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MAX6675ISA+

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Analog Devices Inc./Maxim Integrated Interface - Specialized, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MAX6675ISA+

Analog Devices Inc./Maxim Integrated · Interface - Specialized · SOIC-8

MAX6675ISA+ from Analog Devices Inc./Maxim Integrated, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference for the device; the datasheet gives no separate limits for this pin.
2 T- passive Alumel lead of the type-K thermocouple, which should be connected to ground externally and kept as close to GND as possible for open-thermocouple detection.
3 T+ passive Chromel lead of the type-K thermocouple; absolute maximum rating is -0.3V to VCC + 0.3V relative to GND.
4 VCC power_in Positive supply, specified from 3.0V to 5.5V with a 0.1µF bypass capacitor to GND placed close to the pin.
5 SCK input Serial clock input, with a maximum serial clock frequency of 4.3 MHz.
6 CS input Chip select; set CS low to enable the serial interface, and forcing it low immediately stops any conversion in progress.
7 SO output Serial data output delivering the 16-bit read (dummy sign bit, 12-bit temperature, open-thermocouple flag, device ID bit and three-state bit), with a maximum SO current of 50mA.
8 N.C. unconnected No connection; the pin is not used internally.

Key specifications

Parameter Value
Manufacturer Analog Devices Inc./Maxim Integrated
Package SOIC-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Temperature Error (TTHERMOCOUPLE = +700°C, TA = +25°C), VCC = +3.3V -5 5 LSB TTHERMOCOUPLE = +700°C, TA = +25°C (Note 2), VCC = +3.3V 2
Temperature Error (TTHERMOCOUPLE = +700°C, TA = +25°C), VCC = +5V -6 6 LSB TTHERMOCOUPLE = +700°C, TA = +25°C (Note 2), VCC = +5V 2
Temperature Error (TTHERMOCOUPLE = 0°C to +700°C, TA = +25°C), VCC = +3.3V -8 8 LSB TTHERMOCOUPLE = 0°C to +700°C, TA = +25°C (Note 2), VCC = +3.3V 2
Temperature Error (TTHERMOCOUPLE = 0°C to +700°C, TA = +25°C), VCC = +5V -9 9 LSB TTHERMOCOUPLE = 0°C to +700°C, TA = +25°C (Note 2), VCC = +5V 2
Temperature Error (TTHERMOCOUPLE = +700°C to +1000°C, TA = +25°C), VCC = +3.3V -17 17 LSB TTHERMOCOUPLE = +700°C to +1000°C, TA = +25°C (Note 2), VCC = +3.3V 2
Temperature Error (TTHERMOCOUPLE = +700°C to +1000°C, TA = +25°C), VCC = +5V -19 19 LSB TTHERMOCOUPLE = +700°C to +1000°C, TA = +25°C (Note 2), VCC = +5V 2
Cold-Junction Compensation Error, VCC = +3.3V -3 3 °C TA = -20°C to +85°C (Note 2), VCC = +3.3V 2
Cold-Junction Compensation Error, VCC = +5V -3 3 °C TA = -20°C to +85°C (Note 2), VCC = +5V 2
Supply Voltage VCC 3 5.5 V 2
Supply Current ICC 0.7 1.5 mA 2
Power-On Reset Threshold 1 2 2.5 V VCC rising 2
Input Low Voltage VIL 0.3 x VCC Printed as 0.3 x VCC 2
Input High Voltage VIH 0.7 x VCC Printed as 0.7 x VCC 2
Input Leakage Current ILEAK -5 5 µA VIN = GND or VCC 2
Output High Voltage VOH 0.4 V ISOURCE = 1.6mA; printed as VCC - 0.4 V 3
Output Low Voltage VOL 0.4 V ISINK = 1.6mA 3
Serial Clock Frequency fSCL 4.3 MHz 3
SCK Pulse High Width tCH 100 ns 3
SCK Pulse Low Width tCL 100 ns 3
CSB Fall to SCK Rise tCSS 100 ns CL = 10pF 3
CSB Fall to Output Enable tDV 100 ns CL = 10pF 3
CSB Rise to Output Disable tTR 100 ns CL = 10pF 3
SCK Fall to Output Data Valid tDO 100 ns CL = 10pF 3
Supply Voltage (VCC to GND) VCC -0.3 6 V 2
SO, SCK, CS, T-, T+ to GND -0.3 0.3 V Printed max is VCC + 0.3V (upper limit referenced to VCC) 2
SO Current 50 mA 2
ESD Protection (Human Body Model) -2000 2000 V Human Body Model 2
Continuous Power Dissipation 471 mW TA = +70°C, 8-Pin SO (derate 5.88mW/°C above +70°C) 2
Operating Temperature Range TA -20 85 °C 2
Storage Temperature Range TSTG -65 150 °C 2
Junction Temperature TJ 150 °C 2
Vapor Phase Soldering 215 °C 60s, SO package 2
Infrared Soldering 220 °C 15s, SO package 2
Lead Temperature (soldering) 300 °C 10s 2

CAD (KiCad official)

  • Symbol: MAX6675ISA+
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: max6675isa-etched.step / max6675isa-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max6675isa.step / max6675isa.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Analog Devices Inc./Maxim Integrated datasheet (8 pp, sha256 4a750e839fd0ac04, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF