component

LWT1H7AM

Public Made by Adom

by adom

Lewa Micro MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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LWT1H7AM

Lewa Micro · MOSFETs · SOT-23

LWT1H7AM from Lewa Micro, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-to-source voltage is limited to ±20 V, with a threshold VGS(TH) of 1.8 V typ.
2 S passive Source of the N-channel MOSFET; continuous drain current is 4.5 A at TA=25 °C.
3 D passive Drain; drain-to-source voltage is rated to 100 V and pulsed drain current to 18 A.

Key specifications

Parameter Value
Manufacturer Lewa Micro
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-Source Voltage (absolute maximum) VDSS 100 V 1
Gate-to-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID 4.5 A TA=25 °C 1
Continuous Drain Current ID 2.8 A TA=100 °C 1
Pulsed Drain Current IDM 18 A Repetitive rating; pulse width limited by maximum junction temperature 1
Power Dissipation PD 1.8 W 1
Operating Junction and Storage Temperature Range TJ, TSTG -55 150 ℃ 1
Maximum Temperature for Soldering TL 260 ℃ 1
Thermal Resistance, Junction-to-Ambient RθJA 69.4 ℃/W Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 μm thick) copper area for drain connection 1
Drain to Source Breakdown Voltage VDSS 100 V VGS=0V, ID=250µA 2
Drain to Source Leakage Current IDSS 1 μA VDS=100V, VGS=0V 2
Gate to Source Forward Leakage IGSS(F) 100 nA VGS=+20V, VDS=0V 2
Gate to Source Reverse Leakage IGSS(R) -100 nA VGS=-20V, VDS=0V 2
Diode Forward Voltage VSD 1.2 V IS=4.0A, VGS=0V 2

CAD (KiCad official)

  • Symbol: LWT1H7AM
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: lwt1h7am-etched.step / lwt1h7am-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lwt1h7am.step / lwt1h7am.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Lewa Micro datasheet (10 pp, sha256 e34b6e5cd12e8a5e, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF