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MA780GQ-Z
Public Made by Adomby adom
Monolithic Power Systems Position Sensors, QFN-16(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownMA780GQ-Z
Monolithic Power Systems · Position Sensors · QFN-16(3x3)
MA780GQ-Z from Monolithic Power Systems, in a QFN-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | ND | output | New data output: in ASC mode it indicates when new data is ready to be read, and it also indicates when the displacement exceeds the defined threshold. |
| 2 | ERR | output | Error flag output that is set to logic 1 when any error flag is asserted and is cleared by the SPI Clear Error Flags command. |
| 3 | NVM | output | Non-volatile memory busy output that is high while the chip is accessing the NVM; SPI writes sent while it is high set the ERRMEM flag. |
| 4 | MOSI | input | SPI data input from the controller. |
| 5 | /CS | input | SPI chip select input. |
| 6 | ASC | input | Auto-sampling cycle input; connect to GND if the ASC function is not used. |
| 7 | MISO | output | SPI data output that is pulled low when /CS is set to logic 1. |
| 8 | GND | power_in | Supply ground. |
| 9 | DV | output | Data valid output that indicates whether the digital filter has stabilized in active mode. |
| 10 | TEST | passive | Test pin that must be connected to ground. |
| 11 | N/C | unconnected | No connection; do not make connections to this pin because it is internally connected. |
| 12 | SCLK | input | SPI clock input. |
| 13 | VDD | power_in | 3.3V supply (recommended operating range 3.0V to 3.6V, absolute maximum -0.5V to +4.6V). |
| 14 | VDDIO | power_in | I/O supply of 1.8V to 3.3V that allows SPI communication at any voltage in that range (recommended operating range 1.8V to 3.6V). |
| 15 | EN | input | Enable input that switches the sensor to active mode; connect to GND if it is not used. |
| 16 | N/C | unconnected | No connection; do not make connections to this pin because it is internally connected. |
| 17 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Monolithic Power Systems |
| Package | QFN-16(3x3) |
| Category | Sensors |
| Pins | 17 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Active supply current | IACTIVE | 10 | 12.5 | mA | VDD = 3.3V, B = 45mT to 100mT, TA = -40°C to +125°C | 4 | |
| Idle supply current | IIDLE | 0.3 | 1.9 | µA | Below 85°C | 4 | |
| Effective resolution | 8 | 12 | bits | ±3σ deviations from the noise distribution | 4 | ||
| Noise RMS | 0.015 | 0.2 | deg | RMS 1σ from the noise distribution | 4 | ||
| Refresh rate | 850 | 980 | 1100 | kHz | Active mode | 4 | |
| Data output length | 16 | 16 | bits | 4 | |||
| VDD power-up time | 600 | µs | After setting VDD at 3.3V | 4 | |||
| Start-up time | tSTART_UP | 35 | µs | From active to data valid while FW = 0 | 4 | ||
| Latency | 4 | 4000 | µs | Constant speed propagation delay during tACTIVE, equals the FW time constant (τ) + 3µs | 4 | ||
| Filter cutoff frequency | fCUTOFF | 39 | 160000 | Hz | Depends on FW | 4 | |
| 128MHz internal high freq CLK error | -13 | 12 | % | At room temperature; affects TACT & filter settling time | 4 | ||
| Cycle time accuracy | -5 | 5 | % | At room temperature | 4 | ||
| INL at 25°C | 0.7 | deg | At room temperature across the full field range | 4 | |||
| INL between -40°C to +125°C | 1.1 | deg | Across the full temperature range and field range | 4 | |||
| Temperature-induced drift at room temp | 0.01 | deg/°C | Temperature-induced drift at room temp | 4 | |||
| Temperature-induced variation | 0.5 | deg | From 25°C to 85°C | 4 | |||
| Temperature-induced variation | 0.7 | deg | From 25°C to 125°C | 4 | |||
| Induced magnetic field | 0.01 | deg/mT | 4 | ||||
| Induced supply voltage | 0.35 | deg/V | 4 | ||||
| Input high voltage | VIH | 2.5 | 5.5 | V | VDDIO = 3.3V | 4 | |
| Input high voltage | VIH | 1.2 | 5.5 | V | VDDIO = 1.8V | 4 | |
| Input low voltage | VIL | -0.3 | 0.8 | V | VDDIO = 3.3V | 4 | |
| Input low voltage | VIL | -0.3 | 0.4 | V | VDDIO = 1.8V | 4 | |
| Output low voltage | VOL | 0.4 | V | IOL = 4mA, VDDIO = 3.3V | 4 | ||
| Output high voltage | VOH | 2.4 | V | IOL = 4mA, VDDIO = 3.3V | 4 | ||
| Output high voltage | VOH | 1.2 | V | IOL = 4mA, VDDIO = 1.8V | 4 | ||
| Falling edge slew rate | tF | 0.7 | V/ns | CL = 50pF | 4 | ||
| Supply voltage (VDD) | VDD | 3 | 3.6 | V | 3 | ||
| I/O supply voltage (VDDIO) | VDDIO | 1.8 | 3.6 | V | 3 | ||
| Operating temperature | TOP | -40 | 125 | °C | 3 | ||
| Applied magnetic field | B | 30 | mT | More than 30mT as printed | 3 | ||
| Supply voltage | -0.5 | 4.6 | V | 3 | |||
| Input pin voltage | VI | -0.5 | 6 | V | 3 | ||
| Output pin voltage | VO | -0.5 | 4.6 | V | 3 | ||
| Continuous power dissipation | 2 | W | TA = 25°C | 3 | |||
| Storage temperature | -65 | 150 | °C | 3 | |||
| ESD human body model (HBM) | 2 | kV | 3 | ||||
| ESD charged device model (CDM) | 2 | kV | 3 | ||||
| SPI idle time between angle transmissions | tIDLE_ANGLE | 120 | ns | Idle time between two subsequent angle transmissions | 11 | ||
| SPI idle time before and after register readout | tIDLE_READ_REG | 120 | ns | Idle time before and after a register readout | 11 | ||
| SPI idle time before and after register write | tIDLE_WRITE_REG | 120 | ns | Idle time before and after a register write. | 11 | ||
| Time to store register to NVM | tSTORE_REG_TO_NVM | 23 | ms | Time required to store a register value to the NVM | 11 | ||
| Time to store all registers to NVM | tSTORE_ALL_REGT_O_NVM | 704 | ms | Time required to store all register values to the NVM | 11 | ||
| Time to restore all registers from NVM | tRESTORE_ALL_REG_FROM_NVM | 240 | µs | Time required to restore all register values from the NVM | 11 | ||
| Time to clear fault flags | tCLEAR_FAULT | 40 | ns | Time required to clear the fault flags (register 26) | 11 | ||
| /CS falling edge to SCLK falling edge | tCSL | 120 | ns | Time between /CS falling edge and SCLK falling edge | 11 | ||
| SCLK period | tSCLK | 40 | ns | SCLK period | 11 | ||
| SCLK low level | tSCLKL | 20 | ns | Low level of the SCLK signal | 11 | ||
| SCLK high level | tSCLKH | 20 | ns | High level of the SCLK signal | 11 | ||
| SCLK rising edge to /CS rising edge | tCSH | 20 | ns | Time between the SCLK rising edge and /CS rising edge | 11 | ||
| SCLK falling edge to data output valid | tMISO | 15 | ns | SCLK falling edge to data output valid | 11 | ||
| Data input valid to SCLK reading edge | tMOSI | 15 | ns | Data input valid to SCLK reading edge | 11 | ||
| Thermal resistance junction-to-ambient | θJA | 50 | °C/W | QFN-16 (3mmx3mm), measured on JESD51-7, 4-layer PCB | 3 | ||
| Thermal resistance junction-to-case | θJC | 12 | °C/W | QFN-16 (3mmx3mm) | 3 |
CAD (KiCad official)
- Symbol:
MA780GQ-Z - Footprint:
Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm - 3D model: QFN-16(3x3) (KiCad packages3D, STEP)
- 3D model files:
ma780gq-z-etched.step/ma780gq-z-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ma780gq-z.step/ma780gq-z.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Monolithic Power Systems datasheet (32 pp, sha256
548bd10d94c74e4b, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).