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Contents

README

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M93C86-WMN6TP

STMicroelectronics · EEPROM · SOIC-8

M93C86-WMN6TP from STMicroelectronics, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S input Chip Select input; a rising edge on S (with C low) initiates an instruction; S must be driven, not left floating (pull-down resistor recommended) especially during power-up; also used to read READY/BUSY status after a write/erase cycle.
2 C input Serial Clock input; instruction bits, address and data are read on Serial Data Input on the rising edge of C; clock rate is DC to 2 MHz (M93Cx6-W / M93Cx6-R with process letter K) or DC to 1 MHz (other M93Cx6-R devices).
3 D input Serial Data Input; carries the start bit, op-code, address and write data of each instruction, sampled on the rising edge of Serial Clock (C).
4 Q tri_state Serial Data Output; outputs read data and the READY/BUSY status; high impedance when the device is not selected, driven only when S is high and the device is selected.
5 VSS power_in Ground reference pin for the device.
6 ORG input Organization Select input; unconnected or tied to VCC selects x16 (word) organization, tied to VSS (ground) selects x8 (byte) organization; in Standby mode ORG should be tied to VSS or VCC to minimize standby current.
7 DU unconnected Don't Use pin, reserved by STMicroelectronics for test sequences; does not affect normal device operation and may be left unconnected or tied to VCC or VSS (referenced as pin7 in the standby-current test conditions).
8 VCC power_in Supply voltage input, 2.5 V to 5.5 V for M93Cx6-W or 1.8 V to 5.5 V for M93Cx6-R; must remain stable and valid until completion of any write cycle; decoupling capacitor of 10 nF to 100 nF recommended close to VCC/VSS pins.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SOIC-8
Category Memory
Pins 8

CAD (KiCad official)

  • Symbol: M93C86-WMN6TP
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: m93c86-wmn6tp-etched.step / m93c86-wmn6tp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); m93c86-wmn6tp.step / m93c86-wmn6tp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (35 pp, sha256 7b1f76e6c602697a, retrieved 2026-09-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF