component

MBRS360BT3G

Public Made by Adom

by adom

onsemi Schottky Barrier Diodes (SBD), SMB(DO-214AA). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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MBRS360BT3G

onsemi · Schottky Barrier Diodes (SBD) · SMB(DO-214AA)

MBRS360BT3G from onsemi, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMB(DO-214AA)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 60 V 2
Working Peak Reverse Voltage VRWM 60 V 2
DC Blocking Voltage VR 60 V 2
Average Rectified Forward Current IF(AV) 3 A TL = 137°C 2
Average Rectified Forward Current IF(AV) 4 A TL = 127°C 2
Nonrepetitive Peak Surge Current IFSM 125 A Surge at rated load, halfwave, single phase, 60 Hz 2
Operating Junction Temperature TJ -65 175 °C Note 1: dPD/dTJ < 1/RJA 2
Storage Temperature Range Tstg -65 175 °C 2
Maximum Instantaneous Forward Voltage VF 0.63 V iF = 3.0 A, TJ = 25°C 2
Maximum Instantaneous Reverse Current iR 0.03 mA Rated dc voltage, TJ = 25°C 2
Maximum Instantaneous Reverse Current iR 3 mA Rated dc voltage, TJ = 100°C 2
Thermal Resistance, Junction-to-Lead (SMB Package) RJL 15 °C/W Note 2: mounted with minimum recommended pad size, PC Board FR4 2
Thermal Resistance, Junction-to-Ambient (SMB Package) RJA 145 °C/W Note 2: mounted with minimum recommended pad size, PC Board FR4 2
Thermal Resistance, Junction-to-Ambient (SMB Package, 1 inch pad) RJA 73 °C/W Note 3: 1 inch square pad size (1 x 0.5 inch for each lead) on FR4; Note 4: typical value 2

CAD (KiCad official)

  • Symbol: MBRS360BT3G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: mbrs360bt3g-etched.step / mbrs360bt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbrs360bt3g.step / mbrs360bt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 1277619804cced23, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF