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LWS6028A8

Lewa Micro · MOSFETs · TO-220AB

LWS6028A8 from Lewa Micro, in a TO-220AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-to-source voltage limit is ±20 V, with threshold VGS(TH) of -1.3 V typ. (-1.0 V to -2.3 V range printed) at ID=-250µA.
2 D passive Drain (also connected to the tab); drain-to-source voltage -60 V, continuous drain current -45 A at TC=25°C, pulsed -180 A.
3 S passive Source; diode forward current IS of -45 A and pulsed -180 A through the body diode to drain.

Key specifications

Parameter Value
Manufacturer Lewa Micro
Package TO-220AB
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-Source Breakdown Voltage VDSS -60 V VGS=0V, ID=-250µA 2
Drain to Source Leakage Current IDSS -1 μA VDS=-60V, VGS=0V 2
Gate to Source Forward Leakage IGSS(F) 100 nA VGS=+20V, VDS=0V 2
Gate to Source Reverse Leakage IGSS(R) -100 nA VGS=-20V, VDS=0V 2
Gate Threshold Voltage VGS(TH) -1 -1.8 -2.3 V VDS=VGS, ID=-250µA 2
Drain-to-Source On-Resistance RDS(ON)1 18 25 mΩ VGS=-10V, ID=-10A 2
Drain-to-Source On-Resistance RDS(ON)2 24 32 mΩ VGS=-4.5V, ID=-8.0A 2
Diode Forward Voltage VSD -1.2 V IS=-10A, VGS=0V 2
Diode Forward Current IS -45 A TC=25 °C 2
Diode Pulse Current ISM -180 A VGS=0V 2
Drain-to-Source Voltage VDSS -60 V 1
Gate-to-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID -45 A TC=25℃ 1
Continuous Drain Current ID -29 A TC=100℃ 1
Pulsed Drain Current IDM -180 A Repetitive rating; pulse width limited by maximum junction temperature 1
Power Dissipation PD 100 W TC=25℃ 1
Operating Junction and Storage Temperature Range TJ, TSTG -55 150 ℃ 1
Maximum Temperature for Soldering TL 260 ℃ 1
Thermal Resistance, Junction-to-Case RθJC 1.25 ℃/W 1
Thermal Resistance, Junction-to-Ambient RθJA 60 ℃/W Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm² (one layer, 70 μm thick) copper area for drain connection 1

CAD (KiCad official)

  • Symbol: LWS6028A8
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220AB (KiCad packages3D, STEP)
  • 3D model files: lws6028a8-etched.step / lws6028a8-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lws6028a8.step / lws6028a8.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Lewa Micro datasheet (10 pp, sha256 29c5281ebe699f3f, retrieved 2026-10-28, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF