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MAX3237EIDBR

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Texas Instruments Pre-ordered Chips, SSOP-28-208mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MAX3237EIDBR

Texas Instruments · Pre-ordered Chips · SSOP-28-208mil

MAX3237EIDBR from Texas Instruments, in a SSOP-28-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 C2+ passive Positive terminal of charge-pump capacitor C2 (0.1 µF typical at VCC = 3 V to 5.5 V).
2 GND power_in Ground; ESD protected to ±15 kV HBM pin to pin.
3 C2− passive Negative terminal of charge-pump capacitor C2.
4 V− power_out Negative charge-pump output supply, filtered by capacitor C4; raised toward GND in shutdown.
5 DOUT1 output RS-232 driver 1 output, high-impedance in shutdown, ±15 kV HBM ESD protected.
6 DOUT2 output RS-232 driver 2 output, high-impedance in shutdown, ±15 kV HBM ESD protected.
7 DOUT3 output RS-232 driver 3 output, high-impedance in shutdown, ±15 kV HBM ESD protected.
8 RIN1 input RS-232 receiver 1 input with 5 kΩ nominal input resistance, ±25 V input range.
9 RIN2 input RS-232 receiver 2 input with 5 kΩ nominal input resistance, ±25 V input range.
10 DOUT4 output RS-232 driver 4 output, high-impedance in shutdown, ±15 kV HBM ESD protected.
11 RIN3 input RS-232 receiver 3 input with 5 kΩ nominal input resistance, ±25 V input range.
12 DOUT5 output RS-232 driver 5 output, high-impedance in shutdown, ±15 kV HBM ESD protected.
13 EN input Receiver enable; high places ROUT1-ROUT3 in high-impedance state, low enables them (ROUT1B always active).
14 SHDN input Shutdown control; low (GND) disables drivers and charge pump, supply current falls to under 1 µA typical range.
15 MBAUD input Data-rate select; GND gives 250 kbit/s normal mode, VCC gives 1 Mbit/s.
16 ROUT1B output Receiver 1 output that remains active regardless of EN and SHDN state.
17 DIN5 input Driver 5 logic input; VIL max 0.8 V, accepts up to 5.5 V.
18 ROUT3 output Receiver 3 logic output, high-impedance when EN is high.
19 DIN4 input Driver 4 logic input; VIL max 0.8 V, accepts up to 5.5 V.
20 ROUT2 output Receiver 2 logic output, high-impedance when EN is high.
21 ROUT1 output Receiver 1 logic output, high-impedance when EN is high.
22 DIN3 input Driver 3 logic input; VIL max 0.8 V, accepts up to 5.5 V.
23 DIN2 input Driver 2 logic input; VIL max 0.8 V, accepts up to 5.5 V.
24 DIN1 input Driver 1 logic input; VIL max 0.8 V, accepts up to 5.5 V.
25 C1− passive Negative terminal of charge-pump capacitor C1.
26 VCC power_in Supply voltage, 3 V to 5.5 V, bypassed with 0.1 µF.
27 V+ power_out Positive charge-pump output supply, filtered by capacitor C3; lowered to VCC in shutdown.
28 C1+ passive Positive terminal of charge-pump capacitor C1.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SSOP-28-208mil
Category Interface ICs
Pins 28

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage, VCC = 3.3 V VCC 3 3.3 3.6 V VCC = 3.3 V 4
Supply voltage, VCC = 5 V VCC 4.5 5 5.5 V VCC = 5 V 4
Driver and control high-level input voltage (DIN, SHDN, MBAUD, EN) VIH 2 5.5 V VCC = 3.3 V 4
Driver and control high-level input voltage (DIN, SHDN, MBAUD, EN) VIH 2.4 5.5 V VCC = 5 V 4
Driver and control low-level input voltage (DIN, SHDN, MBAUD, EN) VIL 0 0.8 V 4
Receiver input voltage VI -25 25 V 4
Operating free-air temperature, MAX3237EI TA -40 85 °C MAX3237EI 4
Supply voltage range VCC VCC -0.3 6 V 4
Positive-output supply voltage range V+ -0.3 7 V 4
Negative-output supply voltage range V- -7 0.3 V 4
Supply voltage difference V+, V- V+ - V- 13 V 4
Driver input voltage range (SHDN, MBAUD, EN) VI -0.3 6 V Driver 4
Receiver input voltage range VI -25 25 V Receiver 4
Driver output voltage range VO -13.2 13.2 V Driver 4
Receiver output voltage range VO -0.3 V Receiver; upper limit printed as VCC + 0.3 4
Storage temperature range Tstg -65 150 °C 4
Package thermal impedance θJA 62 °C/W JESD 51-7 4
Supply current, no load, SHDN = VCC ICC 0.5 2 mA No load, SHDN = VCC 4
Supply current, SHDN = GND ICC 1 10 mA SHDN = GND 4
Shutdown supply current ICC 10 300 nA TA = 25°C; SHDN = RIN = GND, DIN = GND or VCC 4
High-level output voltage VOH 5 5.4 V DOUT at RL = 3 kΩ to GND, DIN = GND 5
Low-level output voltage VOL -5 -5.4 V DOUT at RL = 3 kΩ to GND, DIN = VCC 5
High-level input current IIH -1 0.01 1 mA VI = VCC 5
Low-level input current IIL -1 0.01 1 mA VI at GND 5
Short-circuit output current IOS -60 60 mA VCC = 3.6 V or 3.3 V, VO = 0 V 5
Output resistance (minimum) ro 300 Ω VCC, V+, and V- = 0 V, VO = ±2 V 5
Output resistance (maximum) ro 50 kΩ VCC, V+, and V- = 0 V, VO = ±2 V 5
Maximum data rate 250 kbit/s CL = 1000 pF, MBAUD = GND 5
Maximum data rate 1000 kbit/s CL = 1000 pF, VCC = 4.5 V to 5.5 V, RL = 3 kΩ, 1 DIN switching, MBAUD = VCC 5
Pulse skew tsk(p) 100 ns CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, MBAUD = VCC or GND 5
Driver slew rate transition region SR(tr) 6 30 V/ms MBAUD = GND, VCC = 3.3 V, CL = 150 pF to 1000 pF, RL = 3 kΩ to 7 kΩ 5
Driver slew rate transition region SR(tr) 4 30 V/ms MBAUD = GND, CL = 150 pF to 2500 pF, TA = 25°C 5
Driver slew rate transition region SR(tr) 24 150 V/ms MBAUD = VCC, RL = 3 kΩ to 7 kΩ 5
Low-level output voltage (receiver) VOL 0.4 V IOL = 1 mA 6
Positive-going input threshold voltage, VCC = 3.3 V VIT+ 1.5 2.4 V VCC = 3.3 V 6
Positive-going input threshold voltage, VCC = 5 V VIT+ 2 2.4 V VCC = 5 V 6
Negative-going input threshold voltage, VCC = 3.3 V VIT- 0.6 1.1 V VCC = 3.3 V 6
Negative-going input threshold voltage, VCC = 5 V VIT- 0.8 1.5 V VCC = 5 V 6
Output leakage current Ioz -10 0.05 10 mA EN = VCC 6
Input resistance ri 3 5 7 kΩ VI = ±3 V to ±25 V 6

CAD (KiCad official)

  • Symbol: MAX3237EIDBR
  • Footprint: Package_SO:SSOP-28_5.3x10.2mm_P0.65mm
  • 3D model: SSOP-28-208mil (KiCad packages3D, STEP)
  • 3D model files: max3237eidbr-etched.step / max3237eidbr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max3237eidbr.step / max3237eidbr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (21 pp, sha256 255f733e034a131a, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF