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MBRF20150CTR

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SMC Sangdest Microelectronicstronic Nanjing Schottky Diodes, TO-220AB-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MBRF20150CTR

SMC Sangdest Microelectronicstronic Nanjing · Schottky Diodes · TO-220AB-3

MBRF20150CTR from SMC Sangdest Microelectronicstronic Nanjing, in a TO-220AB-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K1 passive Cathode of the first diode leg (common-anode pair), rated for 150 V VRRM/VR and 10 A average forward current per leg.
2 A passive Common anode of both Schottky diode legs, carrying up to 20 A average per device.
3 K2 passive Cathode of the second diode leg (common-anode pair), rated for 150 V VRRM/VR and 10 A average forward current per leg.

Key specifications

Parameter Value
Manufacturer SMC Sangdest Microelectronicstronic Nanjing
Package TO-220AB-3
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward Voltage Drop (Per Leg) VF1 0.84 0.9 V @ 10A, Pulse, TJ = 25 C 1
Forward Voltage Drop (Per Leg) VF2 0.75 0.8 V @ 10A, Pulse, TJ = 125 C 1
Reverse Current (Per Leg) IR1 0.001 1 mA @VR = rated VR, TJ = 25 C 1
Reverse Current (Per Leg) IR2 0.08 6 mA @VR = rated VR, TJ = 125 C 1
Junction Capacitance (Per Leg) CT 150 400 pF @VR = 5V, TC = 25 C, fSIG = 1MHz 1
Voltage Rate of Change dv/dt 10000 V/s 1
RMS Isolation Voltage, clip mounting, epoxy body away from heatsink edge VISO 4500 V t = 1.0 second, R.H. <= 30%, TA = 25 C; clip mounting, epoxy body away from heatsink edge by more than 0.110" along lead direction 1
RMS Isolation Voltage, clip mounting, epoxy body inside heatsink VISO 3500 V t = 1.0 second, R.H. <= 30%, TA = 25 C; clip mounting, epoxy body inside the heatsink 1
RMS Isolation Voltage, screw mounting, epoxy body inside heatsink VISO 1500 V t = 1.0 second, R.H. <= 30%, TA = 25 C; screw mounting, epoxy body inside the heatsink 1
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM 150 V 1
Average Rectified Forward Current (Per Leg) IF (AV) 10 A 50% duty cycle @Tc=100°C, rectangular wave form 1
Average Rectified Forward Current (Per Device) IF (AV) 20 A 50% duty cycle @Tc=100°C, rectangular wave form 1
Peak One Cycle Non-Repetitive Surge Current (Per Leg) IFSM 150 A 8.3ms, Half Sine pulse 1
Junction Temperature TJ -55 175 C 2
Storage Temperature Tstg -55 175 C 2
Series Inductance (Per Leg) LS 8 nH Measured lead to lead 5 mm from package body 1
Typical Thermal Resistance Junction to Case (Per Leg) RJC 3.5 C/W DC operation 2

CAD (KiCad official)

  • Symbol: MBRF20150CTR
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220AB-3 (KiCad packages3D, STEP)
  • 3D model files: mbrf20150ctr-etched.step / mbrf20150ctr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbrf20150ctr.step / mbrf20150ctr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SMC Sangdest Microelectronicstronic Nanjing datasheet (4 pp, sha256 c711af40ebe303d0, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF