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MAX3232ESE-TD

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TDSEMIC RS232 ICs, SOP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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MAX3232ESE-TD

TDSEMIC · RS232 ICs · SOP-16

MAX3232ESE-TD from TDSEMIC, in a SOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 C1+ passive Positive terminal of the charge-pump capacitor C1 (1.0µF external).
2 V+ power_out Positive voltage generated by the charge pump, with a 1.0µF capacitor to VCC and an absolute maximum of 9.8V.
3 C1- passive Negative terminal of the charge-pump capacitor C1 (1.0µF external).
4 C2+ passive Positive terminal of the charge-pump capacitor C2 (1.0µF external).
5 C2- passive Negative terminal of the charge-pump capacitor C2 (1.0µF external).
6 V- power_out Negative voltage generated by the charge pump, with a 1.0µF capacitor to ground and an absolute minimum of -9.0V.
7 T2OUT output RS-232 driver 2 output at RS-232 levels.
8 R2IN input RS-232 receiver 2 input at RS-232 levels, with an internal 5K pulldown and an input range of -30V to 30V.
9 R2OUT output RS-232 receiver 2 output at TTL/CMOS levels.
10 T2IN input RS-232 driver 2 input at TTL/CMOS levels.
11 T1IN input RS-232 driver 1 input at TTL/CMOS levels.
12 R1OUT output RS-232 receiver 1 output at TTL/CMOS levels.
13 R1IN input RS-232 receiver 1 input at RS-232 levels, with an internal 5K pulldown and an input range of -30V to 30V.
14 T1OUT output RS-232 driver 1 output at RS-232 levels.
15 GND power_in Ground.
16 VCC power_in Supply voltage input, recommended 3.0V to 5.5V (absolute maximum 6.0V), with a 1.0µF decoupling capacitor.

Key specifications

Parameter Value
Manufacturer TDSEMIC
Package SOP-16
Category Interface
Pins 16

CAD (KiCad official)

  • Symbol: MAX3232ESE-TD
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOP-16 (KiCad packages3D, STEP)
  • 3D model files: max3232ese-td-etched.step / max3232ese-td-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max3232ese-td.step / max3232ese-td.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TDSEMIC datasheet (8 pp, sha256 2fbfa6231c01b8b4, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF