component

MBR1100RLG

Public Made by Adom

by adom

onsemi Schottky Barrier Diodes (SBD), DO-41. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MBR1100RLG

onsemi · Schottky Barrier Diodes (SBD) · DO-41

MBR1100RLG from onsemi, in a DO-41. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CATHODE passive Cathode, marked by the polarity band on the axial-lead DO-41 package (Style 1); the diode is rated for 100 V VRRM/VR and 1.0 A average forward current.
2 ANODE passive Anode terminal of the Schottky barrier rectifier (Style 1), the lead opposite the polarity band.

Key specifications

Parameter Value
Manufacturer onsemi
Package DO-41
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Instantaneous Forward Voltage VF 0.79 V iF = 1 A, TL = 25°C 2
Maximum Instantaneous Forward Voltage VF 0.69 V iF = 1 A, TL = 100°C 2
Maximum Instantaneous Reverse Current iR 0.5 mA Rated dc voltage, TL = 25°C 2
Maximum Instantaneous Reverse Current iR 5 mA Rated dc voltage, TL = 100°C 2
Peak Repetitive Reverse Voltage / Working Peak Reverse Voltage / DC Blocking Voltage VRRM, VRWM, VR 100 V 1
Average Rectified Forward Current IO 1 A VR(equiv) ≤ 0.2 VR(dc), RθJA = 50°C/W, P.C. Board Mounting, TA = 120°C 1
Peak Repetitive Forward Current IFRM 2 A VR(equiv) ≤ 0.2 VR(dc), RθJA = 50°C/W, P.C. Board Mounting, TA = 110°C 1
Non-Repetitive Peak Surge Current IFSM 50 A Surge applied at rated load conditions, halfwave, single phase, 60 Hz 1
Operating and Storage Junction Temperature Range TJ, Tstg -65 175 °C 1
Voltage Rate of Change dv/dt 10 V/ns Rated VR 1
Lead Temperature for Soldering 260 °C 10 seconds max 1
Thermal Resistance, Junction-to-Ambient RθJA 50 °C/W Mounting Method 3, P.C. Board 1-1/2" x 1-1/2" copper, still air 3
Thermal Resistance, Junction-to-Case RθJ 36 46 °C/W Thermal circuit model, Note 4 3
Thermal Resistance, Lead to Heat Sink RθL 100 120 °C/W/in Thermal circuit model, Note 4 3

CAD (KiCad official)

  • Symbol: MBR1100RLG
  • Footprint: Diode_THT:D_DO-41_SOD81_P10.16mm_Horizontal
  • 3D model: DO-41 (KiCad packages3D, STEP)

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (4 pp, sha256 1a45e1da200aca49, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF