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Contents

README

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MBR2060LCT

LGE · Schottky Diodes · TO-220

MBR2060LCT from LGE, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of diode 1 (10 A per diode, 60 V VRRM); the TO-220AB drawing shows only pin number 1, so the function is taken from the 1-K-2 marking on the TO-263/TO-252 drawings.
2 K passive Common cathode of both diodes (center pin, 60 V VRRM, 20 A per device); the function is taken from the K marking on the TO-263/TO-252 drawings and from the CT suffix.
3 A2 passive Anode of diode 2 (10 A per diode, 60 V VRRM); the TO-220AB drawing shows only pin number 3, so the function is taken from the 1-K-2 marking on the TO-263/TO-252 drawings.

Key specifications

Parameter Value
Manufacturer LGE
Package TO-220
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Breakdown voltage per diode (min) VBR 100 V IR=0.5mA 2
Instantaneous forward voltage VF 0.58 0.62 V IF=10A, TA=25℃ 2
Instantaneous forward voltage VF 0.55 0.61 V IF=10A, TA=100℃ 2
Instantaneous forward voltage VF 0.54 0.6 V IF=10A, TA=125℃ 2
Maximum DC reverse current IR 10 50 μA @Rated DC Blocking Voltage, TA=25℃ 2
Maximum DC reverse current IR 20000 μA @Rated DC Blocking Voltage, TA=125℃ 2
Maximum repetitive peak reverse voltage VRRM 60 V 1
Maximum RMS voltage VRWS 42 V 1
Maximum DC blocking voltage VDC 60 V 1
Maximum average forward rectified current, per device IF(AV) 20 A Per device 1
Maximum average forward rectified current, per diode IF(AV) 10 A Per diode 1
Peak forward surge current IFSM 200 A 8.3ms half-sine-wave 1
I2t rating for fusing I2t 166 A2s t<8.3ms 1
Junction temperature TJ 150 ℃ 1
Storage temperature range TSTG -55 150 ℃ 1
Typical thermal resistance, junction to ambient (TO-220AB) RΘJA 11.4 ℃/W TO-220AB 1
Typical thermal resistance, junction to case (TO-220AB) RΘJC 2.7 ℃/W TO-220AB 1
Typical thermal resistance, junction to lead (TO-220AB) RΘJL 3 ℃/W TO-220AB 1
Typical junction capacitance CJ 680 pF VR=4.0v, f=1MHz 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin ◇ Terminals:Matte Tin Finish. Solderable per MIL-STD-202 Method 208 1

CAD (KiCad official)

  • Symbol: MBR2060LCT
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220 (KiCad packages3D, STEP)
  • 3D model files: mbr2060lct-etched.step / mbr2060lct-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbr2060lct.step / mbr2060lct.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LGE datasheet (4 pp, sha256 16dd9e3425b64c0c, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF