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MBRF10100CTP

SMC(Sangdest Microelectronicstronic (Nanjing)) · Schottky Barrier Diodes (SBD) · ITO-220AB-3

MBRF10100CTP from SMC(Sangdest Microelectronicstronic (Nanjing)), in a ITO-220AB-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of the first Schottky diode leg, rated 5 A average forward current per leg and 100 V maximum reverse voltage.
2 CATHODE passive Common cathode center tap of both Schottky legs, 10 A average forward current per device.
3 A2 passive Anode of the second Schottky diode leg, rated 5 A average forward current per leg and 100 V maximum reverse voltage.

Key specifications

Parameter Value
Manufacturer SMC(Sangdest Microelectronicstronic (Nanjing))
Package ITO-220AB-3
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward Voltage Drop (Per Leg) 25C VF1 0.79 0.85 V @5A, Pulse, TJ = 25 C 1
Forward Voltage Drop (Per Leg) 125C VF2 0.69 0.75 V @5A, Pulse, TJ = 125 C 1
Reverse Current 25C IR1 0.01 1 mA @VR = rated VR, TJ = 25 C 1
Reverse Current 125C IR2 0.2 15 mA @VR = rated VR, TJ = 125 C 1
Junction Capacitance (Per Leg) CT 130 300 pF @VR = 5V, TC = 25 C, fSIG = 1MHz 1
Series Inductance (Per Leg) LS 8 nH Measured lead to lead 5 mm from package body 1
Voltage Rate of Change dv/dt 10000 V/µs 1
Isolation Voltage, clip mounting, body away from heatsink edge >0.110" VISO 4500 V t = 1.0 second, R.H. <=30%, TA = 25 C; Clip mounting, epoxy body away from heatsink edge by more than 0.110" along lead direction 1
Isolation Voltage, clip mounting, body inside heatsink VISO 3500 V t = 1.0 second, R.H. <=30%, TA = 25 C; Clip mounting, epoxy body is inside the heatsink 1
Isolation Voltage, screw mounting, body inside heatsink VISO 1500 V t = 1.0 second, R.H. <=30%, TA = 25 C; Screw mounting, epoxy body is inside the heatsink 1
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM VRWM VR 100 V 1
Average Rectified Forward Current (Per Leg) IF(AV) 5 A 50% duty cycle @Tc=105°C, rectangular wave form 1
Average Rectified Forward Current (Per Device) IF(AV) 10 A 50% duty cycle @Tc=105°C, rectangular wave form 1
Peak One Cycle Non-Repetitive Surge Current (Per Leg) IFSM 120 A 8.3ms, Half Sine pulse 1
Junction Temperature TJ -55 150 C 2
Storage Temperature Tstg -55 150 C 2
Typical Thermal Resistance Junction to Case (Per Leg) RθJC 4.5 C/W DC operation 2

CAD (KiCad official)

  • Symbol: MBRF10100CTP
  • Footprint: Package_TO_SOT_THT:TO-220F-3_Vertical
  • 3D model: ITO-220AB-3 (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SMC(Sangdest Microelectronicstronic (Nanjing)) datasheet (4 pp, sha256 3e6eb858acc5c862, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF