component

MBRS3200T3G

Public Made by Adom

by adom

onsemi Schottky Barrier Diodes (SBD), SMB(DO-214AA). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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MBRS3200T3G

onsemi · Schottky Barrier Diodes (SBD) · SMB(DO-214AA)

MBRS3200T3G from onsemi, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMB(DO-214AA)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 200 V 2
Working Peak Reverse Voltage VRWM 200 V 2
DC Blocking Voltage VR 200 V 2
Average Rectified Forward Current IF(AV) 3 A TL = 150 °C 2
Non-Repetitive Peak Surge Current IFSM 100 A Surge at rated load, halfwave, single phase, 60 Hz 2
Operating Junction Temperature TJ -65 175 °C 2
Maximum Instantaneous Forward Voltage VF 0.84 V IF = 3.0 A, TJ = 25 °C 2
Maximum Instantaneous Forward Voltage VF 0.86 V IF = 4.0 A, TJ = 25 °C 2
Maximum Instantaneous Forward Voltage VF 0.59 V IF = 3.0 A, TJ = 150 °C 2
Maximum Instantaneous Reverse Current IR 1 mA Rated DC voltage, TJ = 25 °C 2
Maximum Instantaneous Reverse Current IR 5 mA Rated DC voltage, TJ = 150 °C 2
Thermal Resistance, Junction-to-Lead RJL 13 °C/W Note 1: minimum pad size on FR4 board 2
Thermal Resistance, Junction-to-Ambient RJA 62 °C/W Note 2: 1 inch square pad size per lead on FR4 board 2

CAD (KiCad official)

  • Symbol: MBRS3200T3G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: mbrs3200t3g-etched.step / mbrs3200t3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbrs3200t3g.step / mbrs3200t3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (4 pp, sha256 984121c4b575aa37, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF