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MAX33041EASA+

Maxim Integrated · CAN ICs · SOIC-8

MAX33041EASA+ from Maxim Integrated, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 TXD input Transmit data input; drive high for the recessive state and low for the dominant state, with an internal pullup to VDD.
2 GND power_in Ground.
3 VDD power_in Supply voltage (3.0V to 3.6V); bypass to GND with a 0.1µF capacitor.
4 RXD output Receive data output; high when CANH and CANL are in the recessive state and low when they are in the dominant state.
5 SHDN input CMOS/TTL-compatible shutdown input; drive high to enter shutdown, with an internal pulldown resistor to GND.
6 CANL bidirectional CAN bus-line low, fault protected to ±40V.
7 CANH bidirectional CAN bus-line high, fault protected to ±40V.
8 STBY input Standby mode select; logic high selects standby, logic low selects normal mode, and a 39.2kΩ resistor to ground selects slow slew rate.

Key specifications

Parameter Value
Manufacturer Maxim Integrated
Package SOIC-8
Category Communication Interface Chip/UART/485/232
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VDD 3 3.6 V 4
Dominant Supply Current IDD_DOM 4.5 8 mA TXD = SHDN = STBY = 0V, RXD open, no load 4
Dominant Supply Current IDD_DOM 36 50 mA TXD = SHDN = STBY = 0V, RXD open, RLD = 60Ω 4
Shutdown Current ISHDN 5 μA SHDN = STBY = TXD = VDD 4
Standby Supply Current ISTBY 60 μA STBY = TXD = VDD, SHDN = 0V, RXD open 4
Recessive Supply Current IDD_REC 3.6 mA VDD = TXD = 3.3V, STBY = SHDN = 0V, RXD open, no load 4
UVLO Threshold Rising VUVLO_R 2.7 V VDD rising 4
UVLO Threshold Falling VUVLO_F 1.2 V VDD falling 4
Fault Protection Range VFP -40 40 V CANH or CANL to GND 4
Input High Voltage VIH 2 V 4
Input Low Voltage VIL 0.8 V 4
TXD Input Pullup Resistance RPU_TXD 100 250 kΩ TXD = 0V 4
STBY Input Pullup Resistance RPU_STBY 100 250 kΩ STBY = 0V 4
Output Low Voltage VOL 0.4 V Sinking 4mA, TXD = 0V 4
Input Low Voltage STBY VIL_STBY 0.2 V 4
Bus Output Differential Voltage (Dominant) VOD_DOM 1.5 3 V TXD = 0V, RCM = 1KΩ, -5V ≤ VCM ≤ VDD 5
Output Voltage Standby VO_STBY 40 120 mV TXD = STBY = VDD, no load 5
Bus Output Differential Voltage (Recessive) VOD_REC -10 10 mV TXD = VDD, RLD = 60Ω 5
Bus Output Differential Voltage (Recessive) VOD_REC -50 50 mV TXD = VDD, no load 5
Common-Mode Input Range VCM -25 25 V CANH or CANL to GND, RXD output valid 5
Common-Mode Input Range Standby Mode VCM_STBY -12 12 V CANH or CANL to GND, RXD output valid 5
Input Differential Voltage (Dominant) VID_DOM 0.9 V -25V ≤ VCM ≤ +25V, TXD = VDD 5
Input Differential Voltage (Recessive) VID_REC 0.5 V -25V ≤ VCM ≤ +25V, TXD = VDD 5
Input Resistance RIN 10 50 kΩ TXD = VDD 5
Differential Input Resistance RIN_DIFF 20 100 kΩ TXD = VDD 5
Input Capacitance CIN 19 35 pF TXD = VDD (Note 2) 5
Differential Input Capacitance CIN_DIFF 10 18 pF TXD = VDD (Note 2) 5
TXD to RXD Loop Delay (Dominant-to-Recessive) tLOOP 70 140 ns STBY = 0V, Figure 2 6
TXD to RXD Loop Delay (Recessive-to-Dominant) tLOOP 90 140 ns STBY = 0V, Figure 2 6
TXD Propagation Delay (Recessive to Dominant) tONTXD 43 60 ns VDD = 3.3V, RCM is open, Figure 1 6
TXD Propagation Delay (Dominant to Recessive) tOFFTXD 40 60 ns VDD = 3.3V, RCM is open, Figure 1 6
RXD Propagation Delay (Recessive to Dominant) tONRXD 55 85 ns VDD = 3.3V, CL = 15pF, Figure 3 6
RXD Propagation Delay (Dominant to Recessive) tOFFRXD 45 85 ns VDD = 3.3V, CL = 15pF, Figure 3 6
TXD-Dominant Timeout tDOM 1.3 4.3 ms Figure 4 6
Absolute Maximum VDD VDD -0.3 4 V 3
Absolute Maximum CANH or CANL (Continuous) CANH, CANL -40 40 V 3
Absolute Maximum TXD, STBY, SHDN -0.3 4 V 3
Absolute Maximum RXD RXD -0.3 4 V 3
Operating Temperature Range -40 125 °C 3
Junction Temperature TJ 150 °C 3
Storage Temperature Range -60 150 °C 3
Soldering Temperature (reflow) 260 °C 3
Lead Temperature (soldering, 10sec) 300 °C 3
Junction-to-Ambient Thermal Resistance (SOIC) θJA 136 °C/W Four-layer board 3
Junction-to-Case Thermal Resistance (SOIC) θJC 38 °C/W Four-layer board 3

CAD (KiCad official)

  • Symbol: MAX33041EASA+
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: max33041easa-etched.step / max33041easa-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max33041easa.step / max33041easa.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Maxim Integrated datasheet (19 pp, sha256 9398f13a085fdfc3, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF