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MAX6071BAUT33+T
Public Made by Adomby adom
Maxim Integrated Voltage References, SOT-23-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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MAX6071BAUT33+T
Maxim Integrated · Voltage References · SOT-23-6
MAX6071BAUT33+T from Maxim Integrated, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GNDF | power_in | Ground Force; the MAX6071 uses this force-ground pin with GNDS as the Kelvin ground connection. |
| 2 | GNDS | power_in | Ground Sense. Connect to ground connection at the load. |
| 3 | EN | input | Enable. Drive high to enable the device. Drive low to disable the device. |
| 4 | IN | power_in | Supply Input, drawing 150µA of supply current with only a 1.6µA/V variation with supply voltage. |
| 5 | OUTS | output | Voltage Reference Sense Output, connected to OUTF at the point where voltage accuracy is needed. |
| 6 | OUTF | output | Voltage Reference Force Output. Short OUTF to OUTS as close as possible to the load. Bypass OUTF with a capacitor (0.1µF to 10µF) to GND. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Maxim Integrated |
| Package | SOT-23-6 |
| Category | Power Management ICs |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output Voltage Accuracy | -0.08 | 0.08 | % | MAX6071B, TA = +25°C | 9 | ||
| Output Voltage Temperature Drift | TCVOUT | 2 | 8 | ppm/°C | MAX6071B | 9 | |
| Supply Voltage | VIN | 3.5 | 5.5 | V | Guaranteed by line regulation | 9 | |
| Enable Input Current | IEN | -1 | 1 | µA | 9 | ||
| Output Current | IOUT | -10 | 10 | mA | 9 | ||
| Capacitive-Load Stability Range | 0.1 | 10 | µF | IOUT ≤ 10mA | 9 | ||
| Line Regulation | 90 | 220 | µV/V | Over specified VIN range, TA = +25°C | 9 | ||
| Line Regulation | 285 | µV/V | Over specified VIN range, TA = TMIN to TMAX | 9 | |||
| Load Regulation sink | 100 | 190 | µV/mA | 0mA < IOUT < 10mA, sink | 9 | ||
| Load Regulation source | 100 | 165 | µV/mA | 0mA < IOUT < 10mA, source | 9 | ||
| Dropout Voltage | 65 | 150 | mV | IOUT = 10mA, TA = TMIN to TMAX | 9 | ||
| Short-Circuit Current sourcing to ground | ISC | 25 | mA | Sourcing to ground | 9 | ||
| Short-Circuit Current sinking from VIN | ISC | 25 | mA | Sinking from VIN | 9 | ||
| Long-Term Stability | 40 | ppm | 1000 hours at TA = +25°C | 9 | |||
| Thermal Hysteresis | 85 | ppm | 9 | ||||
| 1/f Noise Voltage | eOUT | 10 | µVP-P | 0.1Hz to 10Hz, COUT = 0.1µF | 9 | ||
| MAX6071 thermal noise | eOUT | 9 | µVRMS | 10Hz to 10kHz, COUT = 0.1µF | 9 | ||
| Ripple Rejection | 78 | dB | Frequency = 60Hz | 9 | |||
| Turn-On Settling Time MAX6071 | tR | 42 | µs | Settling to 0.01%, COUT = 0.1µF | 9 | ||
| Enable Settling Time MAX6071 | tEN | 75 | µs | Settling to 0.01%, COUT = 0.1µF | 9 | ||
| Quiescent Supply Current | IIN | 160 | 240 | µA | TA = +25°C | 9 | |
| Quiescent Supply Current | IIN | 330 | µA | TA = TMIN to TMAX | 9 | ||
| Shutdown Supply Current | ISD | 0.6 | 6 | µA | 9 | ||
| IN to GNDS, GNDF, GND | -0.3 | 6 | V | Referenced to GNDS, GNDF, GND | 2 | ||
| OUTS to GNDS, GNDF, GND | -0.3 | 6 | V | Referenced to GNDS, GNDF, GND | 2 | ||
| OUTF to GNDS, GNDF, GND | -0.3 | 6 | V | Upper limit is the lower of (VIN + 0.3V) and +6V | 2 | ||
| EN to GNDS, GNDF, GND | -0.3 | 6 | V | Referenced to GNDS, GNDF, GND | 2 | ||
| GNDS to GNDF | -0.3 | 0.3 | V | 2 | |||
| Continuous Power Dissipation SOT23 | 347.8 | mW | TA = +70°C, derate 4.3mW/°C above +70°C | 2 | |||
| Operating Temperature Range | TA | -40 | 125 | °C | 2 | ||
| Junction Temperature | TJ | 150 | °C | 2 | |||
| Storage Temperature Range | TSTG | -65 | 150 | °C | 2 | ||
| Soldering Temperature (reflow) | 260 | °C | 2 | ||||
| Lead Temperature (soldering, 10s) | 300 | °C | 10s | 2 | |||
| Thermal Resistance Junction to Ambient SOT23 | θJA | 230 | °C/W | Multi-layer board | 2 | ||
| Thermal Resistance Junction to Case SOT23 | θJC | 76 | °C/W | Multi-layer board | 2 |
CAD (KiCad official)
- Symbol:
MAX6071BAUT33+T - Footprint:
Package_TO_SOT_SMD:SOT-23-6 - 3D model: SOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
max6071baut33-t-etched.step/max6071baut33-t-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);max6071baut33-t.step/max6071baut33-t.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Maxim Integrated datasheet (26 pp, sha256
5b48e6a8cb45c5c4, retrieved 2026-11-02, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).