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MAX3042BESE+

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Maxim Integrated Interface - Specialized, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentcommunication interface chip-uart-485-232max3042bese+factory-2.0.0extractor-text

Verified MAX3042BESE+

by Ray · last 31 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier mfr, 16 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: MAX3042BESE+ · SOIC-16 · 16 pins
  • ✓copper: 16 copper pads, none touching another net
  • ✓datasheet: all 16 pin names found in the 15-page datasheet
  • ✓distributor: lcsc C3234646, digikey MAX3042BESE+-ND, mouser 700-MAX3042BESE
  • ✓family: SOIC-16_3.9x9.9mm_P1.27mm
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-xrbsbv1a/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 16 pins = 16 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 16 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ max3042bese.kicad_sym✓ max3042bese.kicad_mod✓ max3042bese.step
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Ray Publish 0.1.0 0c2d1d9 19h ago

MAX3042BESE+

Maxim Integrated · Interface - Specialized · SOIC-16

MAX3042BESE+ from Maxim Integrated, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 T1IN input Transmitter 1 input; logic levels VIH min 2.0V, VIL max 0.8V, input current ±1µA.
2 Y1 tri_state Noninverting Transmitter 1 output, ±10kV HBM ESD protected, high impedance when disabled.
3 Z1 tri_state Inverting Transmitter 1 output, ±10kV HBM ESD protected, high impedance when disabled.
4 EN12 input Active-high enable for transmitters 1 and 2 (low disables them to high impedance); part enters low-power shutdown when both EN12 and EN34 are low.
5 Z2 tri_state Inverting Transmitter 2 output, ±10kV HBM ESD protected, high impedance when disabled.
6 Y2 tri_state Noninverting Transmitter 2 output, ±10kV HBM ESD protected, high impedance when disabled.
7 T2IN input Transmitter 2 input; logic levels VIH min 2.0V, VIL max 0.8V, input current ±1µA.
8 GND power_in Ground.
9 T3IN input Transmitter 3 input; logic levels VIH min 2.0V, VIL max 0.8V, input current ±1µA.
10 Y3 tri_state Noninverting Transmitter 3 output, ±10kV HBM ESD protected, high impedance when disabled.
11 Z3 tri_state Inverting Transmitter 3 output, ±10kV HBM ESD protected, high impedance when disabled.
12 EN34 input Active-high enable for transmitters 3 and 4 (low disables them to high impedance); part enters low-power shutdown when both EN12 and EN34 are low.
13 Z4 tri_state Inverting Transmitter 4 output, ±10kV HBM ESD protected, high impedance when disabled.
14 Y4 tri_state Noninverting Transmitter 4 output, ±10kV HBM ESD protected, high impedance when disabled.
15 T4IN input Transmitter 4 input; logic levels VIH min 2.0V, VIL max 0.8V, input current ±1µA.
16 VCC power_in Positive supply, +5V ±5% (absolute max +7V); bypass with a 0.1µF capacitor to GND.

Key specifications

Parameter Value
Manufacturer Maxim Integrated
Package SOIC-16
Category Communication Interface Chip/UART/485/232
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Driver Differential Output VOD 2 V Figure 1, R = 50Ω 2
Driver Differential Output VOD 1.5 V Figure 1, R = 27Ω 2
Change in Magnitude of Differential Output Voltage ΔVOD 0.2 V Figure 1, R = 50Ω or 27Ω (Note 2) 2
Driver Common-Mode Output Voltage VOC 3 V Figure 1, R = 50Ω or 27Ω 2
Change in Magnitude of Common-Mode Voltage ΔVOC 0.2 V Figure 1, R = 50Ω or 27Ω (Note 2) 2
Input High Voltage VIH 2 V T_IN, EN_, EN, EN 2
Input Low Voltage VIL 0.8 V T_IN, EN_, EN, EN 2
Hot-Swap Driver Input Current IHOTSWAP -200 200 µA EN_, EN, EN (Note 3) 2
Driver Input Current IIN -1 1 µA T_IN, EN_, EN, EN 2
Driver Short-Circuit Output Current ISC -250 250 mA -7V < VOUT < +10V (Note 4); min magnitude 25 mA during current limiting 2
Output Leakage (Y_, Z_) when Disabled -1 1 µA EN_ = GND 2
ESD Protection (Y_, Z_) -10 10 kV Human Body Model 2
Electrical Fast Transient/Burst Immunity -4 4 kV IEC 1000-4-4 2
Supply Current ICC 1 2 mA No load 2
Supply Current in Shutdown Mode ISHDN 0.002 10 µA EN_ = GND, TA = +25°C 2
Maximum Data Rate fMAX 20 Mbps 4
Driver Propagation Delay tPLH 23 40 ns Figures 2 and 3, RDIFF = 54Ω, CDIFF = 50pF 4
Driver Differential Output Rise/Fall Time tR, tF 17 ns Figures 2 and 3, RDIFF = 54Ω, CDIFF = 50pF 4
Skew Driver to Driver tDSKEW -8 8 ns Different chips, Figures 2 and 3, RDIFF = 54Ω, CDIFF = 50pF 4
Differential Driver Output Skew /tPLH - tPHL/ tSKEW -8 8 ns Figures 2 and 3, RDIFF = 54Ω, CDIFF = 50pF 4
Driver Enable to Output High tZH 300 ns MAX3042B, Figures 4 and 5, S2 closed, RL = 500Ω, CL = 100pF 4
Driver Enable from Shutdown to Output High tZH(SHDN) 300 ns Figures 4 and 5, S2 closed, RL = 500Ω, CL = 100pF 4
Driver Enable to Output Low tZL 300 ns MAX3042B, Figures 4 and 5, S1 closed, RL = 500Ω, CL = 100pF 4
Driver Enable from Shutdown to Output Low tZL(SHDN) 300 ns Figures 4 and 5, S1 closed, RL = 500Ω, CL = 100pF 4
Driver Disable Time from Low tLZ 400 ns Figures 4 and 5, S1 closed, RL = 500Ω, CL = 15pF 4
Driver Disable Time from High tHZ 400 ns Figures 4 and 5, S2 closed, RL = 500Ω, CL = 15pF 4
Supply Voltage VCC 7 V 2
Driver Output Voltage (Driver Disabled) Y_, Z_ -7.5 12.5 V Driver disabled 2
Driver Output Voltage (Driver Enabled) Y_, Z_ -7.5 10 V Driver enabled 2
Operating Temperature Range -40 85 °C MAX304_E_E 2
Maximum Junction Temperature 150 °C 2
Storage Temperature Range -65 150 °C 2
Lead Temperature 300 °C soldering, 10s 2

CAD (KiCad official)

  • Symbol: MAX3042BESE+
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: max3042bese-etched.step / max3042bese-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max3042bese.step / max3042bese.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Maxim Integrated datasheet (15 pp, sha256 2f88a25548d5ca98, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF