# MAX6126BASA25+

**Maxim Integrated** · Voltage References · SOIC-8

MAX6126BASA25+ from Maxim Integrated, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NR | passive | Noise reduction pin; connect a 0.1µF capacitor to improve wideband noise, or leave unconnected if not used. |
| 2 | IN | power_in | Positive power-supply input, operating from (VOUT + 200mV) to 12.6V. |
| 3 | GND | power_in | Ground. |
| 4 | GNDS | passive | Ground-sense connection; connect to the ground connection at the load (must stay within ±0.3V of GND). |
| 5 | I.C. | unconnected | Internally connected; do not connect anything to this pin. |
| 6 | OUTS | output | Voltage reference sense output. |
| 7 | OUTF | output | Voltage reference force output; short OUTF to OUTS as close to the load as possible and bypass with a 0.1µF to 10µF capacitor to GND. |
| 8 | I.C. | unconnected | Internally connected; do not connect anything to this pin. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Maxim Integrated |
| Package | SOIC-8 |
| Category | Power Management ICs |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage Accuracy (B grade SO) |  | -0.06 |  | 0.06 | % | Referred to VOUT, TA = +25°C | 3 |
| Output Voltage Temperature Coefficient (B grade SO) | TCVOUT |  | 1 | 5 | ppm/°C | TA = -40°C to +85°C | 3 |
| Output Voltage Temperature Coefficient (B grade SO) | TCVOUT |  | 2 | 10 | ppm/°C | TA = -40°C to +125°C | 3 |
| Line Regulation | ΔVOUT/ΔVIN |  | 3 | 20 | µV/V | 2.7V ≤ VIN ≤ 12.6V, TA = +25°C | 3 |
| Line Regulation | ΔVOUT/ΔVIN |  |  | 40 | µV/V | 2.7V ≤ VIN ≤ 12.6V, TA = -40°C to +125°C | 3 |
| Load Regulation, sourcing | ΔVOUT/ΔIOUT |  | 1 | 25 | µV/mA | Sourcing: 0 ≤ IOUT ≤ 10mA | 3 |
| Load Regulation, sinking | ΔVOUT/ΔIOUT |  | 1.8 | 25 | µV/mA | Sinking: -10mA ≤ IOUT ≤ 0 | 3 |
| Dropout Voltage | VIN - VOUT |  | 0.06 | 0.2 | V | ΔVOUT = 0.1%, IOUT = 5mA | 4 |
| Dropout Voltage | VIN - VOUT |  | 0.12 | 0.4 | V | ΔVOUT = 0.1%, IOUT = 10mA | 4 |
| Supply Voltage Range | VIN | 2.7 |  | 12.6 | V | Guaranteed by line-regulation test | 4 |
| Quiescent Supply Current | IIN |  | 380 | 550 | µA | TA = +25°C | 4 |
| Quiescent Supply Current | IIN |  |  | 725 | µA | TA = -40°C to +125°C | 4 |
| Capacitive-Load Stability Range | CLOAD | 0.1 |  | 10 | µF | No sustained oscillations | 4 |
| Output Voltage | VOUT |  | 2.5 |  | V | TA = +25°C | 3 |
| OUT Short-Circuit Current | ISC |  | 160 |  | mA | Short to GND | 4 |
| OUT Short-Circuit Current | ISC |  | 20 |  | mA | Short to IN | 4 |
| Thermal Hysteresis (SO) | ΔVOUT/cycle |  | 35 |  | ppm | SO | 4 |
| Long-Term Stability (SO) | ΔVOUT/time |  | 20 |  | ppm/1000hr | 1000hr at TA = +25°C, SO | 4 |
| Noise Voltage | eOUT |  | 1.45 |  | µVP-P | f = 0.1Hz to 10Hz | 4 |
| Noise Voltage | eOUT |  | 75 |  | nV/√Hz | f = 1kHz, CNR = 0 | 4 |
| Noise Voltage | eOUT |  | 45 |  | nV/√Hz | f = 1kHz, CNR = 0.1µF | 4 |
| Turn-On Settling Time | tR |  | 1 |  | ms | To VOUT = 0.01% of final value, CNR = 0 | 4 |
| Turn-On Settling Time | tR |  | 20 |  | ms | To VOUT = 0.01% of final value, CNR = 0.1µF | 4 |
| GNDS voltage |  | -0.3 |  | 0.3 | V | Referenced to GND | 2 |
| IN voltage |  | -0.3 |  | 13 | V | Referenced to GND | 2 |
| OUTF, OUTS, NR voltage |  | -0.3 |  | 6 | V | -0.3V to the lesser of (VIN + 0.3V) or +6V | 2 |
| Operating Temperature Range |  | -40 |  | 125 | °C |  | 2 |
| Junction Temperature |  |  |  | 150 | °C |  | 2 |
| Storage Temperature Range |  | -65 |  | 150 | °C |  | 2 |
| Lead Temperature (soldering, 10s) |  |  |  | 300 | °C |  | 2 |
| Soldering Temperature (reflow) |  |  |  | 260 | °C |  | 2 |

## CAD (KiCad official)

- Symbol: `MAX6126BASA25+`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `max6126basa25-etched.step` / `max6126basa25-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `max6126basa25.step` / `max6126basa25.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Maxim Integrated datasheet](https://www.analog.com/media/en/technical-documentation/data-sheets/max6126.pdf) (28 pp, sha256 `54fe36ef3780afd6`, retrieved 2026-10-31, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/max6126basa25-datasheet.pdf)