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MAX3250EAI+T

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Maxim Integrated RS232 ICs, SSOP-28-208mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentcommunication interface chip-uart-485-232max3250eai+tfactory-2.0.0extractor-text

Verified MAX3250EAI+T

by Ray · last 30 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

30 Oct 2026RayPublished by the parts factory: tier mfr, 28 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: MAX3250EAI+T · SSOP-28-208mil · 28 pins
  • ✓copper: 28 copper pads, none touching another net
  • ✓datasheet: all 28 pin names found in the 10-page datasheet
  • ✓distributor: lcsc C2671045, digikey MAX3250EAI+TTR-ND, mouser 700-MAX3250EAIT
  • ✓family: SSOP-28_5.3x10.2mm_P0.65mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-uwckoavc/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 28 pins = 28 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 28 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ max3250eai-t.kicad_sym✓ max3250eai-t.kicad_mod✓ max3250eai-t.step
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MAX3250EAI+T

Maxim Integrated · RS232 ICs · SSOP-28-208mil

MAX3250EAI+T from Maxim Integrated, in a SSOP-28-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 C1- passive Negative terminal of the power isolation capacitor; connect a 100V capacitor from C1- to C1+.
2 R1OUT output TTL/CMOS receiver output; the receiver output is high impedance in shutdown.
3 R2OUT output TTL/CMOS receiver output; the receiver output is high impedance in shutdown.
4 T1IN input TTL/CMOS transmitter input; the transmitter input has no pullup, so unused inputs should be connected to VCC or GND.
5 T2IN input TTL/CMOS transmitter input; the transmitter input has no pullup, so unused inputs should be connected to VCC or GND.
6 N.C. unconnected No connection; not internally connected.
7 N.C. unconnected No connection; leave unconnected or connect to ISOCOM.
8 C1+ passive Positive terminal of the power isolation capacitor; connect a 100V capacitor from C1+ to C1-.
9 C3+ passive Positive terminal of the voltage-doubler charge-pump capacitor; connect a 0.1µF capacitor from C3+ to C3-.
10 V+ power_out +5.5V generated by the charge pump, referenced to ISOCOM; bypass V+ to ISOCOM with a 0.47µF capacitor.
11 C3- passive Negative terminal of the voltage-doubler charge-pump capacitor; connect a 0.1µF capacitor from C3- to C3+.
12 C4+ passive Positive terminal of the inverting charge-pump capacitor; connect a 0.47µF capacitor from C4+ to C4-.
13 C4- passive Negative terminal of the inverting charge-pump capacitor; connect a 0.47µF capacitor from C4- to C4+.
14 V- power_out -5.5V generated by the charge pump, referenced to ISOCOM; bypass V- to ISOCOM with a 0.47µF capacitor.
15 ISOCOM power_in Isolated ground; the difference between GND and ISOCOM can be up to 50V, with an absolute maximum of ±80V on ISOCOM.
16 T2OUT output RS-232 transmitter output; can be driven up to ±12V relative to ISOCOM when powered off or shut down.
17 T1OUT output RS-232 transmitter output; can be driven up to ±12V relative to ISOCOM when powered off or shut down.
18 R2IN input RS-232 receiver input with a ±25V input-voltage range relative to ISOCOM.
19 R1IN input RS-232 receiver input with a ±25V input-voltage range relative to ISOCOM.
20 ISOVCC power_out Internally generated isolated power-supply voltage referenced to ISOCOM; bypass ISOVCC to ISOCOM with a 2.2µF capacitor.
21 C2+ passive Positive terminal of the power isolation capacitor; connect a 100V capacitor from C2+ to C2-.
22 N.C. unconnected No connection; not internally connected.
23 N.C. unconnected No connection; not internally connected.
24 SHDN input Shutdown control; drive low to enter low-power shutdown mode, and drive high or connect to VCC for normal operation.
25 FAULT output Overvoltage indicator; active low, open drain, signals excessive isolated-side voltage.
26 GND power_in Ground, the logic-side reference for the device.
27 C2- passive Negative terminal of the power isolation capacitor; connect a 100V capacitor from C2- to C2+.
28 VCC power_in 3.0V to 5.5V supply voltage; bypass VCC to GND with a 1µF capacitor.

Key specifications

Parameter Value
Manufacturer Maxim Integrated
Package SSOP-28-208mil
Category Communication Interface Chip/UART/485/232
Pins 28

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC VCC -0.3 6 V 2
ISOCOM voltage ISOCOM -80 80 V 2
ISOVCC to ISOCOM ISOVCC -0.3 6 V 2
V+ to ISOCOM V+ -0.3 7 V Note 1 2
V- to ISOCOM V- -7 0.3 V Note 1 2
V+ + /V-/ V+ + /V-/ 13 V Note 1 2
Input voltage T_IN, SHDN T_IN, SHDN -0.3 6 V 2
Input voltage R_IN to ISOCOM R_IN -25 25 V to ISOCOM 2
Output voltage T_OUT to ISOCOM T_OUT -13.2 13.2 V to ISOCOM 2
FAULT output voltage FAULT -0.3 6 V 2
T_OUT current continuous T_OUT 30 mA continuous 2
T_OUT current peak T_OUT 50 mA peak, 10µs 2
R_IN current continuous R_IN 30 mA continuous 2
R_IN current peak R_IN 50 mA peak, 10µs 2
ISOCOM current continuous ISOCOM 30 mA continuous 2
ISOCOM current peak ISOCOM 50 mA peak, 10µs 2
Operating temperature MAX3250EAI -40 85 °C MAX3250EAI 2
Storage temperature range -65 150 °C 2
Lead temperature soldering 300 °C soldering, 10s 2
Soldering temperature reflow 260 °C reflow 2
Supply voltage VCC VCC 3 5.5 V 5
Supply current 15 35 mA SHDN = VCC, no load 3
Supply current shutdown -350 350 µA SHDN = GND, VISOCOM = ±50V 3
Maximum ground differential /VGND - VISOCOM/ 50 V 3
Isolation resistance between GND and ISOCOM 60 kΩ between GND and ISOCOM 3
Input logic low T_IN, SHDN 0.8 V 3
Input logic high T_IN, SHDN 2 V VCC = 3.3V 3
Input logic high T_IN, SHDN 2.4 V VCC = 5.0V 3
Transmitter input hysteresis 0.5 V 3
Output-voltage low 0.4 V IOUT = 1.6mA 3
FAULT output-voltage low (open drain) 0.4 V IOUT = 5mA 3
FAULT output leakage current 1 µA FAULT not asserted 3
Receiver input-voltage range -25 25 V relative to ISOCOM 3
Receiver input threshold low 0.6 1.2 V VCC = 3.3V, TA = +25°C 3
Receiver input threshold low 0.8 1.3 V VCC = 5.0V, TA = +25°C 3
Receiver input threshold high 1.6 2.4 V VCC = 3.3V, TA = +25°C 3
Receiver input threshold high 1.7 2.4 V VCC = 5.0V, TA = +25°C 3
Receiver input hysteresis 0.5 V 3
Receiver input resistance 3 5 7 kΩ TA = +25°C 3
Transmitter output-voltage swing -5 5.4 V all transmitter outputs loaded with 3kΩ to ISOCOM, TA = +25°C 3
Transmitter output resistance 300 Ω ISOVCC = V+ = V- = 0V, VT_OUT = ±2V 3
Transmitter output resistance 10 MΩ ISOVCC = V+ = V- = 0V, VT_OUT = ±2V 3
Transmitter output short-circuit current -60 60 mA 3
Transmitter output leakage current -25 25 µA VCC = 0 or 3V to 5.5V, VT_OUT = ±12V, SHDN = GND 3
Maximum data rate 250 kbps RL = 3kΩ, CL = 1000pF to ISOCOM, one transmitter, TA = +25°C 3
Receiver propagation delay 0.4 µs R_IN to R_OUT, CL = 150pF to GND 3
Receiver skew /tPHL - tPLH/ 100 ns 3
Transmitter skew /tPHL - tPLH/ 120 ns Note 3 3
Transition-region slew rate 6 30 V/µs CL = 150pF to 1000pF to ISOCOM, VCC = 3.3V, TA = +25°C, RL = 3kΩ to 7kΩ to ISOCOM 3
Transition-region slew rate 4 30 V/µs CL = 150pF to 2500pF to ISOCOM, VCC = 3.3V, TA = +25°C, RL = 3kΩ to 7kΩ to ISOCOM 3
FAULT propagation delay 0.3 µs 3
Time to shutdown 0.5 µs 3
Time to exit shutdown 300 µs VISOCOM = GND 3
Time to exit shutdown 350 µs VISOCOM = ±50V 3

CAD (KiCad official)

  • Symbol: MAX3250EAI+T
  • Footprint: Package_SO:SSOP-28_5.3x10.2mm_P0.65mm
  • 3D model: SSOP-28-208mil (KiCad packages3D, STEP)
  • 3D model files: max3250eai-t-etched.step / max3250eai-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max3250eai-t.step / max3250eai-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Maxim Integrated datasheet (10 pp, sha256 08a2b9f8f2d555c0, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF