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MAX6006BEUR+T
Public Made by Adomby adom
Maxim Integrated Voltage References, SOT-23-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMAX6006BEUR+T
Maxim Integrated · Voltage References · SOT-23-3
MAX6006BEUR+T from Maxim Integrated, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | passive | Output voltage (1.25V for MAX6006); bias OUT with a pullup resistor to a potential greater than OUT and bypass OUT to GND with a 0.01µF or larger capacitor. |
| 2 | GND | power_in | Ground. |
| 3 | I.C. | unconnected | Internally connected test point; leave this pin unconnected, or connect to GND. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Maxim Integrated |
| Package | SOT-23-3 |
| Category | Power Management ICs |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Breakdown Voltage (MAX6006B, 0.5%) | VR | 1.2438 | 1.25 | 1.2563 | V | TA = +25°C, IR = 1.2µA | 2 |
| Minimum Operating Current | IRMIN | 0.5 | 1 | µA | VR change < 0.2% from VR at IR = 1.2µA | 2 | |
| Reverse Breakdown Change with Current | 1 | mV | IR = 1.2µA to 200µA | 2 | |||
| Reverse Breakdown Change with Current | 2 | mV | IR = 200µA to 2mA | 2 | |||
| Reverse Dynamic Impedance | 1.5 | Ω | IR = 1.2µA to 2mA (Note 2) | 2 | |||
| Temperature Coefficient (MAX6006B) | TC | 75 | ppm/°C | IR = 1.2µA | 2 | ||
| Low-Frequency Noise | 30 | µVP-P | IR = 1.2µA, f = 0.1Hz to 10Hz | 2 | |||
| Long-Term Drift | 150 | ppm | 1000h at TA = +25°C | 2 | |||
| Thermal Hysteresis | 200 | ppm | Note 4 | 2 | |||
| Operating Temperature Range | -40 | 85 | °C | 2 | |||
| Storage Temperature Range | -65 | 150 | °C | 2 | |||
| Lead Temperature (soldering, 10s) | 300 | °C | 2 | ||||
| Soldering Temperature (reflow) | 260 | °C | 2 | ||||
| Thermal Resistance Junction to Ambient | θJA | 274.23 | °C/W | 3 SOT23, multilayer board | 2 | ||
| Thermal Resistance Junction to Case | θJC | 86.19 | °C/W | 3 SOT23, multilayer board | 2 | ||
| Output Capacitor | CL | 0.01 | µF | OUT bypassed to GND with 0.01µF or larger | 6 |
CAD (KiCad official)
- Symbol:
MAX6006BEUR+T - Footprint:
Package_TO_SOT_SMD:SOT-23-3 - 3D model: SOT-23-3 (KiCad packages3D, STEP)
- 3D model files:
max6006beur-t-etched.step/max6006beur-t-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);max6006beur-t.step/max6006beur-t.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Maxim Integrated datasheet (8 pp, sha256
3b52a24fcba522a1, retrieved 2026-10-31, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).