component
M95640-WMN6P
Public Made by Adomby adom
STMicroelectronics EEPROM, SO-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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M95640-WMN6P
STMicroelectronics · EEPROM · SO-8
M95640-WMN6P from STMicroelectronics, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S | input | Chip Select: the device is selected when S is driven low, and it must see a falling edge after power-up before any instruction starts. |
| 2 | Q | output | Serial Data Output, with DC output current limited to 5 mA (IOL for Q = 0 and IOH for Q = 1). |
| 3 | W | input | Write Protect input used together with the status register bits to protect the memory array. |
| 4 | VSS | power_in | Ground reference for the device. |
| 5 | D | input | Serial Data Input, sampled on the serial clock C. |
| 6 | C | input | Serial Clock input supporting SPI clock rates up to 20 MHz. |
| 7 | HOLD | input | Hold input: communications with the device are interrupted while HOLD is driven low. |
| 8 | VCC | power_in | Supply voltage, 2.5 V to 5.5 V for the M95640-W, over an ambient range of -40 °C to +85 °C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | SO-8 |
| Category | Memory |
| Pins | 8 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | TLEAD Lead temperature during soldering See note (1) 1. Compliant with JEDEC standard J-STD-020D (for small-body, Sn-Pb or Pb free assembly), the ST | 32 |
CAD (KiCad official)
- Symbol:
M95640-WMN6P - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files:
m95640-wmn6p-etched.step/m95640-wmn6p-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);m95640-wmn6p.step/m95640-wmn6p.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (53 pp, sha256
6b136d5d2ea5ba78, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# M95640-WMN6P
**STMicroelectronics** · EEPROM · SO-8
M95640-WMN6P from STMicroelectronics, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S | input | Chip Select: the device is selected when S is driven low, and it must see a falling edge after power-up before any instruction starts. |
| 2 | Q | output | Serial Data Output, with DC output current limited to 5 mA (IOL for Q = 0 and IOH for Q = 1). |
| 3 | W | input | Write Protect input used together with the status register bits to protect the memory array. |
| 4 | VSS | power_in | Ground reference for the device. |
| 5 | D | input | Serial Data Input, sampled on the serial clock C. |
| 6 | C | input | Serial Clock input supporting SPI clock rates up to 20 MHz. |
| 7 | HOLD | input | Hold input: communications with the device are interrupted while HOLD is driven low. |
| 8 | VCC | power_in | Supply voltage, 2.5 V to 5.5 V for the M95640-W, over an ambient range of -40 °C to +85 °C. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | SO-8 |
| Category | Memory |
| Pins | 8 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | TLEAD Lead temperature during soldering See note (1) 1. Compliant with JEDEC standard J-STD-020D (for small-body, Sn-Pb or Pb free assembly), the ST | 32 |
## CAD (KiCad official)
- Symbol: `M95640-WMN6P`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files: `m95640-wmn6p-etched.step` / `m95640-wmn6p-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `m95640-wmn6p.step` / `m95640-wmn6p.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [STMicroelectronics datasheet](https://www.st.com/resource/en/datasheet/m95640-wmn6p.pdf) (53 pp, sha256 `6b136d5d2ea5ba78`, retrieved 2026-11-05, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/m95640-wmn6p-datasheet.pdf)