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MAX809RDBZRG

HANSCHIP semiconductor · Supervisor And Reset ICs · SOT-23-3

MAX809RDBZRG from HANSCHIP semiconductor, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Chip ground terminal; the datasheet gives no separate voltage or current limit for this pin.
2 RESET output Reset output (复位输出端); VOL is at most 0.3 V with 1.2 mA sink at VCC=Vthmin, VOH is at least 0.8×VCC with 500 µA source at VCC>Vthmax, and VRESET is limited to -0.3 V to VCC+0.3 V.
3 VCC power_in Chip supply input with an operating voltage of 1.0 V to 6.0 V and an absolute maximum input voltage of 6.5 V.

Key specifications

Parameter Value
Manufacturer HANSCHIP semiconductor
Package SOT-23-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating voltage (VCC) VCC 1 6 V 3
Reset voltage accuracy (high-precision reset threshold) Vth -2.5 2.5 % 1
Power-up reset time (R/S/T suffix group) Trp 80 350 ms VCC=0 to 3.5V, no load 3
Reset output low voltage VOL 0.3 V VCC=Vthmin, ISINK=1.2mA 3
Temperature coefficient of threshold voltage ΔVth/(Vth*ΔTa) -150 150 ppm/℃ -40℃≤Ta≤85℃ 3
Input voltage (VCC) absolute maximum VCC 6.5 V 3
Reset output voltage absolute range VRESET -0.3 V 3
Power dissipation (SOT-23) PD 200 mW SOT-23 3
Operating temperature range Tw -40 85 ℃ 3
Storage temperature range Tc -55 125 ℃ 3
Soldering temperature Th 245 ℃ 10s 3
Supply current (static) ICC 5.5 uA VCC=6V, No Load 3
Fall time Trd 5 us VCC= Vth to (Vth-100mV) 3

CAD (KiCad official)

  • Symbol: MAX809RDBZRG
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: max809rdbzrg-etched.step / max809rdbzrg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max809rdbzrg.step / max809rdbzrg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HANSCHIP semiconductor datasheet (6 pp, sha256 05a8818858c0aa10, retrieved 2026-10-19, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF