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LWS6080A4

Lewa Micro · MOSFETs · TO-252

LWS6080A4 from Lewa Micro, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal of the P-channel MOSFET, with a gate-to-source voltage rating of ±20 V and a typical threshold of -1.65 V.
2 D passive Drain terminal of the P-channel MOSFET, rated for -60 V drain-to-source and -16 A continuous drain current at TC=25℃.
3 S passive Source terminal of the P-channel MOSFET, with a body diode rated for -16 A continuous forward current.

Key specifications

Parameter Value
Manufacturer Lewa Micro
Package TO-252
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-Source Voltage VDSS -60 V 1
Gate-to-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID -16 A TC=25℃ 1
Continuous Drain Current ID -10 A TC=100℃ 1
Pulsed Drain Current IDM -64 A Repetitive rating; pulse width limited by maximum junction temperature 2
Operating Junction and Storage Temperature Range TJ, TSTG -55 150 ℃ 1
Maximum Temperature for Soldering TL 260 ℃ 1
Drain to Source Breakdown Voltage VDSS -60 V VGS=0V, ID=-250µA 2
Gate Threshold Voltage VGS(TH) -1 -1.65 -2.1 V VDS=VGS, ID=-250µA 2
Drain to Source Leakage Current IDSS -1 µA VDS=-60V, VGS=0V 2
Gate to Source Forward Leakage IGSS(F) -100 nA VGS=+20V, VDS=0V 2
Gate to Source Reverse Leakage IGSS(R) 100 nA VGS=-20V, VDS=0V 2
Gate resistance RG 3 Ω VGS=0V, VDS=0V, f=1MHz 2
Thermal Resistance, Junction-to-Case RθJC 3.9 ℃/W 1
Thermal Resistance, Junction-to-Ambient RθJA 60 ℃/W Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 μm thick) copper area for drain connection 1

CAD (KiCad official)

  • Symbol: LWS6080A4
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: lws6080a4-etched.step / lws6080a4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lws6080a4.step / lws6080a4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Lewa Micro datasheet (10 pp, sha256 a7880e21da823138, retrieved 2026-11-04, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF