component

MBRS230LT3G

Public Made by Adom

by adom

onsemi Schottky Barrier Diodes (SBD), SMB(DO-214AA). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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MBRS230LT3G

onsemi · Schottky Barrier Diodes (SBD) · SMB(DO-214AA)

MBRS230LT3G from onsemi, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMB(DO-214AA)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM, VRWM, VR 30 V 2
Average Rectified Forward Current IO 2 A At Rated VR, TC = 110°C 2
Peak Repetitive Forward Current IFRM 4 A At Rated VR, Square Wave, 20 kHz, TC = 105°C 2
Non-Repetitive Peak Surge Current IFSM 40 A Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz 2
Storage/Operating Case Temperature Tstg, TC -55 175 °C 2
Operating Junction Temperature TJ -55 125 °C 2
Voltage Rate of Change dv/dt 10000 V/µs Rated VR, TJ = 25°C 2
Maximum Instantaneous Forward Voltage VF 0.5 V IF = 2.0 A, TJ = 25°C 2
Maximum Instantaneous Forward Voltage VF 0.45 V IF = 2.0 A, TJ = 125°C 2
Maximum Instantaneous Forward Voltage VF 0.6 V IF = 4.0 A, TJ = 25°C 2
Maximum Instantaneous Forward Voltage VF 0.63 V IF = 4.0 A, TJ = 125°C 2
Maximum Instantaneous Reverse Current IR 1 mA VR = 30 V, TJ = 25°C 2
Maximum Instantaneous Reverse Current IR 75 mA VR = 30 V, TJ = 125°C 2
Maximum Instantaneous Reverse Current IR 0.31 mA VR = 15 V, TJ = 25°C 2
Maximum Instantaneous Reverse Current IR 35 mA VR = 15 V, TJ = 125°C 2
Thermal Resistance, Junction-to-Lead RθJL 18.6 °C/W Minimum pad size (0.108" X 0.085") for each lead on FR4 board 2
Thermal Resistance, Junction-to-Ambient RθJA 135 °C/W Minimum pad size (0.108" X 0.085") for each lead on FR4 board 2

CAD (KiCad official)

  • Symbol: MBRS230LT3G
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: mbrs230lt3g-etched.step / mbrs230lt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbrs230lt3g.step / mbrs230lt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (4 pp, sha256 9160b6b9c8653870, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF