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MBRD20200CT

SMC Sangdest Microelectronicstronic Nanjing · Schottky Diodes · TO-252-2(DPAK)

MBRD20200CT from SMC Sangdest Microelectronicstronic Nanjing, in a TO-252-2(DPAK). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of the first Schottky diode leg (10 A average per leg, 200 V VRRM, 10 A forward current per leg at 105°C case).
2 K passive Common cathode (center tap) of both diodes, also connected to the base/tab, rated 200 V reverse voltage and 20 A per device.
3 A2 passive Anode of the second Schottky diode leg (10 A average per leg, 200 V VRRM, 10 A forward current per leg at 105°C case).

Key specifications

Parameter Value
Manufacturer SMC Sangdest Microelectronicstronic Nanjing
Package TO-252-2(DPAK)
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM VRWM VR 200 V 1
Average Rectified Forward Current (per leg) IF (AV) 10 A 50% duty cycle @TC =105°C, rectangular wave form 1
Average Rectified Forward Current (per device) IF (AV) 20 A 50% duty cycle @TC =105°C, rectangular wave form 1
Peak One Cycle Non-Repetitive Surge Current (per leg) IFSM 120 A 8.3 ms, half Sine pulse 1
Forward Voltage Drop (per leg) VF1 0.9 1 V @ 10A, Pulse, TJ = 25 C 1
Forward Voltage Drop (per leg) VF2 0.8 0.9 V @ 10A, Pulse, TJ = 125 C 1
Reverse Current (per leg) IR1 0.0002 1 mA @VR = rated VR, TJ = 25 C 1
Reverse Current (per leg) IR2 0.02 10 mA @VR = rated VR, TJ = 125 C 1
Junction Capacitance (per leg) CT 100 150 pF @VR = 5V, TC = 25 C, fSIG = 1MHz 1
Voltage Rate of Change dv/dt 10000 V/s 1
Junction Temperature TJ -55 150 C 2
Storage Temperature Tstg -55 150 C 2
Typical Thermal Resistance Junction to Case RJC 3.5 C/W 2

CAD (KiCad official)

  • Symbol: MBRD20200CT
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2(DPAK) (KiCad packages3D, STEP)
  • 3D model files: mbrd20200ct-etched.step / mbrd20200ct-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbrd20200ct.step / mbrd20200ct.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SMC Sangdest Microelectronicstronic Nanjing datasheet (4 pp, sha256 94e9fa6f4147270b, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF