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MAX9744ETH+T

MAX · Amplifiers · TQFN-44(7x7)

MAX9744ETH+T from MAX, in a TQFN-44(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 BOOTL+ passive Left-channel positive speaker output boost flying-capacitor connection; connect a 0.1µF ceramic capacitor between BOOTL+ and OUTL+.
2 OUTL+ output Left-channel speaker output, positive phase.
3 OUTL+ output Left-channel speaker output, positive phase.
4 PVDD power_in Speaker amplifier power-supply input, 4.5V to 14V; bypass each with a 1µF capacitor to PGND.
5 PVDD power_in Speaker amplifier power-supply input, 4.5V to 14V; bypass each with a 1µF capacitor to PGND.
6 VDD power_in Power-supply input for the remainder of the device, 2.7V to 3.6V; bypass each with a 1µF capacitor to GND.
7 GND power_in Ground.
8 SDA/VOL bidirectional I2C serial data I/O and analog volume control input.
9 SCLK/PWM input In I2C mode acts as serial clock input; when ADDR1 and ADDR2 = GND, SCLK = 1 selects standard PWM and SCLK = 0 selects filterless modulation.
10 VDD power_in Power-supply input for the remainder of the device, 2.7V to 3.6V; bypass each with a 1µF capacitor to GND.
11 GND power_in Ground.
12 GND power_in Ground.
13 ADDR1 input Address select input 1 sets the I2C device address; connect ADDR1 and ADDR2 to GND to select analog volume control mode.
14 ADDR2 input Address select input 2 sets the I2C device address; connect ADDR1 and ADDR2 to GND to select analog volume control mode.
15 GND power_in Ground.
16 INL input Left-channel audio input.
17 FBL output Left-channel feedback; connect feedback resistor between FBL and INL to set amplifier gain.
18 FBR output Right-channel feedback; connect feedback resistor between FBR and INR to set amplifier gain.
19 INR input Right-channel audio input.
20 BIAS passive Common-mode bias voltage (1.5V typical); bypass with a 2.2µF capacitor to GND.
21 VDD power_in Power-supply input for the remainder of the device, 2.7V to 3.6V; bypass each with a 1µF capacitor to GND.
22 SHDN input Shutdown input; drive low to disable the audio amplifiers, and connect to VDD or drive high for normal operation.
23 N.C. unconnected No connection; not internally connected.
24 MUTE input Mute input; drive high to mute the speaker outputs, and connect to GND for normal operation.
25 SYNC input Frequency select and external clock input: GND selects 1200kHz fixed-frequency, unconnected selects 1440kHz, VDD selects spread-spectrum 1200kHz ±30kHz, and a clock of 1000kHz to 1600kHz synchronizes the device with fSW = 1/4 fSYNC.
26 SYNCOUT output SYNC signal output for cascading devices.
27 GND power_in Ground.
28 VDD power_in Power-supply input for the remainder of the device, 2.7V to 3.6V; bypass each with a 1µF capacitor to GND.
29 PVDD power_in Speaker amplifier power-supply input, 4.5V to 14V; bypass each with a 1µF capacitor to PGND.
30 PVDD power_in Speaker amplifier power-supply input, 4.5V to 14V; bypass each with a 1µF capacitor to PGND.
31 OUTR+ output Right-channel positive speaker output.
32 OUTR+ output Right-channel positive speaker output.
33 BOOTR+ passive Right-channel positive speaker output boost flying-capacitor connection; connect a 0.1µF ceramic capacitor between BOOTR+ and OUTR+.
34 PGND power_in Power ground.
35 PGND power_in Power ground.
36 OUTR- output Right-channel negative speaker output.
37 OUTR- output Right-channel negative speaker output.
38 BOOTR- passive Right-channel negative speaker output boost flying-capacitor connection; connect a 0.1µF ceramic capacitor between BOOTR- and OUTR-.
39 PGND power_in Power ground.
40 BOOTL- passive Left-channel negative speaker output boost flying-capacitor connection; connect a 0.1µF ceramic capacitor between BOOTL- and OUTL-.
41 OUTL- output Left-channel negative speaker output.
42 OUTL- output Left-channel negative speaker output.
43 PGND power_in Power ground.
44 PGND power_in Power ground.
45 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer MAX
Package TQFN-44(7x7)
Category Amplifiers
Pins 45

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Speaker Amplifier Supply Voltage Range PVDD 4.5 14 V Inferred from PSRR test 2
Supply Voltage Range VDD 2.7 3.6 V Inferred from PSRR test 2
Input Amplifier Output Short-Circuit Current Limit -60 60 mA 2
Output Offset VOS -15 2 15 mV TA = 25°C 2
Hard Output Current Limit ISC 3.9 5.5 A 3
Quiescent Current (IDD) IDD 20 35 mA 2
Quiescent Current (IPVDD) IPVDD 10 20 mA 2
Shutdown Current (IVDD) IVDDSHDN 0.1 1 µA TA = +25°C 2
Shutdown Current (IPVDD) IPVDDSHDN 0.1 1 µA TA = +25°C 2
Digital Input Leakage Current ILK -1 1 µA TA = +25°C 4
VOL Input Leakage Current -5 5 µA 4
SYNC Input Leakage Current ISYNCIN -13 7.5 13 µA TA = +25°C 5
Class D Switching Frequency (fSW), SYNC = GND fSW 255 300 338 kHz SYNC = GND 4
Class D Switching Frequency (fSW), SYNC unconnected fSW 320 360 410 kHz SYNC = unconnected 4
Class D Switching Frequency (fSW) spread, spread-spectrum fSW -6 300 6 kHz SYNC = VDD (spread-spectrum mode); printed as 300 ±6 kHz 4
SYNC Frequency (fSYNC), SYNC = GND fSYNC 1020 1200 1355 kHz SYNC = GND 4
SYNC Frequency (fSYNC), SYNC unconnected fSYNC 1280 1440 1640 kHz SYNC = unconnected 4
SYNC Frequency (fSYNC) spread, spread-spectrum fSYNC -30 1200 30 kHz SYNC = VDD (spread-spectrum mode); printed as 1200 ±30 kHz 4
SYNC Frequency Lock Range 1000 1600 kHz 4
Minimum SYNC Frequency Lock Duty Cycle 40 % 4
Maximum SYNC Frequency Lock Duty Cycle 60 % 4
I2C Data Hold Time tHD,DAT 0 0.9 µs 5
Pulse Width of Spike Suppressed tSP 0 50 ns 5
Rise Time of SDA and SCL, Receiving tR 300 ns Receiving; Note 6; minimum printed as 20 + 0.1CB (expression, not numeric) 5
Fall Time of SDA and SCL, Receiving tF 300 ns Receiving; Note 6; minimum printed as 20 + 0.1CB (expression, not numeric) 5
Speaker Amplifier Supply Voltage (absolute maximum) PVDD 16 V PVDD to PGND 2
VDD to GND (absolute maximum) VDD 4 V VDD to GND 2
Logic pins to GND (FB_, SYNCOUT, SYNC, SDA/VOL, ADDR1, ADDR2) -0.3 V Maximum printed as VDD + 0.3V (expression, not numeric) 2
BOOT_ to VDD -0.3 6 V BOOT_ to VDD 2
BOOT_ to OUT_ -0.3 6 V BOOT_ to OUT_ 2
OUT_ to GND -0.3 V Maximum printed as PVDD + 0.3V (expression, not numeric) 2
PGND to GND -0.3 0.3 V PGND to GND 2
Any other pin to GND -0.3 4 V Any other pin to GND 2
Continuous Input Current (except OUT_) -20 20 mA Continuous 2
Junction Temperature 150 °C 2
Storage Temperature Range -65 150 °C 2
Lead Temperature 300 °C Soldering, 10s 2
Operating Temperature Range -40 85 °C 2
Thermal Resistance, junction-to-ambient, single-layer board θJA 37 °C/W Single-layer board 2
Thermal Resistance, junction-to-ambient, multilayer board θJA 27 °C/W Multilayer board 2

CAD (KiCad official)

  • Symbol: MAX9744ETH+T
  • Footprint: Package_DFN_QFN:QFN-44-1EP_7x7mm_P0.5mm_EP5.15x5.15mm
  • 3D model: TQFN-44(7x7) (KiCad packages3D, STEP)
  • 3D model files: max9744eth-t-etched.step / max9744eth-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max9744eth-t.step / max9744eth-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MAX datasheet (28 pp, sha256 0af23e8c2d55295d, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF