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MAX3080EESD+

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Maxim Integrated Pre-ordered Chips, SOIC-14. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentinterface icsmax3080eesd+factory-2.0.0extractor-text

Verified MAX3080EESD+

by Ray · last 30 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

30 Oct 2026RayPublished by the parts factory: tier mfr, 14 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: MAX3080EESD+ · SOIC-14 · 14 pins
  • ✓copper: 14 copper pads, none touching another net
  • ✓datasheet: all 14 pin names found in the 20-page datasheet
  • ✓distributor: lcsc C1543798, digikey MAX3080EESD+-ND, mouser 700-MAX3080EESD
  • ✓family: SOIC-14_3.9x8.7mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-s2kvmhue/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 14 pins = 14 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 14 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ max3080eesd.kicad_sym✓ max3080eesd.kicad_mod✓ max3080eesd.step
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Ray Publish 0.1.0 3c47aa6 10d ago

MAX3080EESD+

Maxim Integrated · Pre-ordered Chips · SOIC-14

MAX3080EESD+ from Maxim Integrated, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 N.C. unconnected Not internally connected.
2 RO output Receiver output: when RE is low, RO is high if A - B ≥ -50mV and low if A - B ≤ -200mV.
3 RE input Receiver output enable: drive RE low to enable RO; RO is high impedance when RE is high, and driving RE high with DE low enters low-power shutdown.
4 DE input Driver output enable: drive DE high to enable the driver outputs; the outputs are high impedance when DE is low.
5 DI input Driver input: with DE high, a low on DI forces the noninverting output low and the inverting output high, and a high on DI forces the noninverting output high and the inverting output low.
6 GND power_in Ground.
7 GND power_in Ground.
8 N.C. unconnected Not internally connected.
9 Y output Noninverting driver output.
10 Z output Inverting driver output.
11 B input Inverting receiver input.
12 A input Noninverting receiver input.
13 N.C. unconnected Not internally connected.
14 VCC power_in Positive supply; 4.75V ≤ VCC ≤ 5.25V.

Key specifications

Parameter Value
Manufacturer Maxim Integrated
Package SOIC-14
Category Interface ICs
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Differential driver output, RS-422 load VOD2 2 V Figure 5, R = 50Ω (RS-422) 2
Differential driver output, RS-485 load VOD2 1.5 V Figure 5, R = 27Ω (RS-485) 2
Change in magnitude of differential output voltage ΔVOD 0.2 V Figure 5, R = 50Ω or R = 27Ω (Note 2) 2
Driver common-mode output voltage VOC 3 V Figure 5, R = 50Ω or R = 27Ω 2
Change in magnitude of common-mode voltage ΔVOC 0.2 V Figure 5, R = 50Ω or R = 27Ω (Note 2) 2
Input high voltage VIH1 2 V DE, DI, RE 2
Input low voltage VIL1 0.8 V DE, DI, RE 2
ESD protection, Y, Z, A, B (Human Body Model) -15 15 kV Human Body Model 3
Receiver output low voltage VOL 0.4 V IO = 4mA, VID = -200mV 3
Receiver differential threshold voltage VTH -200 -125 -50 mV -7V ≤ VCM ≤ 12V 3
Three-state output current at receiver IOZR -1 1 µA DE = GND, VRE = VCC 3
Supply current in shutdown mode ISHDN 0.001 10 µA 3
Driver disable time from low tDLZ 100 ns Figures 8 and 10, CL = 15pF, S1 closed 4
Driver disable time from high tDHZ 100 ns Figures 8 and 10, CL = 15pF, S2 closed 4
Driver enable to output low tDZL 3500 ns Figures 8 and 10, CL = 100pF, S1 closed 4
Driver enable to output high tDZH 3500 ns Figures 8 and 10, CL = 100pF, S2 closed 4
Maximum data rate fMAX 115 kbps SRL unconnected 4
Receiver enable to output low tRZL 20 50 ns Figures 6 and 12, CL = 100pF, S1 closed 4
Receiver enable to output high tRZH 20 50 ns Figures 6 and 12, CL = 100pF, S2 closed 4
Receiver disable time from low tRLZ 20 50 ns Figures 6 and 12, CL = 100pF, S1 closed 4
Receiver disable time from high tRHZ 20 50 ns Figures 6 and 12, CL = 100pF, S2 closed 4
Receiver input to output tRPLH, tRPHL 127 200 ns Figures 11 and 13; /VID/ ≥ 2.0V; rise and fall time of VID ≤ 15ns 4
Differential receiver skew tRSKD -30 3 30 ns Figures 11 and 13; /VID/ ≥ 2.0V; rise and fall time of VID ≤ 15ns 4
Driver input-to-output tDPLH 500 2030 2600 ns Figures 7 and 9, RDIFF = 54Ω, CL1 = CL2 = 100pF 4
Driver output skew tDSKEW -200 -3 200 ns Figures 7 and 9, RDIFF = 54Ω, CL1 = CL2 = 100pF 4
Driver rise or fall time tDR, tDF 667 1320 2500 ns Figures 7 and 9, RDIFF = 54Ω, CL1 = CL2 = 100pF 4
Time to shutdown tSHDN 50 200 600 ns Note 5 4
Driver enable from shutdown to output high tDZH(SHDN) 6000 ns 4
Driver enable from shutdown to output low tDZL(SHDN) 6000 ns 4
Receiver enable from shutdown to output high tRZH(SHDN) 3500 ns 4
Receiver enable from shutdown to output low tRZL(SHDN) 3500 ns 4
Supply voltage VCC tolerance VCC -5 5 % VCC = +5V ±5% 2
Operating temperature range (MAX308_EE__, includes MAX3080EESD) TA -40 85 °C MAX308_EE__ 2
Supply voltage VCC 7 V 2
Control input voltage (RE, DE) -0.3 V Maximum is VCC + 0.3V 2
Special input voltage (H/F, SRL, TXP, RXP) -0.3 V Maximum is VCC + 0.3V 2
Driver input voltage (DI) -0.3 V Maximum is VCC + 0.3V 2
Driver output voltage (A, B, Y, Z) -13 13 V 2
Receiver input voltage (A, B) -13 13 V 2
Receiver input voltage, full duplex (A, B) -25 25 V Full duplex 2
Receiver output voltage (RO) -0.3 V Maximum is VCC + 0.3V 2
Storage temperature range TSTG -65 150 °C 2
Lead temperature 300 °C Soldering, 10s 2

CAD (KiCad official)

  • Symbol: MAX3080EESD+
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: max3080eesd-etched.step / max3080eesd-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max3080eesd.step / max3080eesd.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Maxim Integrated datasheet (20 pp, sha256 90c2a02156880f64, retrieved 2026-10-30, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF