# MBR20100DY

**Shandong Jingdao Microelectronics** · Schottky Diodes · TO-252

MBR20100DY from Shandong Jingdao Microelectronics, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A1 | passive | Anode input of the Schottky rectifier, shown tied with PIN3 to the diode anode in the page 1 symbol; part rated 100 V VRRM and 20 A average forward current. |
| 2 | K | passive | Cathode of the Schottky rectifier, also the exposed tab (PIN2 is labelled on both the tab and the centre lead); 100 V maximum DC blocking voltage. |
| 3 | A2 | passive | Anode input of the Schottky rectifier, shown tied with PIN1 to the diode anode in the page 1 symbol; part rated 100 V VRRM and 20 A average forward current. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shandong Jingdao Microelectronics |
| Package | TO-252 |
| Category | Diodes |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Recurrent Peak Reverse Voltage | VRRM |  |  | 100 | V |  | 1 |
| Maximum RMS Voltage | VRMS |  |  | 70 | V |  | 1 |
| Maximum DC Blocking Voltage | VDC |  |  | 100 | V |  | 1 |
| Maximum Average Forward Rectified Current | IF(AV) |  |  | 20 | A |  | 1 |
| Peak Forward Surge Current | IFSM |  |  | 150 | A | 8.3 ms single half sine-wave superimposed on rated load (JEDEC method), per diode | 1 |
| Max Instantaneous Forward Voltage | VF |  |  | 0.95 | V | IF=20 A | 1 |
| Maximum DC Reverse Current at rated DC reverse voltage | IR |  |  | 0.05 | mA | TJ = 25°C | 1 |
| Maximum DC Reverse Current at rated DC reverse voltage | IR |  |  | 10 | mA | TJ = 100°C | 1 |
| Operating Junction Temperature Range | Tj | -55 |  | 150 | °C |  | 1 |
| Storage Temperature Range | Tstg | -55 |  | 150 | °C |  | 1 |
| Typical Thermal Resistance, junction to case | RθJC |  | 2 |  | °C/W | P.C.B. mounted with 10cmX10cmX1mm copper pad areas | 1 |
| Typical Thermal Resistance, junction to ambient | RθJA |  | 50 |  | °C/W | P.C.B. mounted with 10cmX10cmX1mm copper pad areas | 1 |

## CAD (KiCad official)

- Symbol: `MBR20100DY`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files: `mbr20100dy-etched.step` / `mbr20100dy-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `mbr20100dy.step` / `mbr20100dy.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shandong Jingdao Microelectronics datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603145217533370368) (4 pp, sha256 `5e919247229d12bf`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/mbr20100dy-datasheet.pdf)