component

MBRS2H100T3G

Public Made by Adom

by adom

onsemi Schottky Diodes, SMB(DO-214AA). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

componentdiodesmbrs2h100t3gfactory-2.0.0extractor-text
Overview Files Discover Packages Releases Dependencies Issues Breadcrumbs Pull Requests Activity
main
mbrs2h100t3g / README.md
History Download
Ray Publish 0.1.0 ef53215 11d ago

MBRS2H100T3G

onsemi · Schottky Diodes · SMB(DO-214AA)

MBRS2H100T3G from onsemi, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMB(DO-214AA)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 100 V 2
Working Peak Reverse Voltage VRWM 100 V 2
DC Blocking Voltage VR 100 V 2
Average Rectified Forward Current IO 2 A TL = 150°C 2
Non-Repetitive Peak Surge Current IFSM 130 A Surge applied at rated load, halfwave, single phase, 60 Hz 2
Storage Temperature Range Tstg -65 175 °C 2
Operating Junction Temperature TJ -65 175 °C Note 1 2
Maximum Instantaneous Forward Voltage vF 0.79 V iF = 2.0 A; TJ = 25°C (Note 4) 2
Maximum Instantaneous Forward Voltage vF 0.65 V iF = 2.0 A; TJ = 125°C (Note 4) 2
Maximum Instantaneous Reverse Current IR 0.008 mA VR = 100 V; TJ = 25°C (Note 4) 2
Maximum Instantaneous Reverse Current IR 1.5 mA VR = 100 V; TJ = 125°C (Note 4) 2
Thermal Resistance, Junction-to-Lead (MBRS2H100T3G, NBRS2H100T3G) RJL 12 °C/W Note 2: 700 mm square copper pad, 1 oz FR4 board 2
Thermal Resistance, Junction-to-Ambient (MBRS2H100T3G, NBRS2H100T3G) RJA 71 °C/W Note 2: 700 mm square copper pad, 1 oz FR4 board 2
Thermal Resistance, Junction-to-Ambient (MBRS2H100T3G, NBRS2H100T3G) RJA 230 °C/W Note 3: minimum recommended pad, 1 oz FR4 board 2

CAD (KiCad official)

  • Symbol: MBRS2H100T3G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: mbrs2h100t3g-etched.step / mbrs2h100t3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbrs2h100t3g.step / mbrs2h100t3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 57bceb5a0fa46b16, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF