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MBR2060CTP

SMC Sangdest Microelectronicstronic Nanjing · Schottky Diodes · TO-220AB-3

MBR2060CTP from SMC Sangdest Microelectronicstronic Nanjing, in a TO-220AB-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A1 passive Anode of the first diode leg; each leg is rated 10 A average forward current and 60 V reverse voltage.
2 CATHODE passive Common cathode (center tap) of both diode legs, also connected to the base/tab; 20 A average per device and 60 V VRRM.
3 A2 passive Anode of the second diode leg; each leg is rated 10 A average forward current and 60 V reverse voltage.

Key specifications

Parameter Value
Manufacturer SMC Sangdest Microelectronicstronic Nanjing
Package TO-220AB-3
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM, VRWM, VR 60 V 1
Average Rectified Forward Current (per leg) IF (AV) 10 A 50% duty cycle @Tc=80°C, rectangular wave form, per leg 1
Average Rectified Forward Current (per device) IF (AV) 20 A 50% duty cycle @Tc=80°C, rectangular wave form, per device 1
Peak One Cycle Non-Repetitive Surge Current (per leg) IFSM 150 A 8.3ms, Half Sine pulse, TC = 25 C 1
Forward Voltage Drop (per leg) VF1 0.67 0.8 V @ 10A, Pulse, TJ = 25 C 1
Forward Voltage Drop (per leg) VF2 0.62 0.75 V @ 10A, Pulse, TJ = 125 C 1
Reverse Current (per leg) IR1 0.008 1 mA @VR = rated VR, TJ = 25 C 1
Reverse Current (per leg) IR2 3 40 mA @VR = rated VR, TJ = 125 C 1
Junction Capacitance (per leg) CT 270 400 pF @VR = 5V, TC = 25 C, fSIG = 1MHz 1
Series Inductance (per leg) LS 8 nH Measured lead to lead 5 mm from package body 1
Voltage Rate of Change dv/dt 10000 V/s 1
Junction Temperature TJ -55 150 C 2
Storage Temperature Tstg -55 150 C 2
Typical Thermal Resistance Junction to Case RJC 2.3 C/W DC operation 2

CAD (KiCad official)

  • Symbol: MBR2060CTP
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220AB-3 (KiCad packages3D, STEP)
  • 3D model files: mbr2060ctp-etched.step / mbr2060ctp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbr2060ctp.step / mbr2060ctp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SMC Sangdest Microelectronicstronic Nanjing datasheet (4 pp, sha256 40e9d5b4513c1202, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF