main
Download ZIP Propose a change
Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs max3485eim: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
viewers pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
max3485eim-etched.fit.json max3485eim: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
max3485eim-etched.glb max3485eim: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
max3485eim-etched.step max3485eim: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
max3485eim.glb Publish 0.1.0 · Ray
max3485eim.kicad_mod Publish 0.1.0 · Ray
max3485eim.kicad_sym Publish 0.1.0 · Ray
max3485eim.lbr rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect an… · Ray
max3485eim.step Publish 0.1.0 · Ray
package.json Publish 0.2.0 · Ray
pads.json pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
page.json max3485eim: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding) · Ray
README.md max3485eim: laser-etched CAD + chip hero (factory 2.0.0 backfill) · Ray

MAX3485EIM

HGSEMI · RS-485 / RS-422 ICs · SOP-8

MAX3485EIM from HGSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output. When /RE is low, RO is high if (A-B) >= +200 mV and low if (A-B) <= -200 mV. High-impedance when /RE is high or the device is in shutdown.
2 /RE input Receiver output enable, active low. Low enables RO; high tri-states RO. When /RE is high and DE is low, the device enters low-power shutdown mode.
3 DE input Driver output enable, active high. High enables the differential driver on A/B; low tri-states the driver. When /RE is high and DE is low the device enters low-power shutdown mode.
4 DI input Driver input. With DE high, a low on DI forces A low and B high; a high on DI forces A high and B low. VIH >= 2.0 V, VIL <= 0.8 V (3.3 V logic).
5 GND power_in Ground reference for the device. Connect to the common system ground.
6 A bidirectional Non-inverting RS-485 bus pin: receiver non-inverting input and driver non-inverting output. Absolute input range -7 V to +13 V; ±15 kV HBM ESD.
7 B bidirectional Inverting RS-485 bus pin: receiver inverting input and driver inverting output. Absolute input range -7 V to +13 V; ±15 kV HBM ESD.
8 VCC power_in Supply pin. Operating range 3.0 V to 3.6 V (nominal 3.3 V). Bypass locally with a 0.1 µF ceramic capacitor to GND.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-8
Category Interface
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • MAX3485EIM/TR
  • MAX3485ECM/TR
  • MAX3485EIN
  • MAX3485ECN
  • MAX3485EIMM/TR
  • MAX3485ECMM/TR
  • MAX3485EIDQ/TR
  • MAX3485EIDQ3/TR
  • MAX3485ECDQ/TR
  • MAX3485ECDQ3/TR
  • MAX3485EIM8/TR
  • MAX3485ECM8/TR

CAD (KiCad official)

  • Symbol: MAX3485EIM
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: max3485eim-etched.step / max3485eim-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max3485eim.step / max3485eim.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
max3485eim.step 122 KB You want the bare part, or you mark your own boards.
max3485eim-etched.step 2.0 MB You want the part with MAX3485EIM already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 505 faces against 147 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (17 pp, sha256 2c206ef20fa97d7e, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF