operation with ground-sensing inputs.
4 VEE power_in Negative supply rail (or GND for single-supply operation). Total supply voltage VS = VCC − VEE up to +44 V. In single-supply mode connect to GND; in split-supply mode connect to negative rail (
5 Input 2+ input Non-inverting input of op-amp channel 2. Common-mode range extends from VEE to (VCC − 1.8 V).
6 Input 2- input Inverting input of op-amp channel 2. High-impedance Darlington input, IB typ 100 nA.
7 Output 2 output Output of op-amp channel 2. Class-AB push-pull NPN output stage with short-circuit protection (~30 mA source/sink).
8 VCC power_in Positive supply rail. Operating range 3.0 V to 44 V (single-supply) or up to ±22 V split. Supply current ~1.9 mA/amplifier at ±15 V (2.5 mA max).

Key specifications

Parameter Value
Manufacturer onsemi
Package SOIC-8
Category Op-amp/Cmp
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • MC33072ADR2G
  • MC33072ADR2GDG
  • MC33072ADR2GPG
  • MC33072ADR2GDTBG
  • MC33072ADR2GDTBR2G
  • MC33072ADR2GMTTBG

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Common Mode Rejection CMR 80 97 dB RS ≤ 10 k, VCM = VICR, TA = 25°C 3
Power Supply Rejection PSR 80 97 dB RS = 100, VCC/VEE = +16.5 V/−16.5 V to +13.5 V/−13.5 V, TA = 25°C 3
Large Signal Voltage Gain, TA = +25°C AVOL 50 100 V/mV VO = ±10 V, RL = 2.0 k, TA = +25°C 3
Large Signal Voltage Gain, TA = Tlow to Thigh AVOL 25 100 V/mV VO = ±10 V, RL = 2.0 k, TA = Tlow to Thigh (−40°C to +85°C for MC33072A) 3
Gain Bandwidth Product GBW 3.5 4.5 MHz f = 100 kHz 4
Slew Rate, AV = +1.0 SR 8 10 V/s Vin = −10 V to +10 V, RL = 2.0 k, CL = 500 pF, AV = +1.0 4
Output Voltage Swing High, VCC = +5.0 V VOH 3.7 4 V VCC = +5.0 V, VEE = 0 V, RL = 2.0 k, TA = +25°C 3
Output Voltage Swing High, VCC = +15 V VOH 13.6 14 V VCC = +15 V, VEE = −15 V, RL = 10 k, TA = +25°C 3
Output Voltage Swing High, Tlow to Thigh VOH 13.4 V VCC = +15 V, VEE = −15 V, RL = 2.0 k, TA = Tlow to Thigh 3
Output Voltage Swing Low, VCC = +5.0 V VOL 0.1 0.3 V VCC = +5.0 V, VEE = 0 V, RL = 2.0 k, TA = +25°C 3
Output Voltage Swing Low, VCC = +15 V VOL -14.7 -14.3 V VCC = +15 V, VEE = −15 V, RL = 10 k, TA = +25°C 3
Output Voltage Swing Low, Tlow to Thigh VOL -13.5 V VCC = +15 V, VEE = −15 V, RL = 2.0 k, TA = Tlow to Thigh 3
Input Offset Voltage, +15 V/−15 V, TA = +25°C VIO 3 mV RS = 100, VCM = 0 V, VO = 0 V, VCC = +15 V, VEE = −15 V, TA = +25°C 3
Input Offset Voltage, +5.0 V/0 V, TA = +25°C VIO 3 mV RS = 100, VCM = 0 V, VO = 0 V, VCC = +5.0 V, VEE = 0 V, TA = +25°C 3
Input Offset Voltage, Tlow to Thigh VIO 5 mV RS = 100, VCM = 0 V, VO = 0 V, VCC = +15 V, VEE = −15 V, TA = Tlow to Thigh 3
Power Supply Current, VCC = +5.0 V ID 1.6 1.9 mA Per amplifier, no load, VCC = +5.0 V, VEE = 0 V, VO = +2.5 V, TA = +25°C 3
Power Supply Current, VCC = +15 V ID 2 2.5 mA Per amplifier, no load, VCC = +15 V, VEE = −15 V, VO = 0 V, TA = +25°C 3
Power Supply Current, Tlow to Thigh ID 2.8 mA Per amplifier, no load, VCC = +15 V, VEE = −15 V, VO = 0 V, TA = Tlow to Thigh 3
Output Short Circuit Current, Source ISC 10 mA VID = 1.0 V, VO = 0 V, TA = 25°C 3
Output Short Circuit Current, Sink ISC 20 mA VID = 1.0 V, VO = 0 V, TA = 25°C 3
Supply Voltage (from VEE to VCC) VS 44 V From VEE to VCC 2
Operating Junction Temperature TJ 150 °C 2
Storage Temperature Range Tstg -60 150 °C 2
ESD Capability, Human Body Model ESDHBM 2000 V Dual and quad device, Human Body Model 2
ESD Capability, Machine Model ESDMM 200 V Dual and quad device, Machine Model 2

CAD (KiCad official)

  • Symbol: MC33072ADR2G
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: mc33072adr2g-etched.step / mc33072adr2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mc33072adr2g.step / mc33072adr2g.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
mc33072adr2g.step 122 KB You want the bare part, or you mark your own boards.
mc33072adr2g-etched.step 2.6 MB You want the part with MC33072ADR2G already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 638 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (25 pp, sha256 18c8188aa1e3131f, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF