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Ray Publish 0.1.0 1d091f9 17d ago

MAX810TDBZRG

HANSCHIP semiconductor · Supervisor And Reset ICs · SOT-23-3

MAX810TDBZRG from HANSCHIP semiconductor, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Chip ground terminal.
2 RESET output Reset output that goes high when VCC is below the detection voltage Vth and low when VCC is above it, with VOL at most 0.3 V at ISINK = 1.2 mA and VOH at least 0.8VCC at ISOURCE = 150 uA.
3 VCC power_in Chip supply input, specified from 1.0 V to 6.0 V with an absolute maximum of 6.5 V.

Key specifications

Parameter Value
Manufacturer HANSCHIP semiconductor
Package SOT-23-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
工作电压 (Operating voltage) VCC 1 6 V 3
检测电压 tolerance (Threshold voltage, printed ±2.5%) Vth -2.5 2.5 % 1
静态电流 (Quiescent current) ICC 2 5 uA VCC=5.5V,No Load 3
上电复位时间 (Power-on reset time) Trp 85 500 900 ms MAX810 Z/R/S/T, VCC=0 to 3.5V, VRESET = H to L, No Load 3
复位输出低电压 (Reset output low voltage) VOL 0.3 V VCC = Vthmax, ISINK=1.2mA 3
温度系数 (Temperature coefficient) ΔVth/(Vth*ΔTa) -200 200 ppm/℃ -20℃≤Ta≤60℃ 3
复位输出电压 (Reset output voltage) VRESET -0.3 V 3
输入电压 (VCC input voltage) VCC 6.5 V 3
功耗 (Power dissipation, SOT-23) PD 200 mW 3
工作温度范围 (Operating temperature range) Tw -20 60 ℃ 3
存储温度范围 (Storage temperature range) Tc -50 125 ℃ 3
焊接温度 (Soldering temperature) Th 245 ℃ 10s 3
复位上升沿时间 (Reset rising edge time) Trd 90 ns VCC=Vth to (Vth-100mV) 3
检测电压 (Threshold voltage, ordering table Vth(E)) Vth 3.08 V 1

CAD (KiCad official)

  • Symbol: MAX810TDBZRG
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: max810tdbzrg-etched.step / max810tdbzrg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max810tdbzrg.step / max810tdbzrg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HANSCHIP semiconductor datasheet (6 pp, sha256 13741abb85210c7c, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF