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MAX6364PUT29+T
Public Made by Adomby adom
Maxim Integrated Monitors & Reset Circuits, SOT-23-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
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PCB Footprint
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Datasheet
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README
markdownMAX6364PUT29+T
Maxim Integrated · Monitors & Reset Circuits · SOT-23-6
MAX6364PUT29+T from Maxim Integrated, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RESET IN | input | Reset input: when RESET IN falls below the internal 1.235V reference, reset is asserted, and RESET remains asserted for at least 150ms (tRP) after RESET IN goes high. |
| 2 | GND | power_in | Ground reference for the device. |
| 3 | RESET | output | Active-low open-drain reset output (MAX636_P): RESET is continuously low when VCC is below the reset threshold (VTH) or RESET IN is low, and remains low for the reset timeout period (tRP) after VCC rises above VTH. |
| 4 | VCC | power_in | Supply voltage, 0 to 5.5V; reset is asserted when VCC drops below the reset threshold voltage (VTH). |
| 5 | OUT | power_out | Output sourcing from VCC when VCC is above VTH, and from the greater of VCC or BATT when VCC is below VTH; OUT can supply up to 150mA from VCC. |
| 6 | BATT | power_in | Backup-battery input: BATT switches to OUT when VCC is below the reset threshold and VBATT is 20mV greater than VCC, with 40mV hysteresis to prevent repeated switching. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Maxim Integrated |
| Package | SOT-23-6 |
| Category | Power Management ICs |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reset threshold VTH (suffix 29) | VTH | 2.85 | 2.93 | 3 | V | MAX636_UT29 | 2 |
| Reset-active timeout period | tRP | 150 | 280 | ms | 2 | ||
| Operating voltage range, VCC or VBATT | VCC, VBATT | 0 | 5.5 | V | No load (Note 2) | 2 | |
| Supply current ICC | ICC | 10 | 30 | µA | No load, VCC > VTH, WDI = VCC or GND (MAX6362), VCC = 2.8V | 2 | |
| Supply current ICC | ICC | 11 | 35 | µA | No load, VCC > VTH, WDI = VCC or GND (MAX6362), VCC = 3.6V | 2 | |
| Supply current ICC | ICC | 15 | 50 | µA | No load, VCC > VTH, WDI = VCC or GND (MAX6362), VCC = 5.5V | 2 | |
| Supply current in battery-backup mode (excluding IOUT) | ISUPPLY | 1 | µA | VBATT = 2.8V, VCC = 0V, TA = +25°C | 2 | ||
| Supply current in battery-backup mode (excluding IOUT) | ISUPPLY | 3 | µA | VBATT = 2.8V, VCC = 0V, TA = -40°C to +85°C | 2 | ||
| BATT standby current | IBATT | -0.1 | 0.02 | µA | 5.5V > VCC > (VBATT + 0.2V), TA = +25°C | 2 | |
| BATT standby current | IBATT | -1 | 0.05 | µA | 5.5V > VCC > (VBATT + 0.2V), TA = -40°C to +85°C | 2 | |
| RESET IN input threshold | 1.185 | 1.235 | 1.285 | V | 3 | ||
| RESET IN leakage current | -25 | 0.01 | 25 | nA | 3 | ||
| RESET, RESET output leakage current | ILK | 1 | µA | MAX636_P, MAX636_H only | 3 | ||
| VCC, BATT, OUT voltage (with respect to GND) | VCC, BATT, OUT | -0.3 | 6 | V | With respect to GND | 2 | |
| RESET (open drain), RESET (open drain) voltage (with respect to GND) | RESET, RESET | -0.3 | 6 | V | With respect to GND | 2 | |
| BATT ON, RESET (push-pull), RESET IN, WDI voltage (with respect to GND) | BATT ON, RESET, RESET IN, WDI | -0.3 | V | Maximum is (VOUT + 0.3V) | 2 | ||
| MR voltage (with respect to GND) | MR | -0.3 | V | Maximum is (VCC + 0.3V) | 2 | ||
| VCC input current, peak | VCC | 1 | A | Peak | 2 | ||
| BATT input current, continuous | BATT | 40 | mA | Continuous | 2 | ||
| RESET, RESET, BATT ON output current | RESET, RESET, BATT ON | 20 | mA | 2 | |||
| Operating temperature range | TA | -40 | 85 | °C | 2 | ||
| Junction temperature | TJ | 150 | °C | 2 | |||
| Storage temperature range | TSTG | -65 | 150 | °C | 2 | ||
| Lead temperature (soldering) | 300 | °C | 10 s | 2 | |||
| Soldering temperature (reflow), lead-free | 260 | °C | Lead(Pb)-free | 2 | |||
| Soldering temperature (reflow), packages containing lead | 240 | °C | Packages containing lead(Pb) | 2 |
CAD (KiCad official)
- Symbol:
MAX6364PUT29+T - Footprint:
Package_TO_SOT_SMD:SOT-23-6 - 3D model: SOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
max6364put29-t-etched.step/max6364put29-t-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);max6364put29-t.step/max6364put29-t.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Maxim Integrated datasheet (11 pp, sha256
d06e95bb889faf65, retrieved 2026-10-30, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).