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MBR1H100SFT3G

onsemi · Schottky Barrier Diodes (SBD) · SOD-123FL

MBR1H100SFT3G from onsemi, in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOD-123FL
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM, VRWM, VR 100 V 3
Average Rectified Forward Current IO 1 A TL = 162°C 3
Non-Repetitive Peak Surge Current IFSM 50 A Surge applied at rated load conditions, halfwave, single phase, 60 Hz 3
Storage and Operating Junction Temperature Range Tstg, TJ -65 175 °C 3
Maximum Instantaneous Forward Voltage VF 0.76 V IF = 1.0 A, TJ = 25°C 3
Maximum Instantaneous Forward Voltage VF 0.84 V IF = 2.0 A, TJ = 25°C 3
Maximum Instantaneous Forward Voltage VF 0.61 V IF = 1.0 A, TJ = 125°C 3
Maximum Instantaneous Forward Voltage VF 0.68 V IF = 2.0 A, TJ = 125°C 3
Maximum Instantaneous Reverse Current IR 40 A Rated dc voltage, TJ = 25°C 3
Maximum Instantaneous Reverse Current IR 0.5 mA Rated dc voltage, TJ = 125°C 3
Thermal Resistance, Junction-to-Lead RJL 23 °C/W Note 2: mounted with 700 mm2 copper pad, 1 oz FR4 board 3
Thermal Resistance, Junction-to-Ambient RJA 85 °C/W Note 2: mounted with 700 mm2 copper pad, 1 oz FR4 board 3
Thermal Resistance, Junction-to-Ambient RJA 330 °C/W Note 3: mounted with pad approx. 20 mm2 copper, 1 oz FR4 board 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Lead Finish: 100% Matte Sn (Tin) • Lead and Mounting Surface Temperature for Soldering Purposes: 2

CAD (KiCad official)

  • Symbol: MBR1H100SFT3G
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123FL (KiCad packages3D, STEP)
  • 3D model files: mbr1h100sft3g-etched.step / mbr1h100sft3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbr1h100sft3g.step / mbr1h100sft3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 5ef46b537233ed53, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF