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MAX14841EASA+T

Analog Devices Inc Maxim Integrated · RS-485 / RS-422 ICs · SOIC-8

MAX14841EASA+T from Analog Devices Inc Maxim Integrated, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	RO	output	Receiver output; RO is high impedance when RE is high, and the datasheet states it is logic-high when the receiver differential input VOD is at or above -10mV on the MAX14841E.
2	RE	input	Active-low receiver output enable: driving RE low enables RO, and driving RE high with DE low puts the device into low-power shutdown mode (under 10µA supply current); RE is a hot-swap input.
3	DE	input	Driver output enable: driving DE high enables the driver outputs, which are high impedance when DE is low; DE is a hot-swap input and driving RE high with DE low enters shutdown.
4	DI	input	Driver input: with DE high, a low on DI forces output A low and output B high, and a high on DI forces A high and B low.
5	GND	power_in	Ground reference for the device; all voltages are referenced to this pin.
6	A	bidirectional	Noninverting receiver input and noninverting driver output; the absolute maximum rating for A and B is -8.0V to +13.0V referenced to GND.
7	B	bidirectional	Inverting receiver input and inverting driver output; the absolute maximum rating for A and B is -8.0V to +13.0V referenced to GND.
8	VCC	power_in	Positive supply voltage input, specified at 3.0V to 3.6V; bypass VCC to GND with a 0.1µF ceramic capacitor.

Key specifications

Parameter	Value
Manufacturer	Analog Devices Inc Maxim Integrated
Package	SOIC-8
Category	Interface
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Supply Voltage (VCC)	VCC	-0.3		6	V	Voltages referenced to GND	2
Receiver output / enable pins (RE, RO) voltage	RE, RO	-0.3			V	Upper limit printed as VCC + 0.3V	2
Driver input / enable pins (DE, DI) voltage	DE, DI	-0.3		6	V	Voltages referenced to GND	2
Bus pins (A, B) voltage	A, B	-8		13	V	Voltages referenced to GND	2
Continuous Power Dissipation (8-Pin SO)	PD			606	mW	TA = +70°C	2
Junction Temperature	TJ			150	°C		2
Storage Temperature Range	TSTG	-65		150	°C		2
Lead Temperature (soldering, 10s)				300	°C	Soldering, 10s	2
Soldering Temperature (reflow)				260	°C	Reflow	2
Operating Temperature Range	TA	-40		125	°C	Note 2 (junction up to +150°C)	2
Supply Voltage	VCC	3		3.6	V		2
Supply Current	ICC		1.5	4	mA	DE = RE = VCC, or DE = RE = GND, or DE = VCC, RE = GND, DI = VCC or GND, no load	2
Shutdown Supply Current	ISH			10	µA	DE = GND and RE = VCC	2
Differential Driver Output	VOD	1.5			V	RL = 54Ω, Figure 1	2
Change in Magnitude of Differential Output Voltage	DVOD	-0.2	0	0.2	V	RL = 54Ω, Figure 1 (Note 5)	2
Driver Common-Mode Output Voltage	VOC			3	V	RL = 54Ω, Figure 1	2
Change in Common-Mode Voltage	DVOC	-0.2		0.2	V	RL = 54Ω, Figure 1 (Note 5)	2
Single-Ended Driver Output High	VOH	2.2			V	A/B output, IOUT = -20mA	2
Single-Ended Driver Output Low	VOL			0.8	V	A/B output, IOUT = 20mA	2
Driver Short-Circuit Output Current	/IOSD/			250	mA	0V ≤ VOUT ≤ +12V, output low	2
Input Current (A and B)	IA,B			1000	µA	DE = GND, VCC = GND or +3.6V, VIN = +12V	2
Input Current (A and B)	IA,B	-800			µA	DE = GND, VCC = GND or +3.6V, VIN = -7V	2
Receiver Differential Threshold Voltage (MAX14841E Only)	VTH	-200	-105	-10	mV	-7V ≤ VCM ≤ 12V	3
Receiver Input Hysteresis (MAX14841E Only)	ΔVTH	10			mV	VCM = 0V	3
Input High Voltage (DE, DI)	VIH	2		5.5	V	DE, DI	3
Input High Voltage (RE)	VIH	2			V	RE	3
Input Low Voltage	VIL			0.8	V	DE, DI, RE	3
Input Hysteresis	VHYS	50			mV	DE, DI, RE	3
Input Current	IIN	-1		1	µA	DE, DI, RE	3
Input Impedance on First Transition		1		10	kΩ	DE, RE	3
Output Low Voltage (receiver)	VOL			0.4	V	RE = GND, IO = 1mA, VA - VB < -200mV	3
Three-State Output Current at Receiver	IOZR	-1		1	µA	RE = VCC, 0V ≤ VO ≤ VCC	3
Receiver Output Short-Circuit Current	IOSR	-95		95	mA	0V ≤ VRO ≤ VCC	3
ESD Protection: A, B to GND, HBM		-35		35	kV	HBM, JEDEC JS-001-2012	3
ESD Protection: A, B to GND, IEC 61000-4-2 Air Gap Discharge		-20		20	kV	IEC 61000-4-2 Air Gap Discharge	3
ESD Protection: A, B to GND, IEC 61000-4-2 Contact Discharge		-12		12	kV	IEC 61000-4-2 Contact Discharge	3
ESD Protection: All Other Pins, HBM		-2		2	kV	HBM	3
Driver Propagation Delay (tDPLH)	tDPLH	5	12	20	ns	RL = 54Ω, CL = 50pF, Figures 2 and 3 (Note 6)	3
Driver Propagation Delay (tDPHL)	tDPHL	5	12	20	ns	RL = 54Ω, CL = 50pF, Figures 2 and 3 (Note 6)	3
Differential Driver Output Skew	/tDPLH - tDPHL/			2	ns	RL = 54Ω, CL = 50pF, Figures 2 and 3 (Notes 6, 9)	3
Driver Differential Output Rise or Fall Time	tHL, tLH			7.5	ns	RL = 54Ω, CL = 50pF, Figures 2 and 3 (Notes 6, 9)	4
Maximum Data Rate (driver)	DRMAX	40			Mbps		4
Driver Enable to Output High	tDZH			30	ns	RL = 110Ω, CL = 50pF, Figures 4 and 5 (Notes 6, 7)	4
Driver Enable to Output Low	tDZL			30	ns	RL = 110Ω, CL = 50pF, Figures 4 and 5 (Notes 6, 7)	4
Driver Disable Time from Low	tDLZ			30	ns	RL = 110Ω, CL = 50pF, Figures 4 and 5 (Notes 6, 7)	4
Driver Disable Time from High	tDHZ			30	ns	RL = 110Ω, CL = 50pF, Figures 4 and 5 (Notes 5, 6)	4
Driver Enable from Shutdown to Output Low	tDZL(SHDN)			4	µs	RL = 110Ω, CL = 50pF, Figures 4 and 5 (Notes 6, 7)	4
Driver Enable from Shutdown to Output High	tDZH(SHDN)			4	µs	RL = 110Ω, CL = 50pF, Figures 4 and 5 (Notes 6, 7)	4
Time to Shutdown	tSHDN	50		800	ns	Note 8	4
Receiver Propagation Delay (tRPLH)	tRPLH			25	ns	CL = 15pF, Figures 6 and 7 (Note 6)	4
Receiver Propagation Delay (tRPHL)	tRPHL			25	ns	CL = 15pF, Figures 6 and 7 (Note 6)	4
Receiver Output Skew	tRSKEW			2	ns	CL = 15pF, Figures 6 and 7 (Notes 6, 9)	4
Receiver Enable to Output High	tRZH			20	ns	RL = 1kΩ, CL = 15pF, Figure 8 (Notes 6, 7)	4
Receiver Enable to Output Low	tRZL			20	ns	RL = 1kΩ, CL = 15pF, Figure 8 (Notes 6, 7)	4
Receiver Disable Time from Low	tRLZ			20	ns	RL = 1kΩ, CL = 15pF, Figure 8 (Notes 6, 7)	4
Receiver Disable Time from High	tRHZ			20	ns	RL = 1kΩ, CL = 15pF, Figure 8 (Notes 6, 7)	4

CAD (KiCad official)

Symbol: MAX14841EASA+T
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: max14841easa-t-etched.step / max14841easa-t-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); max14841easa-t.step / max14841easa-t.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Analog Devices Inc Maxim Integrated datasheet (16 pp, sha256 6bfa509840509451, retrieved 2026-10-19, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF