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MBR2H200SFT1G

Public Made by Adom

by adom

onsemi Schottky Diodes, SOD-123. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MBR2H200SFT1G

onsemi · Schottky Diodes · SOD-123

MBR2H200SFT1G from onsemi, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode, marked by the cathode band on the package (the polarity indicator sits next to pin 1 in the top view); device is rated 200 V VRRM/VR and 2.0 A average forward current.
2 A passive Anode, the terminal opposite the cathode band; forward voltage is 0.94 V maximum at IF = 2.0 A, TJ = 25°C.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOD-123
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 200 V 2
Working Peak Reverse Voltage VRWM 200 V 2
DC Blocking Voltage VR 200 V 2
Average Rectified Forward Current IO 2 A TL = 108°C 2
Peak Repetitive Forward Current IFRM 4 A Rated VR, square wave, 20 kHz, TC = 105°C 2
Non-Repetitive Peak Surge Current IFSM 30 A Surge applied at rated load conditions, halfwave, single phase, 60 Hz 2
Storage and Operating Junction Temperature Range Tstg, TJ -55 150 °C 2
Maximum Instantaneous Forward Voltage VF 0.86 V IF = 1.0 A, TJ = 25°C (Note 4) 2
Maximum Instantaneous Forward Voltage VF 0.94 V IF = 2.0 A, TJ = 25°C (Note 4) 2
Maximum Instantaneous Forward Voltage VF 0.71 V IF = 1.0 A, TJ = 125°C (Note 4) 2
Maximum Instantaneous Forward Voltage VF 0.78 V IF = 2.0 A, TJ = 125°C (Note 4) 2
Maximum Instantaneous Reverse Current IR 200 µA Rated dc voltage, TJ = 25°C (Note 4) 2
Maximum Instantaneous Reverse Current IR 2 mA Rated dc voltage, TJ = 125°C (Note 4) 2
Thermal Resistance, Junction-to-Lead JCL 23 °C/W Note 2: mounted with 700 mm2 copper pad (approx. 1 in2), 1 oz FR4 board 2
Thermal Resistance, Junction-to-Ambient RJA 85 °C/W Note 2: mounted with 700 mm2 copper pad (approx. 1 in2), 1 oz FR4 board 2
Thermal Resistance, Junction-to-Ambient RJA 330 °C/W Note 3: mounted with pad size approx. 20 mm2 copper, 1 oz FR4 board 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Lead Finish: 100% Matte Sn (Tin) • Lead and Mounting Surface Temperature for Soldering Purposes: 1

CAD (KiCad official)

  • Symbol: MBR2H200SFT1G
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123 (KiCad packages3D, STEP)
  • 3D model files: mbr2h200sft1g-etched.step / mbr2h200sft1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbr2h200sft1g.step / mbr2h200sft1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (5 pp, sha256 39b7a1ffc24aa377, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF