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MAX40660ATB

Maxim Integrated · Special Purpose Amplifiers · TDFN-10-EP(3x3)

MAX40660ATB from Maxim Integrated, in a TDFN-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCL power_in Power supply connection for the input current clamp; connect to VCC.
2 LP input Enable/low-power input: logic-high is normal operation and logic-low puts the device into low-power standby (VIH 2.0V min, VIL 0.8V max).
3 IN input Signal input; connect to the photodiode cathode through a coupling capacitor for positive cathode bias, or directly to the cathode for negative bias on the anode.
4 OFFSET input Offset adjustment current input that sinks current to adjust the effective input offset current; leave unconnected if offset adjustment is not needed.
5 GAIN input Gain select input: connect to GND for 25kΩ transimpedance and to VCC for 50kΩ transimpedance (logic levels VIL 0.8V max, VIH 2.0V min).
6 GND power_in Circuit ground.
7 OUTN output Negative 50Ω output; the voltage decreases as input current increases and the output should be AC-coupled or terminated to VCC.
8 OUTP output Positive 50Ω output; the voltage increases as input current increases and the output should be AC-coupled or terminated to VCC.
9 VCC power_in +3.3V supply voltage (VCC specified as +2.9V to +3.5V in the electrical characteristics).
10 GND power_in Circuit ground.
11 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Maxim Integrated
Package TDFN-10-EP(3x3)
Category Amplifiers
Pins 11

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (absolute maximum) -0.3 3.6 V 4
Current Into IN -2 A 10ns pulse width, 0.5% duty cycle 4
Current Into IN, OFFSET (continuous) -0.4 0 mA continuous 4
Current into LP, Gain (continuous) -10 10 mA continuous 4
Current into OUTP and OUTN (continuous) -20 20 mA continuous 4
Voltage at OUTN, OUTP 0.3 V printed as VCC + 0.3V; value is offset above VCC 4
Voltage at GAIN, LP -0.3 0.3 V printed as -0.3V to VCC + 0.3V; max is offset above VCC 4
Operating Temperature Range -40 125 °C 4
Operating Junction Temperature Range (die) -40 150 °C die 4
Storage Temperature Range -55 150 °C 4
Soldering Temperature (reflow) 260 °C reflow 4
Supply Voltage (recommended, VCC) VCC 2.9 3.3 3.5 V VCL = VCC; typical at VCC = +3.3V 4
Power Supply Current ICC 41 70 mA LP > 2.0V (logic-high) (Note 4) 4
Power Supply Current ICC 8 13 mA LP < 0.8V (logic-low) (Note 4) 4
VCL Quiescent Supply Current 0.1 20 µA LP > 2.0V (logic-high) (Note 4) 4
Input Bias Voltage VBIAS 0.85 1 V IN and OFFSET 4
Transimpedance Linearity -10 2 10 % GAIN = GND (Note 2) 4
Transimpedance Z21 18 25 32 kΩ GAIN logic-low, IIN < 2µAP-P 5
Transimpedance Z21 36 50 64 kΩ GAIN logic-high, IIN < 1µAP-P 5
Transimpedance in low-power standby 300 mΩ In low-power standby mode: LP < VIL, IIN = 1µARMS, fIN = 100MHz 5
OFFSET Input Transimpedance 18 25 32 kΩ GAIN logic-low, IOFFSET < 2µAP-P 5
OFFSET Input Transimpedance 36 50 64 kΩ GAIN logic-high, IOFFSET < 1µAP-P 5
Overload Recovery Time 2 ns 0 to -100mA input current 5
Input Logic 0 VIL 0 0.8 V GAIN, LP (Note 4) 5
Input Logic 1 VIH 2 V GAIN, LP (Note 4); printed max is VCC 5
Logic Input Current Low IIL 0.001 1 µA GAIN, LP (Note 4) 5
Logic Input Current High IIH 0.001 1 µA GAIN, LP (Note 4) 5
Standby De-Assert Delay 200 ns Time from LP > VIL to output common-mode voltage 90% of nominal value. Measured at OUTP and OUTN. 5
Output Common-Mode Voltage -1.15 -0.73 -0.4 V printed as VCC - 1.15 / VCC - 0.73 / VCC - 0.40; values are offsets below VCC 5
Differential Output Offset ΔVOUT ΔVOUT -200 mV IIN = 0mA, GAIN = GND 5
Differential Output Offset ΔVOUT ΔVOUT -400 mV IIN = 0mA, GAIN = VCC 5
Output Impedance ZOUT 40 50 60 Ω Single-ended 5
Maximum Differential Output Voltage Swing VOUT(MAX) 475 825 1290 mV IIN = 0mA to -200µA pulse, GAIN logic-low 5
Maximum Differential Output Voltage Swing VOUT(MAX) 500 920 1490 mV IIN = 0mA to -200µA pulse, GAIN logic-high 5
Input Resistance RIN 65 Ω 5
Bandwidth (MAX40660) BW 300 490 660 MHz MAX40660, CIN = 0.5pF 5
Bandwidth (MAX40660) BW 70 165 280 MHz MAX40660, CIN = 10pF 5
Input Noise Density (MAX40660) 2.1 pA/√Hz MAX40660, f = 10MHz, CIN = 0.8pF 5
Input Noise Density (MAX40660) 2.8 pA/√Hz MAX40660, f = 10MHz, CIN = 10pF 5
Junction to Ambient (θJA), single-layer board θJA 54 °C/W 10 TDFN, single-layer board, JESD51-7 4
Junction to Case (θJC), single-layer board θJC 9 °C/W 10 TDFN, single-layer board 4
Junction to Ambient (θJA), four-layer board θJA 41 °C/W 10 TDFN, four-layer board, JESD51-7 4
Junction to Case (θJC), four-layer board θJC 9 °C/W 10 TDFN, four-layer board 4

CAD (KiCad official)

  • Symbol: MAX40660ATB
  • Footprint: Package_DFN_QFN:DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
  • 3D model: TDFN-10-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: max40660atb-etched.step / max40660atb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max40660atb.step / max40660atb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Maxim Integrated datasheet (19 pp, sha256 fbb147daa6526961, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF