component
MAX3281EAUT+T
Public Made by Adomby adom
Maxim Integrated Buffers / Drivers, SOT-23-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMAX3281EAUT+T
Maxim Integrated · Buffers / Drivers · SOT-23-6
MAX3281EAUT+T from Maxim Integrated, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Positive Supply: 3V ≤ VCC ≤ 5.5V; bypass with a 0.1µF capacitor to GND. |
| 2 | GND | power_in | Ground reference; all device voltages are referenced to GND. |
| 3 | RO | output | Receiver Output: RO is high if (VA - VB) ≥ -50mV and low if (VA - VB) ≤ -200mV. |
| 4 | B | input | Inverting Receiver Input; the common-mode input range is -7V to +12V. |
| 5 | EN | input | Receiver Output Enable (active high): drive EN high to enable RO; when EN is low, RO is high impedance. |
| 6 | A | input | Noninverting Receiver Input; the common-mode input range is -7V to +12V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Maxim Integrated |
| Package | SOT-23-6 |
| Category | Logic ICs |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 3 | 5.5 | V | 3 | ||
| Receiver Enable Input Low | VENIL | 0.4 | V | MAX3281E, MAX3283E only | 3 | ||
| Receiver Enable Input High | VENIH | 2 | V | MAX3281E, MAX3283E only | 3 | ||
| Receiver Enable Input Leakage | ILEAK | -10 | 10 | µA | MAX3281E, MAX3283E only | 3 | |
| Receiver Differential Threshold Voltage | VTH | -200 | -125 | -50 | mV | -7V ≤ VCM ≤ +12V (Note 4) | 3 |
| Receiver Output Low Voltage | VOL | 0.4 | V | IOL = 4mA, RO low | 3 | ||
| Three-State Output Current at Receiver | IOZR | -5 | 5 | µA | 0 ≤ VO ≤ VCC, RO = high impedance | 3 | |
| Receiver Input Resistance | RIN | 48 | kW | -7V ≤ VCM ≤ +12V (Note 5) | 3 | ||
| Receiver Output Short-Circuit Current | IOSR | -130 | 130 | mA | 0 ≤ VRO ≤ VCC | 3 | |
| Input Current (A and B) | IA, B | 250 | µA | VCC = VGND or 5.5V; VIN = +12V | 3 | ||
| Input Current (A and B) | IA, B | -200 | µA | VCC = VGND or 5.5V; VIN = -7V | 3 | ||
| Receiver Input Hysteresis | ∆VTH | 25 | mV | VA + VB = 0V | 3 | ||
| Supply Current | ICC | 9 | 15 | mA | No load | 3 | |
| ESD Protection Human Body Model (A, B) | -15 | 15 | kV | Human Body Model | 3 | ||
| ESD Protection IEC1000-4-2 Air-Gap Discharge (A, B) | -12 | 12 | kV | IEC1000-4-2 (Air-Gap Discharge) | 3 | ||
| ESD Protection IEC1000-4-2 Contact Discharge (A, B) | -6 | 6 | kV | IEC1000-4-2 (Contact Discharge) | 3 | ||
| Maximum Data Rate | fMAX | 52 | Mbps | CL = 15pF (Notes 5, 6) | 4 | ||
| Receiver Propagation Delay (tPLH) | tPLH | 7 | 15 | ns | Figure 1, CL = 15pF, VID = 2V, VCM = 0V | 4 | |
| Receiver Propagation Delay (tPHL) | tPHL | 8 | 15 | ns | Figure 1, CL = 15pF, VID = 2V, VCM = 0V | 4 | |
| Receiver Output /tPLH - tPHL/ (skew) | tPSKEW | 2 | ns | Figure 1, CL = 15pF, TA = +25°C | 4 | ||
| Device-to-Device Propagation Delay Matching | 8 | ns | Same power supply, maximum temperature difference between devices = +30°C (Note 5) | 4 | |||
| Receiver Enable to Output Low | tPRZL | 500 | ns | Figure 2, CL = 15pF | 4 | ||
| Receiver Enable to Output High | tPRZH | 500 | ns | Figure 2, CL = 15pF | 4 | ||
| Receiver Disable Time from Low | tPRLZ | 500 | ns | Figure 2, CL = 15pF | 4 | ||
| Receiver Disable Time from High | tPRHZ | 500 | ns | Figure 2, CL = 15pF | 4 | ||
| Supply Voltage (VCC) absolute maximum | VCC | -0.3 | 6 | V | 2 | ||
| Control Input Voltage (EN, EN) | -0.3 | 6 | V | 2 | |||
| Receiver Input Voltage (A, B) | -7.5 | 12.5 | V | 2 | |||
| Operating Temperature Range | -40 | 125 | °C | MAX328_EA__ | 2 | ||
| Storage Temperature Range | -65 | 150 | °C | 2 | |||
| Junction Temperature | 150 | °C | 2 | ||||
| Lead Temperature (soldering) | 300 | °C | soldering, 10s | 2 | |||
| Soldering Temperature (reflow) | 260 | °C | 2 | ||||
| Thermal Resistance, Single-Layer Board, Junction to Case | θJC | 80 | °C/W | 2 | |||
| Thermal Resistance, Multi-Layer Board, Junction to Ambient | θJA | 115 | °C/W | 2 | |||
| Thermal Resistance, Multi-Layer Board, Junction to Case | θJC | 80 | °C/W | 2 |
CAD (KiCad official)
- Symbol:
MAX3281EAUT+T - Footprint:
Package_TO_SOT_SMD:SOT-23-6 - 3D model: SOT-23-6 (KiCad packages3D, STEP)
- 3D model files:
max3281eaut-t-etched.step/max3281eaut-t-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);max3281eaut-t.step/max3281eaut-t.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Maxim Integrated datasheet (11 pp, sha256
ddcc0fd9510673c4, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).