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Contents

README

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MAX810RDBZRG

HANSCHIP semiconductor · Supervisor And Reset ICs · SOT-23-3

MAX810RDBZRG from HANSCHIP semiconductor, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Chip ground connection for the voltage detector.
2 RESET output Active-high reset output that goes high when VCC is below the threshold; it is rated VOL max 0.3 V at 1.2 mA sink and VOH min 0.8VCC at 150 µA source, and its absolute range is -0.3 V to VCC+0.3 V.
3 VCC power_in Supply input monitored against the reset threshold, with an operating range of 1.0 V to 6.0 V and an absolute maximum of 6.5 V.

Key specifications

Parameter Value
Manufacturer HANSCHIP semiconductor
Package SOT-23-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating voltage VCC 1 6 V 3
Static current ICC 2 5 uA VCC=5.5V,No Load 3
Detection (reset threshold) voltage tolerance Vth -2.5 2.5 % Precision reset voltage ±2.5% (feature list); electrical table prints Vth97.5% to Vth102.5% 1
Power-on reset time Trp 85 500 900 ms MAX810 Z/R/S/T, VCC=0 to 3.5V VRESET = H to L, No Load 3
Reset output low voltage VOL 0.3 V VCC = Vthmax, ISINK=1.2mA 3
Temperature coefficient of threshold ΔVth/(Vth*ΔTa) -200 200 ppm/℃ -20℃≤Ta≤60℃ 3
VCC input voltage VCC 6.5 V 3
Reset output voltage VRESET -0.3 V Upper limit printed as VCC+0.3 V 3
Power dissipation (SOT-23) PD 200 mW SOT-23 3
Operating temperature range Tw -20 60 ℃ 3
Storage temperature range Tc -50 125 ℃ 3
Soldering temperature Th 245 ℃ 10s 3
Reset threshold voltage (ordering table) Vth(E) 2.63 V MAX810RDBZRG, ordering table value 1
Reset rise time Trd 90 ns VCC=Vth to (Vth-100mV) 3

CAD (KiCad official)

  • Symbol: MAX810RDBZRG
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: max810rdbzrg-etched.step / max810rdbzrg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max810rdbzrg.step / max810rdbzrg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HANSCHIP semiconductor datasheet (6 pp, sha256 13741abb85210c7c, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF