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MBR120ESFT3G

onsemi · Schottky Diodes · SOD-123FL

MBR120ESFT3G from onsemi, in a SOD-123FL. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOD-123FL
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Instantaneous Forward Voltage VF 0.455 V TJ = 25°C, IF = 0.1 A 3
Maximum Instantaneous Forward Voltage VF 0.53 V TJ = 25°C, IF = 1.0 A 3
Maximum Instantaneous Forward Voltage VF 0.595 V TJ = 25°C, IF = 2.0 A 3
Maximum Instantaneous Forward Voltage VF 0.36 V TJ = 100°C, IF = 0.1 A 3
Maximum Instantaneous Forward Voltage VF 0.54 V TJ = 100°C, IF = 2.0 A 3
Maximum Instantaneous Reverse Current IR 10 A TJ = 25°C, VR = 20 V 3
Maximum Instantaneous Reverse Current IR 1 A TJ = 25°C, VR = 10 V 3
Maximum Instantaneous Reverse Current IR 0.5 A TJ = 25°C, VR = 5.0 V 3
Maximum Instantaneous Reverse Current IR 1600 A TJ = 100°C, VR = 20 V 3
Maximum Instantaneous Reverse Current IR 500 A TJ = 100°C, VR = 10 V 3
Maximum Instantaneous Reverse Current IR 300 A TJ = 100°C, VR = 5.0 V 3
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM / VRWM / VR 20 V 3
Average Rectified Forward Current IO 1 A At Rated VR, TL = 140°C 3
Peak Repetitive Forward Current IFRM 2 A At Rated VR, Square Wave, 20 kHz, TL = 125°C 3
Non-Repetitive Peak Surge Current IFSM 40 A Non-Repetitive peak surge current, halfwave, single phase, 60 Hz 3
Storage Temperature Tstg -65 150 °C 3
Operating Junction Temperature TJ -65 150 °C 3
Voltage Rate of Change dv/dt 10000 V/s Rated VR, TJ = 25°C 3
Thermal Resistance - Junction-to-Lead Rtjl 26 °C/W Note 1: mounted with minimum recommended pad size, PC Board FR4 3
Thermal Resistance - Junction-to-Lead Rtjl 21 °C/W Note 2: mounted with 1 in. copper pad (Cu area 700 mm2) 3
Thermal Resistance - Junction-to-Ambient Rtja 325 °C/W Note 1: mounted with minimum recommended pad size, PC Board FR4 3
Thermal Resistance - Junction-to-Ambient Rtja 82 °C/W Note 2: mounted with 1 in. copper pad (Cu area 700 mm2) 3

CAD (KiCad official)

  • Symbol: MBR120ESFT3G
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123FL (KiCad packages3D, STEP)
  • 3D model files: mbr120esft3g-etched.step / mbr120esft3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); mbr120esft3g.step / mbr120esft3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 d97adac489d4515d, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF