component
M93C56-RDW6TP
Public Made by Adomby adom
STMicroelectronics EEPROM, TSSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownM93C56-RDW6TP
STMicroelectronics · EEPROM · TSSOP-8
M93C56-RDW6TP from STMicroelectronics, in a TSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S | input | Chip Select input; must be driven to VSS during power-up (pull-down recommended) and must be brought low for at least tSLSH between consecutive instruction cycles. |
| 2 | C | input | Serial Clock input; operates from DC up to 2 MHz and must be held low when Chip Select rises, with an external pull-down recommended if the bus master can go high impedance. |
| 3 | D | input | Serial Data input, sampled on the rising edge of the Serial Clock for the start bit, op-code, address and data bits. |
| 4 | Q | output | Serial Data output that shifts out read data on rising clock edges, shows READY/BUSY status (Q=0 busy, Q=1 ready) during write or erase cycles, and is high impedance when the device is deselected. |
| 5 | VSS | power_in | Ground reference for the device. |
| 6 | ORG | input | Organization Select: x16 when left unconnected or tied to VCC, x8 when tied to VSS, and should be tied to VSS or VCC in standby for minimum power. |
| 7 | DU | passive | Don't Use pin reserved for ST test sequences, which may be left unconnected or connected to VCC or VSS. |
| 8 | VCC | power_in | Supply voltage of 1.8 V to 5.5 V for the M93Cx6-R, with a 10 nF to 100 nF decoupling capacitor recommended close to the VCC and VSS pins. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | TSSOP-8 |
| Category | Memory |
| Pins | 8 |
CAD (KiCad official)
- Symbol:
M93C56-RDW6TP - Footprint:
Package_SO:TSSOP-8_3x3mm_P0.65mm - 3D model: TSSOP-8 (KiCad packages3D, STEP)
- 3D model files:
m93c56-rdw6tp-etched.step/m93c56-rdw6tp-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);m93c56-rdw6tp.step/m93c56-rdw6tp.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (35 pp, sha256
7b1f76e6c602697a, retrieved 2026-10-03, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).