component
MAX3109ETJ+
Public Made by Adomby adom
Maxim Integrated UART, TQFN-32-EP(5x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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| max3109etj-etched.step | 12d ago |
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MAX3109ETJ+
Maxim Integrated · UART · TQFN-32-EP(5x5)
MAX3109ETJ+ from Maxim Integrated, in a TQFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RST | input | Active-low reset input that forces all UARTs into hardware reset and enables low-power shutdown when driven low, and it switches off the internal V18 LDO even if LDOEN is high. |
| 2 | MISO/SDA | bidirectional | Serial-data pin that acts as SPI MISO output when SPI/I2C is high and as the I2C SDA data line when SPI/I2C is low, and it is high impedance when RST is low or V18 is powered off. |
| 3 | SCLK/SCL | input | Serial-clock input that accepts SPI SCLK up to 26MHz when SPI/I2C is high and I2C SCL up to 1MHz in fast mode plus when SPI/I2C is low. |
| 4 | GPIO7 | bidirectional | User-programmable general-purpose I/O that can be push-pull or open drain and has a weak pulldown to DGND when configured as an input. |
| 5 | CS/A0 | input | Active-low SPI chip select when SPI/I2C is high, or the A0 I2C address programming input when SPI/I2C is low, which must be connected to DGND, VL, SCL, or SDA in I2C mode. |
| 6 | MOSI/A1 | input | SPI master-output slave-input when SPI/I2C is high, or the A1 I2C address programming input when SPI/I2C is low, which must be connected to DGND, VL, SCL, or SDA in I2C mode. |
| 7 | IRQ | output | Active-low interrupt open-drain output that is asserted when an interrupt is pending and is high impedance when RST is driven low. |
| 8 | VL | power_in | Digital interface supply that powers the logic-level translators for RST, IRQ, MOSI/A1, CS/A0, SCLK/SCL, MISO/SDA, LDOEN, and SPI/I2C, and should be bypassed with a 0.1µF ceramic capacitor to DGND. |
| 9 | SPI/I2C | input | Interface selector where driving the pin high enables SPI and driving it low enables I2C. |
| 10 | DGND | power_in | Digital ground reference for the device. |
| 11 | GPIO0 | bidirectional | User-programmable general-purpose I/O with a weak pulldown to DGND when input, and it outputs the reference clock when bit 7 of the TxSynch register is set high. |
| 12 | GPIO4 | bidirectional | User-programmable general-purpose I/O with a weak pulldown to DGND when input, and it outputs the reference clock when bit 7 of the TxSynch register is set high. |
| 13 | GPIO1 | bidirectional | User-programmable general-purpose I/O with a weak pulldown to DGND when input, and it outputs the TIMER signal when bit 7 of the TIMER2 register is set high. |
| 14 | GPIO5 | bidirectional | User-programmable general-purpose I/O with a weak pulldown to DGND when input, and it outputs the TIMER signal when bit 7 of the TIMER2 register is set high. |
| 15 | CTS0 | input | Active-low clear-to-send flow-control status input for UART0. |
| 16 | CTS1 | input | Active-low clear-to-send flow-control status input for UART1. |
| 17 | TX1 | output | Serial transmit data output for UART1 that is logic-high when RST is low or when the externally supplied V18 is not powered. |
| 18 | TX0 | output | Serial transmit data output for UART0 that is logic-high when RST is low or when the externally supplied V18 is not powered. |
| 19 | RX0 | input | Serial receive data input for UART0 with an internal weak pullup resistor to VEXT. |
| 20 | RX1 | input | Serial receive data input for UART1 with an internal weak pullup resistor to VEXT. |
| 21 | RTS0 | output | Active-low request-to-send output for UART0 that can be set high or low through the LCR register and is logic-high when RST is low or V18 is not powered. |
| 22 | RTS1 | output | Active-low request-to-send output for UART1 that can be set high or low through the LCR register and is logic-high when RST is low or V18 is not powered. |
| 23 | GPIO2 | bidirectional | User-programmable general-purpose I/O that can be push-pull or open drain and has a weak pulldown to DGND when configured as an input. |
| 24 | GPIO3 | bidirectional | User-programmable general-purpose I/O that can be push-pull or open drain and has a weak pulldown to DGND when configured as an input. |
| 25 | VEXT | power_in | Transceiver interface supply that powers the logic-level translators for RX_, TX_, RTS_, CTS_, and GPIO_, and should be bypassed with a 0.1µF ceramic capacitor to DGND. |
| 26 | XIN | input | Crystal or clock input where a crystal connects between XIN and XOUT, or an external single-ended clock is driven. |
| 27 | XOUT | passive | Crystal output that connects to the other end of the crystal from XIN, and must be left unconnected when an external clock source is used. |
| 28 | GPIO6 | bidirectional | User-programmable general-purpose I/O that can be push-pull or open drain and has a weak pulldown to DGND when configured as an input. |
| 29 | AGND | power_in | Analog ground reference for the device that the exposed pad must be connected to. |
| 30 | LDOEN | input | LDO enable input where driving it high enables the internal 1.8V LDO and driving it low disables it, requiring an external V18 supply. |
| 31 | V18 | power_in | Internal 1.8V LDO output and 1.8V power-supply input that should be bypassed with a 1µF ceramic capacitor to DGND. |
| 32 | VCC | power_in | Analog supply that powers the PLL and internal LDO, specified at 1.71V to 3.6V with the PLL bypassed and 2.35V to 3.6V with the PLL enabled, and should be bypassed with a 0.1µF ceramic capacitor to AGND. |
| 33 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Maxim Integrated |
| Package | TQFN-32-EP(5x5) |
| Category | Interface ICs |
| Pins | 33 |
CAD (KiCad official)
- Symbol:
MAX3109ETJ+ - Footprint:
Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm - 3D model: TQFN-32-EP(5x5) (KiCad packages3D, STEP)
- 3D model files:
max3109etj-etched.step/max3109etj-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);max3109etj.step/max3109etj.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Maxim Integrated datasheet (66 pp, sha256
2a6e460cb0dda736, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).