# MAX3072EESA+

**Analog Devices Inc Maxim Integrated** · RS-485 / RS-422 ICs · SOIC-8

MAX3072EESA+ from Analog Devices Inc Maxim Integrated, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RO | output | Receiver output: with RE low, RO is high when (A - B) is at or above -50mV and low when (A - B) is at or below -200mV. |
| 2 | RE | input | Receiver output enable: drive RE low to enable RO, which is high impedance when RE is high; RE is a hot-swap input. |
| 3 | DE | input | Driver output enable: drive DE high to enable the driver outputs, which are high impedance when DE is low; DE is a hot-swap input. |
| 4 | DI | input | Driver input: with DE high, a low on DI forces the noninverting output low and the inverting output high, and a high on DI forces the reverse. |
| 5 | GND | power_in | Ground. |
| 6 | A | bidirectional | Noninverting receiver input and noninverting driver output; in half-duplex mode the driver outputs serve as receiver inputs. |
| 7 | B | bidirectional | Inverting receiver input and inverting driver output; in half-duplex mode the driver outputs serve as receiver inputs. |
| 8 | VCC | power_in | Positive supply, VCC = 3.3V ±10%; bypass VCC to GND with a 0.1µF capacitor. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Analog Devices Inc Maxim Integrated |
| Package | SOIC-8 |
| Category | Interface |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VCC |  |  | 6 | V |  | 2 |
| Control Input Voltage (RE, DE, SLR, H/F, TXP, RXP) |  | -0.3 |  | 6 | V |  | 2 |
| Driver Input Voltage (DI) |  | -0.3 |  | 6 | V |  | 2 |
| Driver Output Voltage (Z, Y, A, B) |  | -8 |  | 13 | V |  | 2 |
| Receiver Input Voltage (A, B) |  | -8 |  | 13 | V |  | 2 |
| Receiver Output Voltage (RO) |  | -0.3 |  |  | V |  | 2 |
| Driver Output Current |  | -250 |  | 250 | mA |  | 2 |
| Junction Temperature |  |  |  | 150 | °C |  | 2 |
| Storage Temperature Range |  | -65 |  | 150 | °C |  | 2 |
| Lead Temperature (soldering, 10s) |  |  |  | 300 | °C | 10s | 2 |
| Operating Temperature Range, MAX307_EE__ |  | -40 |  | 85 | °C |  | 2 |
| Differential Driver Output | VOD | 2 |  |  | V | RL = 100Ω (RS422), Figure 1 | 2 |
| Differential Driver Output | VOD | 1.5 |  |  | V | RL = 54Ω (RS485), Figure 1 | 2 |
| Change in Magnitude of Differential Output Voltage | ΔVOD |  |  | 0.2 | V | RL = 100Ω or 54Ω, Figure 1 (Note 2) | 2 |
| Driver Common-Mode Output Voltage | VOC |  |  | 3 | V | RL = 100Ω or 54Ω, Figure 1 | 2 |
| Change in Magnitude of Common-Mode Voltage | ΔVOC |  |  | 0.2 | V | RL = 100Ω or 54Ω, Figure 1 (Note 2) | 2 |
| Input High Voltage | VIH | 2 |  |  | V | DE, DI, RE, TXP, RXP, H/F | 2 |
| Input Low Voltage | VIL |  |  | 0.8 | V | DE, DI, RE, TXP, RXP, H/F | 2 |
| Input Current | IIN1 | -1 |  | 1 | µA | DE, DI, RE | 2 |
| Input Impedance First Transition |  | 1 |  | 10 | kΩ |  | 2 |
| Driver Short-Circuit Output Current | IOSD | 40 |  | 250 | mA | 0 ≤ VOUT ≤ 12V (Note 3) | 3 |
| Driver Short-Circuit Output Current | IOSD | -250 |  | -40 | mA | -7V ≤ VOUT ≤ VCC (Note 3) | 3 |
| Input Current (A and B) | IA, B |  |  | 125 | µA | DE = GND, VCC = GND or 3.6V, VIN = +12V | 3 |
| Input Current (A and B) | IA, B | -100 |  |  | µA | DE = GND, VCC = GND or 3.6V, VIN = -7V | 3 |
| Receiver Differential Threshold Voltage | VTH | -200 | -125 | -50 | mV | -7V ≤ VCM ≤ 12V | 3 |
| RO Output Low Voltage | VOL |  |  | 0.4 | V | IO = 1mA | 3 |
| Three-State Output Current at Receiver | IOZR | -1 |  | 1 | µA | 0 ≤ VO ≤ VCC | 3 |
| Receiver Output Short-Circuit Current | IOSR | -80 |  | 80 | mA | 0V ≤ VRO ≤ VCC | 3 |
| Supply Current | ICC |  | 0.8 | 1.5 | mA | No load, RE = 0, DE = VCC | 3 |
| Supply Current in Shutdown Mode | ISHDN |  | 0.05 | 10 | µA | RE = VCC, DE = GND | 3 |
| ESD Protection for Y, Z, A, and B |  | -15 |  | 15 | kV | Human Body Model | 3 |
| Driver Propagation Delay | tDPLH | 250 |  | 1500 | ns | CL= 50pF, RL= 54Ω, Figures 2 and 3 | 4 |
| Driver Differential Output Rise or Fall Time | tDR, tDF | 350 |  | 1600 | ns | CL= 50pF, RL= 54Ω, Figures 2 and 3 | 4 |
| Time to Shutdown (driver) | tSHDN | 50 | 200 | 600 | ns |  | 4 |
| Time to Shutdown (receiver) | tSHDN | 50 | 200 | 600 | ns |  | 4 |

## CAD (KiCad official)

- Symbol: `MAX3072EESA+`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `max3072eesa-etched.step` / `max3072eesa-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `max3072eesa.step` / `max3072eesa.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Analog Devices Inc Maxim Integrated datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589034861411905537) (23 pp, sha256 `864232a540aeec53`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/max3072eesa-datasheet.pdf)