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MBRS260T3G

Public Made by Adom

by adom

onsemi Schottky Barrier Diodes (SBD), SMB(DO-214AA). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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PCB Footprint

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Datasheet

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Contents

README

markdown

MBRS260T3G

onsemi · Schottky Barrier Diodes (SBD) · SMB(DO-214AA)

MBRS260T3G from onsemi, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMB(DO-214AA)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 60 V 2
Working Peak Reverse Voltage VRWM 60 V 2
DC Blocking Voltage VR 60 V 2
Average Rectified Forward Current IO 2 A At rated VR, TL = 95°C 2
Non-Repetitive Peak Surge Current IFSM 60 A Halfwave, single phase, 60 Hz, at rated load 2
Storage Temperature Range Tstg -55 150 °C 2
Operating Junction Temperature TJ -55 125 °C 2
Voltage Rate of Change dv/dt 10000 V/s Rated VR, TJ = 25°C 2
Maximum Instantaneous Forward Voltage vF 0.51 V iF = 1.0 A, TJ = 25°C, pulse test 2
Maximum Instantaneous Forward Voltage vF 0.63 V iF = 2.0 A, TJ = 25°C, pulse test 2
Maximum Instantaneous Forward Voltage vF 0.475 V iF = 1.0 A, TJ = 125°C, pulse test 2
Maximum Instantaneous Forward Voltage vF 0.55 V iF = 2.0 A, TJ = 125°C, pulse test 2
Maximum Instantaneous Reverse Current IR 0.2 mA VR = 60 V, TJ = 25°C, pulse test 2
Maximum Instantaneous Reverse Current IR 20 mA VR = 60 V, TJ = 125°C, pulse test 2
Thermal Resistance, Junction-to-Lead RJL 24 °C/W Mounted with minimum recommended pad size, PC board FR4 (Note 1) 2
Thermal Resistance, Junction-to-Ambient RJA 80 °C/W 1 inch square pad on FR4 (Note 2) 2

CAD (KiCad official)

  • Symbol: MBRS260T3G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: mbrs260t3g-etched.step / mbrs260t3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbrs260t3g.step / mbrs260t3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (5 pp, sha256 de5e47e280290991, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF