component
MAX3072EIM
Public Made by Adomby adom
HGSEMI RS-485 / RS-422 ICs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMAX3072EIM
HGSEMI · RS-485 / RS-422 ICs · SOIC-8
MAX3072EIM from HGSEMI, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RO | output | Receiver output: when RE is low, RO is high if A-B is at least -50mV and low if A-B is at most -200mV, with failsafe high when inputs are open or shorted. |
| 2 | RE | input | Receiver output enable: RO is enabled when RE is low and high-impedance when RE is high; RE high with DE low puts the device into low-power shutdown, and RE has a hot-plug input structure. |
| 3 | DE | input | Driver output enable: the driver outputs are enabled when DE is high and high-impedance when DE is low; DE high with RE high puts the device into low-power shutdown, and DE has a hot-plug input structure. |
| 4 | DI | input | Driver input: when DE is high, a low on DI drives A/Y low and B/Z high, and a high on DI drives A/Y high and B/Z low. |
| 5 | GND | power_in | Ground reference for the device. |
| 6 | A | bidirectional | Receiver non-inverting input and driver non-inverting output (A/Y) on the RS-485 bus, rated for ±16kV IEC 61000-4-2 ESD protection. |
| 7 | B | bidirectional | Receiver inverting input and driver inverting output (B/Z) on the RS-485 bus, rated for ±16kV IEC 61000-4-2 ESD protection. |
| 8 | VCC | power_in | Positive supply: 3.15V ≤ VCC ≤ 3.45V; connect a 0.1µF capacitor to ground. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOIC-8 |
| Category | Interface |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC | 6 | V | 3 | |||
| Control input voltage (RE, DE) | RE, DE | -0.3 | 6 | V | 3 | ||
| Driver input voltage | DI | -0.3 | 6 | V | 3 | ||
| Driver output voltage | A, B, Y, Z | -7 | 12 | V | 3 | ||
| Receiver input voltage | A, B | -7 | 12 | V | 3 | ||
| Continuous power dissipation, 8SO package | 500 | mW | TA=+70°C | 3 | |||
| Operating temperature range, industrial grade (MAX307_I_) | -40 | 85 | °C | MAX307_I_ | 3 | ||
| Storage temperature | -65 | 150 | °C | 3 | |||
| Lead temperature (soldering 10 s) | TLEAD | 260 | °C | Soldering 10 s | 3 | ||
| Supply voltage | VCC | 3.15 | 3.45 | V | 3 | ||
| Differential driver output voltage, RS-422 | VOD | 2 | V | Fig.1, RL=100Ω (RS-422) | 3 | ||
| Differential driver output voltage, RS-485 | VOD | 1.5 | V | Fig.1, RL=54Ω (RS-485) | 3 | ||
| Change in magnitude of differential driver output voltage | ΔVOD | 0.2 | V | Fig.1, RL=100Ω or RL=54Ω | 3 | ||
| Driver common-mode output voltage | VOC | 3 | V | Fig.1, RL=100Ω or RL=54Ω | 3 | ||
| Change in magnitude of common-mode output voltage | ΔVOC | 0.2 | V | Fig.1, RL=100Ω or RL=54Ω | 3 | ||
| Input high voltage | VIH | 2 | V | DE, DI, RE | 4 | ||
| Input low voltage | VIL | 0.8 | V | DE, DI, RE | 4 | ||
| Input current | IIN | -1 | 1 | μA | DE, DI, RE | 4 | |
| Input current (A, B), full duplex label | IA, IB | 125 | μA | DE=GND, VCC=GND or VCC, VIN=12V | 4 | ||
| Input current (A, B), full duplex label | IA, IB | -75 | μA | DE=GND, VCC=GND or VCC, VIN=-7V | 4 | ||
| Output leakage current (Y, Z), full duplex label | IO | 125 | μA | DE=GND, VCC=GND or VCC, VIN=12V | 4 | ||
| Output leakage current (Y, Z), full duplex label | IO | -100 | μA | DE=GND, VCC=GND or VCC, VIN=-7V | 4 | ||
| Driver short-circuit output current | IOSD | 250 | mA | 0≤VOUT≤12V | 4 | ||
| Driver short-circuit output current | IOSD | -250 | mA | -7≤VOUT≤VCC | 4 | ||
| Driver short-circuit foldback output current | IOSDF | 20 | mA | Vcc-1V≤VOUT≤Vcc+0.3.3V (as printed) | 4 | ||
| Driver short-circuit foldback output current | IOSDF | -20 | mA | -0.3.3V≤VOUT≤+1V (as printed) | 4 | ||
| Receiver differential threshold voltage | VTH | -200 | 200 | mV | -7V≤VCM≤12V | 4 | |
| Receiver output low voltage | VOL | 0.4 | V | IO=4mA, VID=-200mV | 4 | ||
| Receiver tri-state output current | IOZR | -1 | 1 | μA | 0≤VO≤VCC | 4 | |
| Receiver output short-circuit current (printed ±7 / ±95 magnitude range) | IOSR | 7 | 95 | mA | 0V≤VRO≤VCC | 4 | |
| Supply current, no load | Icc | 400 | 900 | μA | RE=VCC, DI=GND or VCC, DE=VCC | 4 | |
| Supply current, no load | Icc | 330 | 600 | μA | RE=VCC, DI=GND or VCC, DE=GND | 4 | |
| Supply current, no load | Icc | 400 | 1000 | μA | RE=GND, DI=GND or VCC, DE=VCC | 4 | |
| Supply current, no load | Icc | 330 | 800 | μA | RE=GND, DI=GND or VCC, DE=GND | 4 | |
| Standby mode supply current | ISHDN | 0.05 | 10 | μA | DE=GND, RE=VCC | 4 | |
| ESD, IEC61000-4-2 air-gap discharge, RS-485 pins | -16 | 16 | kV | IEC61000-4-2 air-gap discharge | 4 | ||
| ESD, IEC61000-4-2 contact discharge, half-duplex | -16 | 16 | kV | IEC61000-4-2 contact discharge, half-duplex | 4 | ||
| ESD, HBM, pin to GND | -16 | 16 | kV | HBM, pin to GND | 4 | ||
| Driver propagation delay, tDPLH | tDPLH | 500 | 2600 | ns | Fig.2 and 5, RL=54Ω, CL=50pF | 5 | |
| Driver propagation delay, tDPHL | tDPHL | 500 | 2600 | ns | Fig.2 and 5, RL=54Ω, CL=50pF | 5 | |
| Driver output skew | /tDPLH-tDPHL/, tDSKEW | -200 | 200 | ns | Fig.2 and 5, RL=54Ω, CL=50pF | 5 | |
| Driver rise and fall time | tDR, tDF | 650 | 2500 | ns | Fig.2 and 5, RL=54Ω, CL=50pF | 5 | |
| Maximum data rate, driver (115 kbps part) | fMAX | 115 | kbps | 5 | |||
| Driver enable to output high | tDZH | 3500 | ns | Fig.3 and 6, CL=100pF, S3 closed | 5 | ||
| Driver enable to output low | tDZL | 3500 | ns | Fig.3 and 6, CL=100pF, S2 closed | 5 | ||
| Driver output low to disable time | tDLZ | 100 | ns | Fig.3 and 6, CL=15pF, S2 closed | 5 | ||
| Driver output high to disable time | tDHZ | 100 | ns | Fig.3 and 6, CL=15pF, S3 closed | 5 | ||
| Driver enable from standby to output high | tDZH(SHDN) | 5500 | ns | Fig.3 and 6, CL=15pF, S3 closed | 5 | ||
| Driver enable from standby to output low | tDZL(SHDN) | 5500 | ns | Fig.3 and 6, CL=15pF, S2 closed | 5 | ||
| Standby time, driver | tSHDN | 50 | 350 | 700 | ns | Note 4 | 5 |
| Receiver propagation delay | tRPLH, tRPHL | 200 | ns | Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns | 5 | ||
| Receiver output skew | tRSKEW | -30 | 30 | ns | Fig.7 and 8, CL=15pF, /VID/≥2.0V, VID≤15ns | 5 | |
| Maximum data rate, receiver (115 kbps part) | fMAX | 115 | kbps | 5 | |||
| Receiver enable to output low | tRZL | 50 | ns | Fig.4 and 9, S1=-1.3.3V (as printed), S2 to VCC | 5 | ||
| Receiver enable to output high | tRZH | 50 | ns | Fig.4 and 9, S1=+1.3.3V (as printed), S2 to GND | 5 | ||
| Receiver output low to disable time | tRLZ | 50 | ns | Fig.4 and 9, S1=-1.3.3V (as printed), S2 to VCC | 5 | ||
| Receiver output high to disable time | tRHZ | 50 | ns | Fig.4 and 9, S1=+1.3.3V (as printed), S2 to GND | 5 | ||
| Receiver enable from standby to output high | tRZH(SHDN) | 5500 | ns | Fig.4 and 9, S1=-1.3.3V (as printed), S2 to VCC | 5 | ||
| Receiver enable from standby to output low | tRZL(SHDN) | 5500 | ns | Fig.4 and 9, S1=+1.3.3V (as printed), S2 to GND | 5 | ||
| Standby time, receiver | tSHDN | 50 | 700 | ns | Note 4 | 5 |
CAD (KiCad official)
- Symbol:
MAX3072EIM - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
max3072eim-etched.step/max3072eim-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);max3072eim.step/max3072eim.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (23 pp, sha256
74ef5bff2c0c4616, retrieved 2026-10-19, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).