component

MBR140ESFT1G

Public Made by Adom

by adom

onsemi Schottky Diodes, SOD-123. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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MBR140ESFT1G

onsemi · Schottky Diodes · SOD-123

MBR140ESFT1G from onsemi, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOD-123
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Repetitive Reverse Voltage VRRM 40 V 2
Working Peak Reverse Voltage VRWM 40 V 2
DC Blocking Voltage VR 40 V 2
Average Rectified Forward Current IO 1 A 2
Peak Repetitive Forward Current IFRM 2 A 2
Non-Repetitive Peak Surge Current IFSM 30 A Non-repetitive peak surge current, halfwave, single phase, 60 Hz 2
Storage Temperature Tstg -55 175 °C 2
Operating Junction Temperature TJ -55 175 °C 2
Maximum Instantaneous Forward Voltage VF 0.56 V TJ = 25°C; IF = 1.0 A; pulse test (Note 3) 2
Maximum Instantaneous Reverse Current IR 30 A TJ = 25°C; VR = 40 V; pulse test (Note 3) 2
Thermal Resistance, Junction-to-Lead Rtjl 26 °C/W Mounted with minimum recommended pad size, PC Board FR4 (Note 1) 2
Thermal Resistance, Junction-to-Lead Rtjl 21 °C/W Mounted with 1 in. copper pad (Cu area 700 mm2) (Note 2) 2
Thermal Resistance, Junction-to-Ambient Rtja 325 °C/W Mounted with minimum recommended pad size, PC Board FR4 (Note 1) 2
Thermal Resistance, Junction-to-Ambient Rtja 82 °C/W Mounted with 1 in. copper pad (Cu area 700 mm2) (Note 2) 2

CAD (KiCad official)

  • Symbol: MBR140ESFT1G
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123 (KiCad packages3D, STEP)
  • 3D model files: mbr140esft1g-etched.step / mbr140esft1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbr140esft1g.step / mbr140esft1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (6 pp, sha256 4a68c1070ec43825, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF