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MAX810SDBZRG

HANSCHIP semiconductor · Supervisor And Reset ICs · SOT-23-3

MAX810SDBZRG from HANSCHIP semiconductor, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Chip ground terminal (芯片接地端), the reference for the supply and the reset output.
2 RESET output Active-high reset output that goes high when VCC falls below the 2.93 V threshold of this variant and stays high until VCC recovers, with VOL at most 0.3 V (1.2 mA sink) and VOH at least 0.8·VCC (150 µA source); the absolute range is -0.3 V to VCC+0.3 V.
3 VCC power_in Supply input with a 1.0 V to 6.0 V operating range and a 6.5 V absolute maximum rating.

Key specifications

Parameter Value
Manufacturer HANSCHIP semiconductor
Package SOT-23-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
工作电压 (operating voltage) VCC 1 6 V 3
静态电流 (quiescent current) ICC 2 5 uA VCC=5.5V,No Load 3
复位输出低电压 (reset output low voltage) VOL 0.3 V VCC = Vthmax, ISINK=1.2mA 3
复位输出高电压 (reset output high voltage) VOH 0.8 x VCC 1.8V<VCC<Vthmin, ISOURCE=150uA; printed as 0.8VCC (min) 3
上电复位时间 (power-on reset time) Trp 85 500 900 ms MAX810 Z/R/S/T, VCC=0 to 3.5V, VRESET = H to L, No Load 3
温度系数 (temperature coefficient) ΔVth/(Vth*ΔTa) -200 200 ppm/℃ -20℃≤Ta≤60℃ 3
VCC 输入电压 (input voltage, absolute max) VCC 6.5 V 3
复位输出电压 (reset output voltage) VRESET -0.3 V printed as -0.3~ VCC+0.3 3
功耗 (power dissipation, SOT-23) PD 200 mW SOT-23 3
工作温度范围 (operating temperature) Tw -20 60 ℃ 3
存储温度范围 (storage temperature) Tc -50 125 ℃ 3
焊接温度 (soldering temperature) Th 245 ℃ 10s 3
复位上升沿时间 (reset rising edge time) Trd 90 ns VCC=Vth to (Vth-100mV) 3

CAD (KiCad official)

  • Symbol: MAX810SDBZRG
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: max810sdbzrg-etched.step / max810sdbzrg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max810sdbzrg.step / max810sdbzrg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HANSCHIP semiconductor datasheet (6 pp, sha256 13741abb85210c7c, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF