main
History Download
Ray Publish 0.1.0 f22666c 7d ago

MAX809SDBZRG

HANSCHIP semiconductor · Supervisor And Reset ICs · SOT-23-3

MAX809SDBZRG from HANSCHIP semiconductor, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Chip ground terminal (芯片接地端); the datasheet gives no additional electrical limits for this pin.
2 RESET output Reset output (复位输出端) that drives low (VOL max 0.3 V at ISINK = 1.2 mA with VCC = Vthmin) and high (VOH min 0.8VCC at ISOURCE = 500 uA with VCC > Vthmax), with VRESET limited to -0.3 V to VCC+0.3 V.
3 VCC power_in Supply input (芯片输入端) with an operating range of 1.0 V to 6.0 V and an absolute maximum of 6.5 V.

Key specifications

Parameter Value
Manufacturer HANSCHIP semiconductor
Package SOT-23-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
工作电压 (operating voltage) VCC 1 6 V 3
工作温度范围 (operating temperature range) Tw -40 85 ℃ 3
复位电压 (reset threshold voltage, Vth(1)) Vth(1) 0.975 1.025 V VCC=Vth+0.5V to Vth, no load, VRESET=VCC to GND; printed as 0.975Vth(E) to 1.025Vth(E), Vth(E) nominal 3
上电复位时间 (power-on reset time, R/S/T group) Trp 80 350 ms VCC=0 to 3.5V, no load 3
复位输出低电压 (reset output low voltage) VOL 0.3 V VCC=Vthmin, ISINK=1.2mA 3
复位输出高电压 (reset output high voltage) VOH 0.8 V VCC>Vthmax, ISOURCE=500uA; printed as 0.8VCC (minimum, no maximum printed) 3
温度系数 (threshold temperature coefficient) ΔVth/(Vth*ΔTa) -150 150 ppm/℃ -40℃≤Ta≤85℃; printed as ±150 3
输入电压 (input voltage, absolute maximum) VCC 6.5 V 3
复位输出电压 (reset output voltage, absolute maximum) VRESET -0.3 V upper limit printed as VCC+0.3 3
功耗 (power dissipation, SOT-23) PD 200 mW SOT-23 3
存储温度范围 (storage temperature range) Tc -55 125 ℃ 3
焊接温度 (soldering temperature) Th 245 ℃ 10s 3

CAD (KiCad official)

  • Symbol: MAX809SDBZRG
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: max809sdbzrg-etched.step / max809sdbzrg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max809sdbzrg.step / max809sdbzrg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HANSCHIP semiconductor datasheet (6 pp, sha256 05a8818858c0aa10, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF