component
MAX17544ATP+
Public Made by Adomby adom
Maxim Integrated DC-DC Converters, TQFN-20(5x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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MAX17544ATP+
Maxim Integrated · DC-DC Converters · TQFN-20(5x5)
MAX17544ATP+ from Maxim Integrated, in a TQFN-20(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VIN | power_in | Power supply input with a 4.5V to 42V input supply range; connect the VIN pins together. |
| 2 | VIN | power_in | Power supply input with a 4.5V to 42V input supply range; connect the VIN pins together. |
| 3 | VIN | power_in | Power supply input with a 4.5V to 42V input supply range; connect the VIN pins together. |
| 4 | EN/UVLO | input | Enable/undervoltage lockout input that must be driven high to enable the output, with an external resistor divider from VIN to SGND setting the turn-on input voltage. |
| 5 | RESET | output | Open-drain RESET output that is driven low if FB drops below 92% of its set value and goes high 1024 clock cycles after FB rises above 95% of its set value. |
| 6 | SYNC | input | Clock input used to synchronize the device to an external clock. |
| 7 | SS | passive | Soft-start input; a capacitor connected from SS to SGND sets the soft-start time. |
| 8 | CF | passive | At switching frequencies below 500kHz a capacitor is connected from CF to FB, and CF is left open at 500kHz or above. |
| 9 | FB | input | Feedback input connected to the center tap of an external resistor divider from the output to GND to set the output voltage. |
| 10 | RT | passive | A resistor from RT to SGND sets the switching frequency from 100kHz to 2.2MHz, and leaving RT open selects the default 500kHz. |
| 11 | MODE | input | Mode select pin: left unconnected for PFM, connected to SGND for constant-frequency PWM, and connected to VCC for DCM operation, latched at power-up. |
| 12 | VCC | power_out | 5V LDO output that must be bypassed with 2.2µF ceramic capacitance to SGND. |
| 13 | SGND | power_in | Analog ground. |
| 14 | PGND | power_in | Power ground that connects externally to the power ground plane and to SGND at the VCC bypass capacitor return path. |
| 15 | PGND | power_in | Power ground that connects externally to the power ground plane and to SGND at the VCC bypass capacitor return path. |
| 16 | PGND | power_in | Power ground that connects externally to the power ground plane and to SGND at the VCC bypass capacitor return path. |
| 17 | LX | output | Switching node connected to the switching side of the inductor. |
| 18 | LX | output | Switching node connected to the switching side of the inductor. |
| 19 | LX | output | Switching node connected to the switching side of the inductor. |
| 20 | BST | passive | Boost flying capacitor connection; a 0.1µF ceramic capacitor is connected between BST and LX. |
| 21 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Maxim Integrated |
| Package | TQFN-20(5x5) |
| Category | Power Management ICs |
| Pins | 21 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VIN to PGND | VIN | -0.3 | 48 | V | VIN to PGND | 2 | |
| EN/UVLO to SGND | VEN/UVLO | -0.3 | 48 | V | EN/UVLO to SGND | 2 | |
| BST to PGND | VBST | -0.3 | 53 | V | BST to PGND | 2 | |
| BST to LX | VBST-LX | -0.3 | 6.5 | V | BST to LX | 2 | |
| BST to VCC | VBST-VCC | -0.3 | 48 | V | BST to VCC | 2 | |
| CF, RESET, SS, MODE, SYNC, RT to SGND | -0.3 | 6.5 | V | CF, RESET, SS, MODE, SYNC, RT to SGND | 2 | ||
| FB to SGND | VFB | -0.3 | 1.5 | V | FB to SGND | 2 | |
| VCC to SGND | VCC | -0.3 | 6.5 | V | VCC to SGND | 2 | |
| SGND to PGND | -0.3 | 0.3 | V | SGND to PGND | 2 | ||
| LX Total RMS Current | ILX | -5.6 | 5.6 | A | LX total RMS current | 2 | |
| Junction Temperature | TJ | 150 | °C | 2 | |||
| Storage Temperature Range | TSTG | -65 | 160 | °C | 2 | ||
| Lead Temperature | 300 | °C | soldering, 10s | 2 | |||
| Soldering Temperature (reflow) | 260 | °C | reflow | 2 | |||
| Input Voltage Range | VIN | 4.5 | 42 | V | 2 | ||
| Input Shutdown Current | IIN-SH | 2.8 | 4.5 | µA | VEN/UVLO = 0V (shutdown mode) | 2 | |
| Input Quiescent Current DCM | IQ-DCM | 1.16 | 1.8 | mA | DCM mode, VLX = 0.1V | 2 | |
| EN/UVLO Threshold rising | VENR | 1.19 | 1.215 | 1.26 | V | VEN/UVLO rising | 2 |
| EN/UVLO Threshold falling | VENF | 1.068 | 1.09 | 1.131 | V | VEN/UVLO falling | 2 |
| EN/UVLO Input Leakage Current | IEN | -50 | 0 | 50 | nA | VEN/UVLO = 0V, TA = +25°C | 2 |
| VCC Output Voltage Range | VCC | 4.75 | 5 | 5.25 | V | 6V < VIN < 42V, IVCC = 1mA | 2 |
| VCC Output Voltage Range (load) | VCC | 4.75 | 5 | 5.25 | V | 1mA ≤ IVCC ≤ 25mA | 2 |
| VCC Current Limit | IVCC-MAX | 26.5 | 54 | 100 | mA | VCC = 4.3V, VIN = 6V | 2 |
| VCC UVLO rising | VCC_UVR | 4.05 | 4.2 | 4.3 | V | VCC rising | 2 |
| VCC UVLO falling | VCC_UVF | 3.65 | 3.8 | 3.9 | V | VCC falling | 2 |
| High-Side nMOS On-Resistance | RDS-ONH | 165 | 325 | mΩ | ILX = 0.3A | 3 | |
| Low-Side nMOS On-Resistance | RDS-ONL | 80 | 150 | mΩ | ILX = 0.3A | 3 | |
| LX Leakage Current | ILX_LKG | -2 | 2 | µA | VLX = VIN - 1V, VLX = VPGND + 1V, TA = +25°C | 3 | |
| Soft-Start Charging Current | ISS | 4.7 | 5 | 5.3 | µA | VSS = 0.5V | 3 |
| FB Regulation Voltage (MODE = SGND or VCC) | VFB_REG | 0.89 | 0.9 | 0.91 | V | MODE = SGND or MODE = VCC | 3 |
| FB Regulation Voltage (MODE open) | VFB_REG | 0.89 | 0.915 | 0.936 | V | MODE = OPEN | 3 |
| FB Input Bias Current | IFB | -50 | 50 | nA | 0 < VFB < 1V, TA = +25°C | 3 | |
| Peak Current-Limit Threshold | IPEAK-LIMIT | 4.4 | 5.1 | 5.85 | A | 3 | |
| Runaway Current-Limit Threshold | IRUNAWAY-LIMIT | 4.9 | 5.7 | 6.7 | A | 3 | |
| Valley Current-Limit Threshold | ISINK-LIMIT | -0.16 | 0 | 0.16 | A | MODE = open/VCC | 3 |
| PFM Current-Limit Threshold | IPFM | 0.6 | 0.75 | 0.9 | A | MODE = open | 3 |
| Switching Frequency | fSW | 90 | 100 | 110 | kHz | RRT = 210kΩ | 3 |
| Switching Frequency | fSW | 180 | 200 | 220 | kHz | RRT = 102kΩ | 3 |
| Switching Frequency | fSW | 475 | 500 | 525 | kHz | RRT = 40.2kΩ | 3 |
| Switching Frequency | fSW | 1950 | 2200 | 2450 | kHz | RRT = 8.06kΩ | 3 |
| Switching Frequency | fSW | 460 | 500 | 540 | kHz | RRT = open | 3 |
| FB Undervoltage Trip Level to Cause Hiccup | VFB-HICF | 0.56 | 0.58 | 0.65 | V | 3 | |
| FB Threshold for RESET Assertion | VFB-OKF | 90.5 | 92 | 94.6 | %VFB-REG | VFB falling | 4 |
| FB Threshold for RESET Deassertion | VFB-OKR | 93.8 | 95 | 97.8 | %VFB-REG | VFB rising | 4 |
| RESET Output Leakage Current | -0.1 | 0.1 | µA | TA = TJ = +25°C, VRESET = 5.5V | 4 | ||
| Input Quiescent Current PFM (VFB=1V, MODE=RT=open) | IQ_PFM | 118 | µA | VFB = 1V, MODE = RT = open | 2 | ||
| Input Quiescent Current PFM (VFB=1V, MODE=open) | IQ_PFM | 162 | µA | VFB = 1V, MODE = open | 2 | ||
| Junction-to-Ambient Thermal Resistance | θJA | 30 | °C/W | 2 | |||
| Junction-to-Case Thermal Resistance | θJC | 2 | °C/W | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | Exposed Pad. Connect to the SGND pin. Connect to a large copper plane below the IC to improve heat | 11 |
CAD (KiCad official)
- Symbol:
MAX17544ATP+ - Footprint:
Package_DFN_QFN:QFN-20-1EP_5x5mm_P0.65mm_EP3.35x3.35mm - 3D model: TQFN-20(5x5) (KiCad packages3D, STEP)
- 3D model files:
max17544atp-etched.step/max17544atp-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);max17544atp.step/max17544atp.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Maxim Integrated datasheet (21 pp, sha256
ce246f2733327f1f, retrieved 2026-11-02, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# MAX17544ATP+
**Maxim Integrated** · DC-DC Converters · TQFN-20(5x5)
MAX17544ATP+ from Maxim Integrated, in a TQFN-20(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VIN | power_in | Power supply input with a 4.5V to 42V input supply range; connect the VIN pins together. |
| 2 | VIN | power_in | Power supply input with a 4.5V to 42V input supply range; connect the VIN pins together. |
| 3 | VIN | power_in | Power supply input with a 4.5V to 42V input supply range; connect the VIN pins together. |
| 4 | EN/UVLO | input | Enable/undervoltage lockout input that must be driven high to enable the output, with an external resistor divider from VIN to SGND setting the turn-on input voltage. |
| 5 | RESET | output | Open-drain RESET output that is driven low if FB drops below 92% of its set value and goes high 1024 clock cycles after FB rises above 95% of its set value. |
| 6 | SYNC | input | Clock input used to synchronize the device to an external clock. |
| 7 | SS | passive | Soft-start input; a capacitor connected from SS to SGND sets the soft-start time. |
| 8 | CF | passive | At switching frequencies below 500kHz a capacitor is connected from CF to FB, and CF is left open at 500kHz or above. |
| 9 | FB | input | Feedback input connected to the center tap of an external resistor divider from the output to GND to set the output voltage. |
| 10 | RT | passive | A resistor from RT to SGND sets the switching frequency from 100kHz to 2.2MHz, and leaving RT open selects the default 500kHz. |
| 11 | MODE | input | Mode select pin: left unconnected for PFM, connected to SGND for constant-frequency PWM, and connected to VCC for DCM operation, latched at power-up. |
| 12 | VCC | power_out | 5V LDO output that must be bypassed with 2.2µF ceramic capacitance to SGND. |
| 13 | SGND | power_in | Analog ground. |
| 14 | PGND | power_in | Power ground that connects externally to the power ground plane and to SGND at the VCC bypass capacitor return path. |
| 15 | PGND | power_in | Power ground that connects externally to the power ground plane and to SGND at the VCC bypass capacitor return path. |
| 16 | PGND | power_in | Power ground that connects externally to the power ground plane and to SGND at the VCC bypass capacitor return path. |
| 17 | LX | output | Switching node connected to the switching side of the inductor. |
| 18 | LX | output | Switching node connected to the switching side of the inductor. |
| 19 | LX | output | Switching node connected to the switching side of the inductor. |
| 20 | BST | passive | Boost flying capacitor connection; a 0.1µF ceramic capacitor is connected between BST and LX. |
| 21 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Maxim Integrated |
| Package | TQFN-20(5x5) |
| Category | Power Management ICs |
| Pins | 21 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VIN to PGND | VIN | -0.3 | | 48 | V | VIN to PGND | 2 |
| EN/UVLO to SGND | VEN/UVLO | -0.3 | | 48 | V | EN/UVLO to SGND | 2 |
| BST to PGND | VBST | -0.3 | | 53 | V | BST to PGND | 2 |
| BST to LX | VBST-LX | -0.3 | | 6.5 | V | BST to LX | 2 |
| BST to VCC | VBST-VCC | -0.3 | | 48 | V | BST to VCC | 2 |
| CF, RESET, SS, MODE, SYNC, RT to SGND | | -0.3 | | 6.5 | V | CF, RESET, SS, MODE, SYNC, RT to SGND | 2 |
| FB to SGND | VFB | -0.3 | | 1.5 | V | FB to SGND | 2 |
| VCC to SGND | VCC | -0.3 | | 6.5 | V | VCC to SGND | 2 |
| SGND to PGND | | -0.3 | | 0.3 | V | SGND to PGND | 2 |
| LX Total RMS Current | ILX | -5.6 | | 5.6 | A | LX total RMS current | 2 |
| Junction Temperature | TJ | | | 150 | °C | | 2 |
| Storage Temperature Range | TSTG | -65 | | 160 | °C | | 2 |
| Lead Temperature | | | | 300 | °C | soldering, 10s | 2 |
| Soldering Temperature (reflow) | | | | 260 | °C | reflow | 2 |
| Input Voltage Range | VIN | 4.5 | | 42 | V | | 2 |
| Input Shutdown Current | IIN-SH | | 2.8 | 4.5 | µA | VEN/UVLO = 0V (shutdown mode) | 2 |
| Input Quiescent Current DCM | IQ-DCM | | 1.16 | 1.8 | mA | DCM mode, VLX = 0.1V | 2 |
| EN/UVLO Threshold rising | VENR | 1.19 | 1.215 | 1.26 | V | VEN/UVLO rising | 2 |
| EN/UVLO Threshold falling | VENF | 1.068 | 1.09 | 1.131 | V | VEN/UVLO falling | 2 |
| EN/UVLO Input Leakage Current | IEN | -50 | 0 | 50 | nA | VEN/UVLO = 0V, TA = +25°C | 2 |
| VCC Output Voltage Range | VCC | 4.75 | 5 | 5.25 | V | 6V < VIN < 42V, IVCC = 1mA | 2 |
| VCC Output Voltage Range (load) | VCC | 4.75 | 5 | 5.25 | V | 1mA ≤ IVCC ≤ 25mA | 2 |
| VCC Current Limit | IVCC-MAX | 26.5 | 54 | 100 | mA | VCC = 4.3V, VIN = 6V | 2 |
| VCC UVLO rising | VCC_UVR | 4.05 | 4.2 | 4.3 | V | VCC rising | 2 |
| VCC UVLO falling | VCC_UVF | 3.65 | 3.8 | 3.9 | V | VCC falling | 2 |
| High-Side nMOS On-Resistance | RDS-ONH | | 165 | 325 | mΩ | ILX = 0.3A | 3 |
| Low-Side nMOS On-Resistance | RDS-ONL | | 80 | 150 | mΩ | ILX = 0.3A | 3 |
| LX Leakage Current | ILX_LKG | -2 | | 2 | µA | VLX = VIN - 1V, VLX = VPGND + 1V, TA = +25°C | 3 |
| Soft-Start Charging Current | ISS | 4.7 | 5 | 5.3 | µA | VSS = 0.5V | 3 |
| FB Regulation Voltage (MODE = SGND or VCC) | VFB_REG | 0.89 | 0.9 | 0.91 | V | MODE = SGND or MODE = VCC | 3 |
| FB Regulation Voltage (MODE open) | VFB_REG | 0.89 | 0.915 | 0.936 | V | MODE = OPEN | 3 |
| FB Input Bias Current | IFB | -50 | | 50 | nA | 0 < VFB < 1V, TA = +25°C | 3 |
| Peak Current-Limit Threshold | IPEAK-LIMIT | 4.4 | 5.1 | 5.85 | A | | 3 |
| Runaway Current-Limit Threshold | IRUNAWAY-LIMIT | 4.9 | 5.7 | 6.7 | A | | 3 |
| Valley Current-Limit Threshold | ISINK-LIMIT | -0.16 | 0 | 0.16 | A | MODE = open/VCC | 3 |
| PFM Current-Limit Threshold | IPFM | 0.6 | 0.75 | 0.9 | A | MODE = open | 3 |
| Switching Frequency | fSW | 90 | 100 | 110 | kHz | RRT = 210kΩ | 3 |
| Switching Frequency | fSW | 180 | 200 | 220 | kHz | RRT = 102kΩ | 3 |
| Switching Frequency | fSW | 475 | 500 | 525 | kHz | RRT = 40.2kΩ | 3 |
| Switching Frequency | fSW | 1950 | 2200 | 2450 | kHz | RRT = 8.06kΩ | 3 |
| Switching Frequency | fSW | 460 | 500 | 540 | kHz | RRT = open | 3 |
| FB Undervoltage Trip Level to Cause Hiccup | VFB-HICF | 0.56 | 0.58 | 0.65 | V | | 3 |
| FB Threshold for RESET Assertion | VFB-OKF | 90.5 | 92 | 94.6 | %VFB-REG | VFB falling | 4 |
| FB Threshold for RESET Deassertion | VFB-OKR | 93.8 | 95 | 97.8 | %VFB-REG | VFB rising | 4 |
| RESET Output Leakage Current | | -0.1 | | 0.1 | µA | TA = TJ = +25°C, VRESET = 5.5V | 4 |
| Input Quiescent Current PFM (VFB=1V, MODE=RT=open) | IQ_PFM | | 118 | | µA | VFB = 1V, MODE = RT = open | 2 |
| Input Quiescent Current PFM (VFB=1V, MODE=open) | IQ_PFM | | 162 | | µA | VFB = 1V, MODE = open | 2 |
| Junction-to-Ambient Thermal Resistance | θJA | | 30 | | °C/W | | 2 |
| Junction-to-Case Thermal Resistance | θJC | | 2 | | °C/W | | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | | Exposed Pad. Connect to the SGND pin. Connect to a large copper plane below the IC to improve heat | 11 |
## CAD (KiCad official)
- Symbol: `MAX17544ATP+`
- Footprint: `Package_DFN_QFN:QFN-20-1EP_5x5mm_P0.65mm_EP3.35x3.35mm`
- 3D model: TQFN-20(5x5) (KiCad packages3D, STEP)
- 3D model files: `max17544atp-etched.step` / `max17544atp-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `max17544atp.step` / `max17544atp.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Maxim Integrated datasheet](https://www.analog.com/media/en/technical-documentation/data-sheets/MAX17544.pdf) (21 pp, sha256 `ce246f2733327f1f`, retrieved 2026-11-02, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/max17544atp-datasheet.pdf)