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Contents

README

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MBRD10100CTTR

SMC Sangdest Microelectronicstronic Nanjing · Schottky Diodes · TO-252-2(DPAK)

MBRD10100CTTR from SMC Sangdest Microelectronicstronic Nanjing, in a TO-252-2(DPAK). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of the first Schottky diode leg, rated 5 A average forward current per leg and 100 V maximum reverse voltage.
2 CATHODE passive Common cathode (center tap) of both diode legs, also connected to the base/tab, with 10 A average forward current per device and 100 V VRRM.
3 A2 passive Anode of the second Schottky diode leg, rated 5 A average forward current per leg and 100 V maximum reverse voltage.

Key specifications

Parameter Value
Manufacturer SMC Sangdest Microelectronicstronic Nanjing
Package TO-252-2(DPAK)
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 100 V 1
Working Peak Reverse Voltage VRWM 100 V 1
DC Blocking Voltage VR 100 V 1
Average Rectified Forward Current (peg leg) IF(AV) 5 A 50% duty cycle @TC = 131°C, rectangular wave form 1
Average Rectified Forward Current (peg device) IF(AV) 10 A 50% duty cycle @TC = 131°C, rectangular wave form 1
Peak One Cycle Non-Repetitive Surge Current (peg leg) IFSM 84 A 8.3 ms, half Sine pulse 1
Forward Voltage Drop (per leg) VF1 0.83 0.85 V @ 5A, Pulse, TJ = 25 C 1
Forward Voltage Drop (per leg) VF2 0.71 0.75 V @ 5A, Pulse, TJ = 125 C 1
Reverse Current (per leg) IR1 0.0006 1 mA @VR = rated VR, TJ = 25 C 1
Reverse Current (per leg) IR2 0.8 15 mA @VR = rated VR, TJ = 125 C 1
Junction Capacitance (per leg) CT 120 300 pF @VR = 5V, TC = 25 C, fSIG = 1MHz 1
Series Inductance (per leg) LS 8 8 nH Measured lead to lead 5 mm from package body 1
Voltage Rate of Change dv/dt 10000 V/s 1
Junction Temperature TJ -55 200 C 2
Storage Temperature Tstg -55 200 C 2
Typical Thermal Resistance Junction to Case RJC 6 C/W 2

CAD (KiCad official)

  • Symbol: MBRD10100CTTR
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2(DPAK) (KiCad packages3D, STEP)
  • 3D model files: mbrd10100cttr-etched.step / mbrd10100cttr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbrd10100cttr.step / mbrd10100cttr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SMC Sangdest Microelectronicstronic Nanjing datasheet (4 pp, sha256 ab10f5423e9ad3fe, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF